JPS5984835U - semiconductor pellets - Google Patents

semiconductor pellets

Info

Publication number
JPS5984835U
JPS5984835U JP1982181629U JP18162982U JPS5984835U JP S5984835 U JPS5984835 U JP S5984835U JP 1982181629 U JP1982181629 U JP 1982181629U JP 18162982 U JP18162982 U JP 18162982U JP S5984835 U JPS5984835 U JP S5984835U
Authority
JP
Japan
Prior art keywords
semiconductor pellets
semiconductor
pellet
insulating film
electrode film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982181629U
Other languages
Japanese (ja)
Inventor
洋 高山
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982181629U priority Critical patent/JPS5984835U/en
Publication of JPS5984835U publication Critical patent/JPS5984835U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図及び第２図は本考案の第１実施例を示す平面図及
び表面拡大断面図、第３図乃至第６図は第１図の半導体
ペレットの粗面加工方法を説明するための各工程でのペ
レット表面断面図、第７図及び第８図は本考案の第２実
施例を示す平面図及び表面拡大断面図、第゛９図は本考
案の第３実施例を示す表面断面図である。 ？・・・・・・絶縁膜、３・・・・・・電極膜ミ７・・
・・・・電極膜、８・・・・・・絶縁膜、ａ、　ｂ、　
　ｃ・・・・・・粗面。1 and 2 are a plan view and an enlarged surface sectional view showing a first embodiment of the present invention, and FIGS. 3 to 6 are each a plan view and an enlarged surface sectional view showing the method of roughening the semiconductor pellet shown in FIG. 7 and 8 are plan views and enlarged surface sectional views showing the second embodiment of the present invention, and Fig. 9 is a surface sectional view showing the third embodiment of the present invention. It is. ? ...Insulating film, 3...Electrode film Mi7...
...Electrode film, 8...Insulating film, a, b,
c...Rough surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ペレット表面に所望のパターンで形成された電極膜と絶
縁膜のいずれか一方の表面を鏡面に、他方の表面を粗面
に形成したことを特徴とする半導体ペレット。A semiconductor pellet characterized in that one of an electrode film and an insulating film formed in a desired pattern on the pellet surface has a mirror surface and the other surface has a rough surface.
JP1982181629U 1982-11-29 1982-11-29 semiconductor pellets Pending JPS5984835U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982181629U JPS5984835U (en) 1982-11-29 1982-11-29 semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982181629U JPS5984835U (en) 1982-11-29 1982-11-29 semiconductor pellets

Publications (1)

Publication Number Publication Date
JPS5984835U true JPS5984835U (en) 1984-06-08

Family

ID=30393537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982181629U Pending JPS5984835U (en) 1982-11-29 1982-11-29 semiconductor pellets

Country Status (1)

Country Link
JP (1) JPS5984835U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310162A (en) * 1986-06-30 1988-01-16 Hoya Corp Photomask

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649537A (en) * 1979-09-28 1981-05-06 Nec Corp Semiconductor wafer
JPS5674936A (en) * 1979-11-22 1981-06-20 Sharp Corp Position detection method of semiconductor chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649537A (en) * 1979-09-28 1981-05-06 Nec Corp Semiconductor wafer
JPS5674936A (en) * 1979-11-22 1981-06-20 Sharp Corp Position detection method of semiconductor chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6310162A (en) * 1986-06-30 1988-01-16 Hoya Corp Photomask

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