JPS5894779A - Microconnector for mounting superconductive element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a microconnector for mounting superconducting elements.

The conventional kernel seed device, as shown in Figure 1,
A silicon board 1 formed by shape etching and provided with nine socket holes 11 and a mercury bulb 12 injected and held in each socket hole 11, and a silicon card substrate 3 on which a superconducting element 2 is mounted. and a silicon foot substrate 4 with platinum microbins 41 attached to the substrate 3 in an L-shape;
The silicon board 1 is composed of an element and a wiring module 5 that controls the operation between the elements.
From the front and back sides of the socket hole 11, insert the silicon foot board 2. Then, the platinum microbins 41 and 51 of the wiring module 5 are inserted, and electrical connections are made between them.

Here, the card board 3. As a result, the number of the 7 boards 40 and the micro pins 41 is, for example, 120, and since, for example, 16 to 32 sets of cards are mounted on the board 1, one excess is around 4,000. A socket hole 11 is provided, and its dimensions are 60μ in pin diameter.
The hole diameter is around 100 μm.

In such a conventional mounting, not only the elements but also the wiring material are made of a superconducting material.
, 51 is not a superconducting material, which has the essential drawback of reducing the device operating speed in the cryogenic region.In addition, the socket hole 11, which is the cavity for holding the mercury bulb 12, is not suitable for photoetching and selective etching. After passing through each process, a complicated manufacturing procedure is required in which two symmetrical substrates are pasted together, and the board 1 made by pasting two substrates together in this way is at least 0.
It has a thickness of around 5 to 0.6 mm, resulting in each microbin 41,! The gap between i and I becomes larger, increasing the impedance at the connector part, and since the socket hole 11 is formed by etching silicon, the hole diameter on the cavity side is about 100 μm compared to the large diameter on the entrance side. It has many drawbacks, such as the fact that it cannot expand to around 100 μm, which is disadvantageous for future high-density packaging.

In order to improve these drawbacks of the conventional art, this invention forms both the substance to be injected into the socket hole and the micro-bin made of superconducting material, and also places a wiring pattern on one surface of one board. The board and the wiring module are integrated, and a resin film is attached to both sides of the board substrate.1, one resin film serves as a protective film for the wiring pattern, and the other resin film has a bottle hole at a position corresponding to the socket hole. The elasticity of the hole is used to hold the low melting point superconducting alloy in the socket hole before inserting the bottle, and to hold the bottle after the bottle is inserted.

Hereinafter, one embodiment of the inventive device will be described in detail with reference to FIG.

In FIG. 2, reference numeral 1a denotes a board that also serves as a wiring module, on one side of which a predetermined wiring pattern 13 is formed and placed, and at a predetermined position a socket hole 14 passing through the other surface. It is formed. Then, resin 1[15, 1B is adhered and formed on both sides of this substrate 1a, and a dividing groove 15a* is formed to prevent breakage and deformation as appropriate.
16 m, and a small connection hole 17 is bored at a position corresponding to the socket hole 14 in the resin film 16 on the other side, and a connecting member 1 made of a low melting point superconducting alloy material is inserted into the socket hole 14.
It is filled with 8. Further, numerals 2, 3, and 4 are a superconducting element, a card board, and a seven-piece board as in the conventional example, and the foot board 4 is provided with a microbin 42 made of a superconducting alloy material.

However, the operation in this embodiment is performed under an environment where the connecting member 1S is melted at, for example, 40 to 50°C, and the superconducting element 2 is formed in the resin film 16 of the board substrate 1a and inserted into the small connection hole 17. ．． This is done by inserting the microbin 42 of the foot board 4 containing the card board 3. This insertion is carried out by expanding the small hole 1T of the resin film 16, and after insertion, the micro-bin 42 is held by the shrinkage elasticity of the resin itself, and this holding is done for all the micro-bins 42. , the card holding means conventionally required can be omitted.

In addition, if you wish to remove the element in the opposite manner to the above, such as when replacing a part of the element, use the small hole 17 under the same melting environment as above. All you have to do is pull out the icropin 42.

In this case, as the bottle 42 is pulled out, the surface of the bottle 42 to be pulled out is rubbed by the resin film 16 around the circumference H of the small hole 1T, and after the bottle 42 is pulled out, the small hole 1T itself is closed as much as possible. , the molten alloy will not be drawn out or flowed out with the bottle.

Next, as an example of a method for manufacturing the board substrate 1a,
Quartz with a plate thickness of 250 to 300 #m.

After drilling a predetermined number of socket holes 14 with a diameter of about 150 to 200 μm in a predetermined position on a substrate made of ceramics or silicon using a laser, the substrate is heated at 40 to 50°C.
Each socket hole 14 is filled with a connecting member 18 made of this alloy. After that, both sides of the board taken out from the bath are polished to flatten the surface between the alloy and the board, and on one side, each of the connection members is placed in a predetermined position corresponding to a wiring circuit in a conventional wiring module. A wiring pattern 13 connected to 18 is formed, and a thickness of 50 to 100 μm is formed on both sides of the substrate including this pattern.
Paste resin film 15 and 16 around m.

Also spray coat. This resin is preferably silicone rubber or urethane rubber, which is resistant to extremely low temperatures and highly elastic at room temperature. Next, the other resin film 16 corresponding to the socket hole 14 is removed using a low power laser.
A small connection hole 17 with a diameter of 1, for example, around 50 to 100 μm, which is smaller than the diameter of the micro pin 42 and can prevent the alloy from flowing out, is made, and divisions #15a and 16a are formed by laser scanning to prevent thermal expansion. The resin films 15 and 16 are completed while being prevented from breaking or deforming due to coefficient differences or the like. Further, the microbin 42 is formed by depositing a superconducting alloy material in a thick pattern at a predetermined position and having a melting point sufficiently higher than that of the alloy used as the connecting member 18, and then heating and melting the material to the melting point to increase its surface tension. This may be allowed to naturally form into a spherical shape, and then cooled and solidified.

The low melting point superconducting alloy material to be filled in the socket hole 14 may be, for example, a Pb-8n-Bi-In alloy, and the same alloy for the micro pin 42-, which has a higher melting point than this, may be used. For example, h=Bi-8n alloys can be used for each.

As detailed above, according to the present invention, a laser can be applied to process the board, and since the board and the wiring module are made common, the overall configuration can be extremely simplified, and it is easy to manufacture and handle. This is advantageous when creating an island or layering a large number of modules, and all the connecting members, micro pins, etc. are made of superconducting alloy, and the thickness of the board can be reduced to half of the conventional one. has the advantage of speeding up signal transmission. In addition, since the socket hole part is made of an elastic resin film, there is no need for any other means to hold the micro pin after it is inserted.Furthermore, since the socket hole is straight, it can occupy a large area on the board compared to conventional methods. 1/ of
Since it can be made to be 4 or less, it is possible to wear a high-density mask. Furthermore, if necessary, the wiring pattern can be corrected by locally removing the protective resin film with a laser, cutting a portion of the wiring pattern, trimming it, or adding new vapor deposition. It is possible to demonstrate this.

[Brief explanation of the drawing]

Figure 1 shows a conventional micro connector for actual values of superconducting elements. The configuration diagram, Figure 2, is a nine superconducting element using this embodiment! Cross-section of the main part showing the external connector. ...Small hole for connection, 1--Connection part made of low-melting point superconducting alloy material, 2 Patent application filed Nippon Denkoden m company agent Kataki Yamakawa Figure 1 Figure 2

Claims (1)

[Claims] Each has a thin film substrate with socket holes drilled at predetermined positions, each socket hole is filled with a connecting member made of a low melting point alloy that exhibits superconductivity in an extremely low temperature range, and the A wiring pattern to be connected to each connection member is formed, and an elastic resin film is formed on both sides of the board including the wiring pattern, and small connection holes are formed in the resin film on the other side at positions corresponding to the socket holes. The same quality alloy with a higher melting point than the connecting member is passed through this small hole. A micro connector for mounting a superconducting element, characterized in that a microphone pin of different types can be inserted and connected.