JPS59114849A - 混成集積回路の製造方法 - Google Patents

混成集積回路の製造方法

Info

Publication number
JPS59114849A
JPS59114849A JP57223966A JP22396682A JPS59114849A JP S59114849 A JPS59114849 A JP S59114849A JP 57223966 A JP57223966 A JP 57223966A JP 22396682 A JP22396682 A JP 22396682A JP S59114849 A JPS59114849 A JP S59114849A
Authority
JP
Japan
Prior art keywords
circuit
lead wire
connection part
conductor
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57223966A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0550141B2 (enExample
Inventor
Toshio Yamamoto
俊夫 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57223966A priority Critical patent/JPS59114849A/ja
Publication of JPS59114849A publication Critical patent/JPS59114849A/ja
Publication of JPH0550141B2 publication Critical patent/JPH0550141B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP57223966A 1982-12-22 1982-12-22 混成集積回路の製造方法 Granted JPS59114849A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57223966A JPS59114849A (ja) 1982-12-22 1982-12-22 混成集積回路の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57223966A JPS59114849A (ja) 1982-12-22 1982-12-22 混成集積回路の製造方法

Publications (2)

Publication Number Publication Date
JPS59114849A true JPS59114849A (ja) 1984-07-03
JPH0550141B2 JPH0550141B2 (enExample) 1993-07-28

Family

ID=16806472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57223966A Granted JPS59114849A (ja) 1982-12-22 1982-12-22 混成集積回路の製造方法

Country Status (1)

Country Link
JP (1) JPS59114849A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194654A (ja) * 1986-02-20 1987-08-27 Nec Corp リ−ドフレ−ム
WO2008031366A1 (de) * 2006-09-13 2008-03-20 Siemens Aktiengesellschaft Leiterplatte, insbesondere keramikleiterplatte
CN101618481B (zh) 2008-06-30 2012-06-13 日本优尼可思股份有限公司 激光焊接方法和装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5585000B2 (ja) * 2009-05-22 2014-09-10 富士通セミコンダクター株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114340A (en) * 1980-02-13 1981-09-08 Mitsubishi Electric Corp Bonding method
JPS57121266A (en) * 1981-01-20 1982-07-28 Toshiba Corp Manufacture of hybrid integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56114340A (en) * 1980-02-13 1981-09-08 Mitsubishi Electric Corp Bonding method
JPS57121266A (en) * 1981-01-20 1982-07-28 Toshiba Corp Manufacture of hybrid integrated circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62194654A (ja) * 1986-02-20 1987-08-27 Nec Corp リ−ドフレ−ム
WO2008031366A1 (de) * 2006-09-13 2008-03-20 Siemens Aktiengesellschaft Leiterplatte, insbesondere keramikleiterplatte
CN101618481B (zh) 2008-06-30 2012-06-13 日本优尼可思股份有限公司 激光焊接方法和装置

Also Published As

Publication number Publication date
JPH0550141B2 (enExample) 1993-07-28

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