JPS5956758U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5956758U JPS5956758U JP15285382U JP15285382U JPS5956758U JP S5956758 U JPS5956758 U JP S5956758U JP 15285382 U JP15285382 U JP 15285382U JP 15285382 U JP15285382 U JP 15285382U JP S5956758 U JPS5956758 U JP S5956758U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- case
- pellet
- electrode part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来型半導体素子の斜視図、第２図は゛その上
面図である。第３図は従来型半導体素子の横断面図、第
４図は本考案による一実施例の斜視図、第５図はその上
面図、第６図は本考案によや半導体装置の他の実施例の
斜視図である。
１：低抵抗半導体基板（サブストレート層）、２：釡属
電極部、３：ケースめ絶縁体部、４：ケースの金属部、
５：金属線あるいは金属テープ、６：動作層、７：金属
板。FIG. 1 is a perspective view of a conventional semiconductor device, and FIG. 2 is a top view thereof. 3 is a cross-sectional view of a conventional semiconductor device, FIG. 4 is a perspective view of an embodiment of the present invention, FIG. 5 is a top view thereof, and FIG. 6 is another embodiment of a semiconductor device according to the present invention. FIG. 2 is a perspective view of an example. 1: Low resistance semiconductor substrate (substrate layer), 2: Metal electrode part, 3: Case insulator part, 4: Metal part of the case,
5: Metal wire or metal tape, 6: Operating layer, 7: Metal plate.
Claims (1)
ットと、ペレットが実装されるケースからなる半導体装
置において、前記金属電極部近傍においては幅が狭く、
それ以外の部分では、広くなるように加工された１枚の
金属板を用いて前記電極部とケースとが接続されている
ことを特徴とする半導体装置。In a semiconductor device comprising a pellet having a plurality of active layers and electrode parts on a semiconductor substrate, and a case in which the pellet is mounted, the width is narrow near the metal electrode part;
A semiconductor device characterized in that, in other parts, the electrode part and the case are connected using a single metal plate processed to be wider.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15285382U JPS5956758U (en) | 1982-10-08 | 1982-10-08 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15285382U JPS5956758U (en) | 1982-10-08 | 1982-10-08 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5956758U true JPS5956758U (en) | 1984-04-13 |
Family
ID=30338339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15285382U Pending JPS5956758U (en) | 1982-10-08 | 1982-10-08 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956758U (en) |
-
1982
- 1982-10-08 JP JP15285382U patent/JPS5956758U/en active Pending
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