JPS585357U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS585357U
JPS585357U JP9809481U JP9809481U JPS585357U JP S585357 U JPS585357 U JP S585357U JP 9809481 U JP9809481 U JP 9809481U JP 9809481 U JP9809481 U JP 9809481U JP S585357 U JPS585357 U JP S585357U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
annular region
semiconductor
abstract
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9809481U
Other languages
Japanese (ja)
Inventor
「あま」田　秀雄
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9809481U priority Critical patent/JPS585357U/en
Publication of JPS585357U publication Critical patent/JPS585357U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Bipolar Transistors (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は半導体装置の一例を示す平面図、第２図は第１
図Ａ−Ａ断面図、第３図は本考案の一例を示す平面図、
第４図は本考案による半導体素子の拡大平面図、第５図
は第４図Ｂ−Ｂ断面図である。 ６・・・・・・半導体素子、７・・・・・・半導体基板
、７ａ・・・　□・・・主面、１３・・・・・・環状領
域、１４・・・・・・電極。 第３図 第４図　　゛Fig. 1 is a plan view showing an example of a semiconductor device, and Fig. 2 is a plan view showing an example of a semiconductor device.
Figure AA sectional view, Figure 3 is a plan view showing an example of the present invention,
FIG. 4 is an enlarged plan view of a semiconductor device according to the present invention, and FIG. 5 is a sectional view taken along line BB in FIG. 6... Semiconductor element, 7... Semiconductor substrate, 7a... □... Main surface, 13... Annular region, 14... Electrode. Figure 3 Figure 4 ゛

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板の主面外周面に沿って基板と逆導電型の環状
領域を形成すると共に上記環状領域に電極を形成した半
導体素子を具備したことを特徴とする半導体装置。1. A semiconductor device comprising: a semiconductor element having an annular region having a conductivity type opposite to that of the substrate formed along the outer peripheral surface of a main surface of a semiconductor substrate, and an electrode formed in the annular region.
JP9809481U 1981-06-30 1981-06-30 semiconductor equipment Pending JPS585357U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9809481U JPS585357U (en) 1981-06-30 1981-06-30 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9809481U JPS585357U (en) 1981-06-30 1981-06-30 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS585357U true JPS585357U (en) 1983-01-13

Family

ID=29892863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9809481U Pending JPS585357U (en) 1981-06-30 1981-06-30 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS585357U (en)

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