JPS59111987A - 複合焼結体の製造方法 - Google Patents
複合焼結体の製造方法Info
- Publication number
- JPS59111987A JPS59111987A JP58216184A JP21618483A JPS59111987A JP S59111987 A JPS59111987 A JP S59111987A JP 58216184 A JP58216184 A JP 58216184A JP 21618483 A JP21618483 A JP 21618483A JP S59111987 A JPS59111987 A JP S59111987A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- sintered body
- composite sintered
- mixture
- boiling point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58216184A JPS59111987A (ja) | 1983-11-18 | 1983-11-18 | 複合焼結体の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58216184A JPS59111987A (ja) | 1983-11-18 | 1983-11-18 | 複合焼結体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59111987A true JPS59111987A (ja) | 1984-06-28 |
JPS6117656B2 JPS6117656B2 (ko) | 1986-05-08 |
Family
ID=16684602
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58216184A Granted JPS59111987A (ja) | 1983-11-18 | 1983-11-18 | 複合焼結体の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59111987A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354055U (ko) * | 1986-09-25 | 1988-04-11 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3549784A (en) * | 1968-02-01 | 1970-12-22 | American Lava Corp | Ceramic-metallic composite substrate |
JPS5727060A (en) * | 1980-07-25 | 1982-02-13 | Toshiba Corp | Manufacture of semiconductor device |
-
1983
- 1983-11-18 JP JP58216184A patent/JPS59111987A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3549784A (en) * | 1968-02-01 | 1970-12-22 | American Lava Corp | Ceramic-metallic composite substrate |
GB1255253A (en) * | 1968-02-01 | 1971-12-01 | Minnesota Mining & Mfg | Ceramic-metallic composite substrate |
JPS5727060A (en) * | 1980-07-25 | 1982-02-13 | Toshiba Corp | Manufacture of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6117656B2 (ko) | 1986-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5661882A (en) | Method of integrating electronic components into electronic circuit structures made using LTCC tape | |
JPS6043890A (ja) | 集積回路装置を装着するための誘電体基板 | |
JPH11353939A (ja) | 導電性ペーストおよびセラミック多層基板 | |
US20060162844A1 (en) | Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof | |
WO2000060613A1 (en) | Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate | |
JPH11505368A (ja) | 支持基板上のセラミック多層回路基板用導電性バイア充填インク | |
US20060163768A1 (en) | Multi-component LTCC substrate with a core of high dielectric constant ceramic material and processes for the development thereof | |
JPH0811696B2 (ja) | 多層ガラスセラミック基板とその製造方法 | |
JPS59111987A (ja) | 複合焼結体の製造方法 | |
JP2004319706A (ja) | 導体ペースト並びに多層基板及びその製造方法 | |
US5932326A (en) | Ceramic wiring boards and method for their manufacture | |
JPS6010696A (ja) | 薄膜用セラミツク回路基板の製造法 | |
JPS6323394A (ja) | 複合焼結体の製造法 | |
JP2676221B2 (ja) | グレーズ処理セラミック基板およびその製造方法 | |
JPH0249265B2 (ko) | ||
JP2504350B2 (ja) | 多層ガラスセラミック基板とその製造方法 | |
JPS62186593A (ja) | ガラスセラミツク多層回路基板 | |
JPH05315720A (ja) | ガラス又はガラス・セラミックス基板用導体材料 | |
JPS605597A (ja) | セラミツク複合焼成体の製造方法 | |
JPH02212141A (ja) | 複合セラミックス基板の製法 | |
JP2504351B2 (ja) | 多層ガラスセラミック基板とその製造方法 | |
JPS59101896A (ja) | セラミツク多層回路基板の製造法 | |
JPS63112473A (ja) | セラミツク基板の製造方法 | |
JP2608083B2 (ja) | 絶縁性セラミックペースト | |
JPH0793480B2 (ja) | 多層ガラスセラミック基板とその製造方法 |