JPS5897859A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5897859A
JPS5897859A JP56197277A JP19727781A JPS5897859A JP S5897859 A JPS5897859 A JP S5897859A JP 56197277 A JP56197277 A JP 56197277A JP 19727781 A JP19727781 A JP 19727781A JP S5897859 A JPS5897859 A JP S5897859A
Authority
JP
Japan
Prior art keywords
oxide film
polysilicon
regions
transistor
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56197277A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6224951B2 (enrdf_load_stackoverflow
Inventor
Kimimaro Yoshikawa
公麿 吉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56197277A priority Critical patent/JPS5897859A/ja
Publication of JPS5897859A publication Critical patent/JPS5897859A/ja
Publication of JPS6224951B2 publication Critical patent/JPS6224951B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0112Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H10D84/0116Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including integrated injection logic [I2L]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Bipolar Integrated Circuits (AREA)
JP56197277A 1981-12-08 1981-12-08 半導体装置の製造方法 Granted JPS5897859A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56197277A JPS5897859A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56197277A JPS5897859A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5897859A true JPS5897859A (ja) 1983-06-10
JPS6224951B2 JPS6224951B2 (enrdf_load_stackoverflow) 1987-05-30

Family

ID=16371781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56197277A Granted JPS5897859A (ja) 1981-12-08 1981-12-08 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5897859A (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685852A (en) * 1979-12-17 1981-07-13 Toshiba Corp Manufacture of bipolar type integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685852A (en) * 1979-12-17 1981-07-13 Toshiba Corp Manufacture of bipolar type integrated circuit

Also Published As

Publication number Publication date
JPS6224951B2 (enrdf_load_stackoverflow) 1987-05-30

Similar Documents

Publication Publication Date Title
JPS6318673A (ja) 半導体装置の製法
JPS5974674A (ja) 絶縁ゲ−ト半導体装置とその製造法
JPS5897859A (ja) 半導体装置の製造方法
JPS6228587B2 (enrdf_load_stackoverflow)
JPH02226727A (ja) Ldd型mos半導体装置の製造方法
JPH056965A (ja) 半導体集積回路及びその製造方法
JPS63293858A (ja) 半導体装置の製造方法
JPS59134868A (ja) 半導体装置の製造方法
JPH01105578A (ja) 半導体装置の製造方法
JPH04133423A (ja) 半導体装置の製造方法
JPH0855999A (ja) 半導体装置
JPH02210867A (ja) 半導体装置の製造方法
JPS61184872A (ja) 半導体装置の製造方法
JPS6223474B2 (enrdf_load_stackoverflow)
JPH04146669A (ja) 半導体装置
JPS5817661A (ja) 半導体装置及びその製造方法
JPH0294636A (ja) 半導体装置の製造方法
JPS5927566A (ja) 半導体集積回路装置
JPS59107562A (ja) 半導体装置とその製造法
JPS6182446A (ja) 半導体装置の製造方法
JPS6358963A (ja) シヨツトキバリヤダイオ−ドの製造方法
JPH04137633A (ja) 半導体装置およびその製造方法
JPH05343422A (ja) 半導体装置および半導体装置の製造方法
JPS60109245A (ja) 半導体集積回路装置およびその製造方法
JPH0575067A (ja) 半導体装置の製造方法