JPS59111337A - ボンデイング方法 - Google Patents

ボンデイング方法

Info

Publication number
JPS59111337A
JPS59111337A JP57221406A JP22140682A JPS59111337A JP S59111337 A JPS59111337 A JP S59111337A JP 57221406 A JP57221406 A JP 57221406A JP 22140682 A JP22140682 A JP 22140682A JP S59111337 A JPS59111337 A JP S59111337A
Authority
JP
Japan
Prior art keywords
bonding
semiconductor element
ultrasonic
bonding tool
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57221406A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214780B2 (ko
Inventor
Minoru Hirai
平井　稔
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57221406A priority Critical patent/JPS59111337A/ja
Publication of JPS59111337A publication Critical patent/JPS59111337A/ja
Publication of JPH0214780B2 publication Critical patent/JPH0214780B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57221406A 1982-12-16 1982-12-16 ボンデイング方法 Granted JPS59111337A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57221406A JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57221406A JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS59111337A true JPS59111337A (ja) 1984-06-27
JPH0214780B2 JPH0214780B2 (ko) 1990-04-10

Family

ID=16766243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57221406A Granted JPS59111337A (ja) 1982-12-16 1982-12-16 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS59111337A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004062842A1 (en) * 2003-01-03 2004-07-29 Nanopierce Technologies, Inc. Ultrasonic bonding of electrical devices
CN113658875A (zh) * 2021-08-18 2021-11-16 深圳市振华微电子有限公司 一种中小功率混合集成电路的组装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004062842A1 (en) * 2003-01-03 2004-07-29 Nanopierce Technologies, Inc. Ultrasonic bonding of electrical devices
CN113658875A (zh) * 2021-08-18 2021-11-16 深圳市振华微电子有限公司 一种中小功率混合集成电路的组装方法

Also Published As

Publication number Publication date
JPH0214780B2 (ko) 1990-04-10

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