JPS523275B2 - - Google Patents

Info

Publication number
JPS523275B2
JPS523275B2 JP49088355A JP8835574A JPS523275B2 JP S523275 B2 JPS523275 B2 JP S523275B2 JP 49088355 A JP49088355 A JP 49088355A JP 8835574 A JP8835574 A JP 8835574A JP S523275 B2 JPS523275 B2 JP S523275B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP49088355A
Other languages
Japanese (ja)
Other versions
JPS5116877A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP49088355A priority Critical patent/JPS523275B2/ja
Publication of JPS5116877A publication Critical patent/JPS5116877A/ja
Publication of JPS523275B2 publication Critical patent/JPS523275B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP49088355A 1974-07-31 1974-07-31 Expired JPS523275B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP49088355A JPS523275B2 (enrdf_load_stackoverflow) 1974-07-31 1974-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49088355A JPS523275B2 (enrdf_load_stackoverflow) 1974-07-31 1974-07-31

Publications (2)

Publication Number Publication Date
JPS5116877A JPS5116877A (enrdf_load_stackoverflow) 1976-02-10
JPS523275B2 true JPS523275B2 (enrdf_load_stackoverflow) 1977-01-27

Family

ID=13940496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49088355A Expired JPS523275B2 (enrdf_load_stackoverflow) 1974-07-31 1974-07-31

Country Status (1)

Country Link
JP (1) JPS523275B2 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5333892A (en) * 1976-09-03 1978-03-30 Mitsui Miike Machinery Co Ltd Bait supplier for fish culture
JPS5441671A (en) * 1977-09-08 1979-04-03 Sharp Corp Semiconductor device
JPS5910753Y2 (ja) * 1977-09-22 1984-04-04 シャープ株式会社 半導体装置
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
JPS629723Y2 (enrdf_load_stackoverflow) * 1981-02-20 1987-03-06
JPS63190363A (ja) * 1987-02-02 1988-08-05 Matsushita Electronics Corp パワ−パツケ−ジ
JPH01214032A (ja) * 1988-02-22 1989-08-28 Canon Inc 電気回路装置
JPS6442828A (en) * 1987-08-10 1989-02-15 Rohm Co Ltd Semiconductor device
JPH0624212B2 (ja) * 1989-10-09 1994-03-30 ローム株式会社 電子部品
JPH04307760A (ja) * 1991-04-04 1992-10-29 Mitsubishi Electric Corp 樹脂封止形半導体装置

Also Published As

Publication number Publication date
JPS5116877A (enrdf_load_stackoverflow) 1976-02-10

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