JPS6025160U - Layered IC chip - Google Patents

Layered IC chip

Info

Publication number
JPS6025160U
JPS6025160U JP11642683U JP11642683U JPS6025160U JP S6025160 U JPS6025160 U JP S6025160U JP 11642683 U JP11642683 U JP 11642683U JP 11642683 U JP11642683 U JP 11642683U JP S6025160 U JPS6025160 U JP S6025160U
Authority
JP
Japan
Prior art keywords
chip
layered
stacked
peripheral terminals
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11642683U
Other languages
Japanese (ja)
Inventor
兼子　隆
Original Assignee
住友電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電気工業株式会社 filed Critical 住友電気工業株式会社
Priority to JP11642683U priority Critical patent/JPS6025160U/en
Publication of JPS6025160U publication Critical patent/JPS6025160U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案による重ね合せチップの平面図、第２区
は第１図に示すものの断面図である。 図面中、１は下段ＩＣチップ、２は上段ＩＣチップ、３
はパッケージ受台、４１は白金、４゜は絶縁体層、５１
，５゜・・・は下段ＩＣチップの周辺端子、６１，６゜
・・・は上段ＩＣチップの周辺端子、７１．７□・・・
はパッケージのリード端子、８１，８□・・・はリード
線である。FIG. 1 is a plan view of a stacked chip according to the present invention, and the second section is a cross-sectional view of the chip shown in FIG. In the drawing, 1 is the lower IC chip, 2 is the upper IC chip, and 3 is the lower IC chip.
is a package pedestal, 41 is platinum, 4° is an insulator layer, 51
, 5°... are peripheral terminals of the lower IC chip, 61,6°... are peripheral terminals of the upper IC chip, 71.7□...
are lead terminals of the package, and 81, 8□, . . . are lead wires.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下段のＩＣチップと、該ＩＣチップの上面の周辺端子部
え避けて絶縁体層を介在して重ね合せて載置した上段の
ＩＣチップからなることを特徴とする重ね合せＩＣチッ
プ。A stacked IC chip comprising a lower IC chip and an upper IC chip stacked on top of each other with an insulating layer interposed therebetween, avoiding the peripheral terminals on the upper surface of the IC chip.
JP11642683U 1983-07-28 1983-07-28 Layered IC chip Pending JPS6025160U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11642683U JPS6025160U (en) 1983-07-28 1983-07-28 Layered IC chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11642683U JPS6025160U (en) 1983-07-28 1983-07-28 Layered IC chip

Publications (1)

Publication Number Publication Date
JPS6025160U true JPS6025160U (en) 1985-02-20

Family

ID=30268390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11642683U Pending JPS6025160U (en) 1983-07-28 1983-07-28 Layered IC chip

Country Status (1)

Country Link
JP (1) JPS6025160U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211281A (en) * 1991-09-13 1993-08-20 Internatl Business Mach Corp <Ibm> Stepped package for electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05211281A (en) * 1991-09-13 1993-08-20 Internatl Business Mach Corp <Ibm> Stepped package for electronic device

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