JPS59108072A - 常温粘着性を有する熱硬化性接着シ−ト - Google Patents

常温粘着性を有する熱硬化性接着シ−ト

Info

Publication number
JPS59108072A
JPS59108072A JP57217617A JP21761782A JPS59108072A JP S59108072 A JPS59108072 A JP S59108072A JP 57217617 A JP57217617 A JP 57217617A JP 21761782 A JP21761782 A JP 21761782A JP S59108072 A JPS59108072 A JP S59108072A
Authority
JP
Japan
Prior art keywords
parts
weight
room temperature
tackiness
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57217617A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0131796B2 (cg-RX-API-DMAC7.html
Inventor
Yukio Nishiyama
幸夫 西山
Kazuhiko Mogami
最上　和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP57217617A priority Critical patent/JPS59108072A/ja
Publication of JPS59108072A publication Critical patent/JPS59108072A/ja
Publication of JPH0131796B2 publication Critical patent/JPH0131796B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
JP57217617A 1982-12-11 1982-12-11 常温粘着性を有する熱硬化性接着シ−ト Granted JPS59108072A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57217617A JPS59108072A (ja) 1982-12-11 1982-12-11 常温粘着性を有する熱硬化性接着シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57217617A JPS59108072A (ja) 1982-12-11 1982-12-11 常温粘着性を有する熱硬化性接着シ−ト

Publications (2)

Publication Number Publication Date
JPS59108072A true JPS59108072A (ja) 1984-06-22
JPH0131796B2 JPH0131796B2 (cg-RX-API-DMAC7.html) 1989-06-28

Family

ID=16707095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57217617A Granted JPS59108072A (ja) 1982-12-11 1982-12-11 常温粘着性を有する熱硬化性接着シ−ト

Country Status (1)

Country Link
JP (1) JPS59108072A (cg-RX-API-DMAC7.html)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188478A (ja) * 1985-02-18 1986-08-22 Toagosei Chem Ind Co Ltd 接着剤組成物
JPS61236882A (ja) * 1985-04-15 1986-10-22 Shin Etsu Chem Co Ltd カバ−レイフイルム
JPH021789A (ja) * 1988-02-24 1990-01-08 Matsushita Electric Works Ltd 電気回路板
JPH02222478A (ja) * 1989-02-23 1990-09-05 Tomoegawa Paper Co Ltd 接着テープ
JPH04339852A (ja) * 1991-05-16 1992-11-26 Hitachi Chem Co Ltd エポキシ樹脂組成物
EP0604815A3 (en) * 1992-12-30 1994-08-17 Cerdec Ag Thermoplastic/thermoset coatings or inks for glass, ceramic and other hard surfaces.
US5824182A (en) * 1988-09-29 1998-10-20 Tomoegawa Paper Co., Ltd. Adhesive tapes
US6355131B1 (en) * 1996-10-09 2002-03-12 Matsushita Electric Industrial Co., Ltd. Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
JP2008518087A (ja) * 2004-10-27 2008-05-29 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 粘着性コーティング組成物
JP2008144140A (ja) * 2006-10-24 2008-06-26 Hitachi Chem Co Ltd 接着成形品、その製造方法及び半導体装置
WO2010016987A1 (en) * 2008-08-05 2010-02-11 Dow Global Technologies Inc. Production of solid epoxy resin
WO2010021167A1 (ja) * 2008-08-18 2010-02-25 積水化学工業株式会社 絶縁シート及び積層構造体
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
JP2010202695A (ja) * 2009-02-27 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2010205498A (ja) * 2009-03-02 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2015119563A (ja) * 2013-12-18 2015-06-25 矢崎総業株式会社 電線保護構造
JP2020055991A (ja) * 2018-09-28 2020-04-09 株式会社槌屋 繊維強化接着シート

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4686688B2 (ja) * 2000-12-01 2011-05-25 フジコピアン株式会社 手持ち型の転写式感圧接着テープ転写具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127937A (cg-RX-API-DMAC7.html) * 1974-03-18 1975-10-08
JPS57109875A (en) * 1980-12-26 1982-07-08 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127937A (cg-RX-API-DMAC7.html) * 1974-03-18 1975-10-08
JPS57109875A (en) * 1980-12-26 1982-07-08 Dainippon Printing Co Ltd Pressure-sensitive adhesive composition

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188478A (ja) * 1985-02-18 1986-08-22 Toagosei Chem Ind Co Ltd 接着剤組成物
JPS61236882A (ja) * 1985-04-15 1986-10-22 Shin Etsu Chem Co Ltd カバ−レイフイルム
JPH021789A (ja) * 1988-02-24 1990-01-08 Matsushita Electric Works Ltd 電気回路板
US5824182A (en) * 1988-09-29 1998-10-20 Tomoegawa Paper Co., Ltd. Adhesive tapes
US5891566A (en) * 1988-09-29 1999-04-06 Tomoegawa Paper Co., Ltd. Adhesive tapes
JPH02222478A (ja) * 1989-02-23 1990-09-05 Tomoegawa Paper Co Ltd 接着テープ
JPH04339852A (ja) * 1991-05-16 1992-11-26 Hitachi Chem Co Ltd エポキシ樹脂組成物
EP0604815A3 (en) * 1992-12-30 1994-08-17 Cerdec Ag Thermoplastic/thermoset coatings or inks for glass, ceramic and other hard surfaces.
US6355131B1 (en) * 1996-10-09 2002-03-12 Matsushita Electric Industrial Co., Ltd. Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
US6358351B1 (en) 1996-10-09 2002-03-19 Matsushita Electric Industrial Co., Ltd. Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
JP2008518087A (ja) * 2004-10-27 2008-05-29 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 粘着性コーティング組成物
JP2008144140A (ja) * 2006-10-24 2008-06-26 Hitachi Chem Co Ltd 接着成形品、その製造方法及び半導体装置
WO2010016987A1 (en) * 2008-08-05 2010-02-11 Dow Global Technologies Inc. Production of solid epoxy resin
WO2010021167A1 (ja) * 2008-08-18 2010-02-25 積水化学工業株式会社 絶縁シート及び積層構造体
JP2010044998A (ja) * 2008-08-18 2010-02-25 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
TWI415142B (zh) * 2008-08-18 2013-11-11 Sekisui Chemical Co Ltd Insulating sheet and laminated structure
JP2010116531A (ja) * 2008-10-15 2010-05-27 Hitachi Chem Co Ltd 接着剤組成物、接着剤層及び多段パッケージ
JP2010202695A (ja) * 2009-02-27 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2010205498A (ja) * 2009-03-02 2010-09-16 Sekisui Chem Co Ltd 絶縁シート及び積層構造体
JP2015119563A (ja) * 2013-12-18 2015-06-25 矢崎総業株式会社 電線保護構造
JP2020055991A (ja) * 2018-09-28 2020-04-09 株式会社槌屋 繊維強化接着シート

Also Published As

Publication number Publication date
JPH0131796B2 (cg-RX-API-DMAC7.html) 1989-06-28

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