JPS5910753Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5910753Y2
JPS5910753Y2 JP1977129093U JP12909377U JPS5910753Y2 JP S5910753 Y2 JPS5910753 Y2 JP S5910753Y2 JP 1977129093 U JP1977129093 U JP 1977129093U JP 12909377 U JP12909377 U JP 12909377U JP S5910753 Y2 JPS5910753 Y2 JP S5910753Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
resin
main surface
semiconductor
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977129093U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5455270U (enrdf_load_stackoverflow
Inventor
征男 早川
崇道 前田
政男 玖村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1977129093U priority Critical patent/JPS5910753Y2/ja
Publication of JPS5455270U publication Critical patent/JPS5455270U/ja
Priority to US06/190,744 priority patent/US4300153A/en
Application granted granted Critical
Publication of JPS5910753Y2 publication Critical patent/JPS5910753Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1977129093U 1977-09-22 1977-09-22 半導体装置 Expired JPS5910753Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1977129093U JPS5910753Y2 (ja) 1977-09-22 1977-09-22 半導体装置
US06/190,744 US4300153A (en) 1977-09-22 1980-09-25 Flat shaped semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977129093U JPS5910753Y2 (ja) 1977-09-22 1977-09-22 半導体装置

Publications (2)

Publication Number Publication Date
JPS5455270U JPS5455270U (enrdf_load_stackoverflow) 1979-04-17
JPS5910753Y2 true JPS5910753Y2 (ja) 1984-04-04

Family

ID=29093414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977129093U Expired JPS5910753Y2 (ja) 1977-09-22 1977-09-22 半導体装置

Country Status (1)

Country Link
JP (1) JPS5910753Y2 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5040165U (enrdf_load_stackoverflow) * 1973-08-10 1975-04-24
JPS5074279U (enrdf_load_stackoverflow) * 1973-11-08 1975-06-28
JPS523275B2 (enrdf_load_stackoverflow) * 1974-07-31 1977-01-27

Also Published As

Publication number Publication date
JPS5455270U (enrdf_load_stackoverflow) 1979-04-17

Similar Documents

Publication Publication Date Title
US4300153A (en) Flat shaped semiconductor encapsulation
US6818989B2 (en) BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
GB2026234A (en) Circuit element package having lead patterns
JPS5910753Y2 (ja) 半導体装置
JP3306981B2 (ja) 半導体装置用リードフレームへの接着剤塗布方法
JP2959874B2 (ja) リードフレームの製造方法
JPS55138241A (en) Sealing structure for semiconductor device
JPH07231060A (ja) 電子部品およびその製造方法
JPS61285730A (ja) 半導体装置の製造方法及びこれに用いる樹脂封止部材
JPS55138240A (en) Manufacture of semiconductor device
JPS59188947A (ja) 樹脂封止形半導体装置の製造方法
JPS6164132A (ja) 半導体装置
JPS6155247B2 (enrdf_load_stackoverflow)
JP3339808B2 (ja) 半導体装置の製造方法及び半導体装置製造用マスク
JPS6152977B2 (enrdf_load_stackoverflow)
US5237206A (en) Low-melting point glass sealed semiconductor device and method of manufacturing the same
JPS57148362A (en) Semiconductor device
JPS6220694B2 (enrdf_load_stackoverflow)
KR100257405B1 (ko) 마이크로 비지에이 패키지 제조방법
KR100234160B1 (ko) 반도체 리드 프레임의 제조 방법
JPS5814746B2 (ja) ハンドウタイソウチノセイゾウホウホウ
JPS60177656A (ja) 半導体装置
JPS63310147A (ja) 半導体装置の製造方法
JPS59130448A (ja) 回路素子密封装置
JPS62252155A (ja) 混成集積回路