JPS5911449U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5911449U
JPS5911449U JP10571482U JP10571482U JPS5911449U JP S5911449 U JPS5911449 U JP S5911449U JP 10571482 U JP10571482 U JP 10571482U JP 10571482 U JP10571482 U JP 10571482U JP S5911449 U JPS5911449 U JP S5911449U
Authority
JP
Japan
Prior art keywords
terminal pads
external lead
lead terminal
semiconductor equipment
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10571482U
Other languages
Japanese (ja)
Other versions
JPS635235Y2 (en
Inventor
柳沢　守
赤崎　英彦
辻村　剛久
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP10571482U priority Critical patent/JPS5911449U/en
Publication of JPS5911449U publication Critical patent/JPS5911449U/en
Application granted granted Critical
Publication of JPS635235Y2 publication Critical patent/JPS635235Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の半導体装置の肩親図、断面図及
び裏面平面図で坐る。 ４・・・・・・検査用パッド、６，７・・・・・・外部
リード端子パッド、８・・・・・・半導体チップ。FIG. 1 shows a shoulder diagram, a sectional view, and a back plan view of a semiconductor device according to an embodiment of the present invention. 4... Inspection pad, 6, 7... External lead terminal pad, 8... Semiconductor chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップを収容する容器裏面の外周に外部リード端
子パッドを配列し且つ該外周列の外部リード端子パッド
列に囲まれる内周にも外部リード端子パッドを配列して
なる装置において、前記容器の表面に前記内周列の外部
リード端子パッドに夫々導通された端子パッドを設けた
ことを特徴とする半導体装置。In a device in which external lead terminal pads are arranged on the outer periphery of the back surface of a container housing a semiconductor chip, and external lead terminal pads are also arranged on the inner periphery surrounded by the rows of external lead terminal pads on the outer periphery, the surface of the container 2. A semiconductor device, wherein terminal pads are provided which are electrically connected to the external lead terminal pads of the inner circumferential row.
JP10571482U 1982-07-13 1982-07-13 semiconductor equipment Granted JPS5911449U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10571482U JPS5911449U (en) 1982-07-13 1982-07-13 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10571482U JPS5911449U (en) 1982-07-13 1982-07-13 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5911449U true JPS5911449U (en) 1984-01-24
JPS635235Y2 JPS635235Y2 (en) 1988-02-12

Family

ID=30247672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10571482U Granted JPS5911449U (en) 1982-07-13 1982-07-13 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5911449U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021044816A1 (en) * 2019-09-04 2021-03-11 ソニーセミコンダクタソリューションズ株式会社 Semiconductor laser driving device, electronic equipment, and method of manufacturing semiconductor laser driving device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636153U (en) * 1979-08-30 1981-04-07

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636153B2 (en) * 1972-11-16 1981-08-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636153U (en) * 1979-08-30 1981-04-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021044816A1 (en) * 2019-09-04 2021-03-11 ソニーセミコンダクタソリューションズ株式会社 Semiconductor laser driving device, electronic equipment, and method of manufacturing semiconductor laser driving device

Also Published As

Publication number Publication date
JPS635235Y2 (en) 1988-02-12

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