JPS5887360U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5887360U JPS5887360U JP1981183042U JP18304281U JPS5887360U JP S5887360 U JPS5887360 U JP S5887360U JP 1981183042 U JP1981183042 U JP 1981183042U JP 18304281 U JP18304281 U JP 18304281U JP S5887360 U JPS5887360 U JP S5887360U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- electrode row
- semiconductor
- semiconductor device
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のフィルム状印刷リードに接続した半導体
装置の平面図であり、第２図および第３図は本考案の一
実施例による半導体装置の横断面図および平面図であり
、第４図は各種ボンディング法によるパッド数とペレッ
ト面積との関係を示したグラフである。
１．１１・・・半導体ペレ少ト、２，１２．１３・・・
ポンディングパッド、１５・・・フィル状リード、１６
・・・絶縁フィルム、１７．１８・・・リード。
哀５１．−
一一
５θ
ポン
チ１ングン得ド１ｋｋ−ＰFIG. 1 is a plan view of a semiconductor device connected to a conventional film-like printed lead, FIGS. 2 and 3 are a cross-sectional view and a plan view of a semiconductor device according to an embodiment of the present invention, and FIG. The figure is a graph showing the relationship between the number of pads and pellet area according to various bonding methods. 1.11... Few semiconductor pellets, 2,12.13...
Ponding pad, 15... fill-like lead, 16
...Insulating film, 17.18...Lead. Sorrow 51. - 115θ Punch 1ngundo 1kk-P
Claims (1)
は段差があり、各電極列が絶縁層によって絶縁された複
数層のリードと接続されていることを特徴とする半導体
装置。1. A semiconductor device comprising a plurality of electrodes on a semiconductor pellet, a step between each electrode row, and each electrode row connected to a plurality of layers of leads insulated by an insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981183042U JPS5887360U (en) | 1981-12-09 | 1981-12-09 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981183042U JPS5887360U (en) | 1981-12-09 | 1981-12-09 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5887360U true JPS5887360U (en) | 1983-06-14 |
Family
ID=29981950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981183042U Pending JPS5887360U (en) | 1981-12-09 | 1981-12-09 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5887360U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039973A (en) * | 1989-06-07 | 1991-01-17 | Shinko Electric Ind Co Ltd | Tape for tab and semiconductor device using it |
| WO1996012296A1 (en) * | 1994-10-18 | 1996-04-25 | Hitachi, Ltd. | Semiconductor device and its manufacture |
-
1981
- 1981-12-09 JP JP1981183042U patent/JPS5887360U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039973A (en) * | 1989-06-07 | 1991-01-17 | Shinko Electric Ind Co Ltd | Tape for tab and semiconductor device using it |
| WO1996012296A1 (en) * | 1994-10-18 | 1996-04-25 | Hitachi, Ltd. | Semiconductor device and its manufacture |
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