JPS5894780A - Microconnector for mounting superconductive element - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a microconnector for mounting superconducting elements.

A conventional expansion of this type of equipment, as shown in Figure 1,
A silicon board 1 formed by shape etching and having nine socket holes 11 in which a mercury bulb 12 is injected and held, and a silicon card substrate 3 on which a superconducting element 2 is mounted. A silicon foot substrate 4 is attached to this substrate 3 in a 5-shape and is provided with platinum microbins 41, and also has platinum microbins 51 to control the elements and the operations between the elements. The silicon foot board 2 is connected to the socket hole 11 of the silicon board 1 from the front and back. and Tani Shirogane microbin 41 of wiring module 5
, 51 were inserted to establish mutual electrical connection.

Here, the card board 3. Furthermore, the number of microbins 41 on the foot board 4 is, for example, around 120, and since, for example, 16 to 32 sets of cards are mounted on the board 1, the number of microbins 41 is usually around 4,000. A socket hole 11 is provided, and its size is 60 mm in bottle diameter.
The hole diameter is around 100 μm.

In such a conventional device, not only the elements but also the wiring material are made of superconducting material.
．． Since the material 51 is not a superconducting material, it has the essential drawback of reducing the device operating speed in the cryogenic region.In addition, the socket hole 11, which is a cavity for holding the mercury bulb 12, is not suitable for photoetching and selective etching. After going through each process, a complicated manufacturing procedure is required in which two symmetrical substrates are bonded together, and the board 1 made by bonding two substrates in this way is made up of at least 0.
It has a thickness of about 5 to 0.6 mm, and as a result, the distance between each micro-bin 41, 51 becomes large, the impedance at the connector part increases, and the socket hole 1
Since 1 is formed by anisotropic etching of silicon, the hole diameter on the cavity side expands to around 500 μm compared to the hole diameter on the entrance side of around 100 μm9, which is disadvantageous for high-density mounting in the future. It was something that I had.

In order to improve these drawbacks of the conventional art, the present invention forms both the material to be inserted into the socket hole and the microbin made of superconducting material, and provides the electrical connection part on the outer surface of the board, so that the same device can be used as a single drive. In addition, each configuration of the bottle is made easy and simple.

Hereinafter, embodiments of this inventive device will be described in detail with reference to FIGS. WJ2 to WJ4.

Figure 2 and #! FIG. 3 shows the configuration of one embodiment.

In these FIGS. 2 and 3, reference numeral 1a denotes a single board with through holes 13 formed at predetermined positions, and separation grooves 15 formed at predetermined positions on both the front and back surfaces.
．． At the same time, a small hole 16.16t is opened at the corresponding position of the through hole 13, and a connecting piece 17 made of a superconducting alloy material is inserted through each hole 13.1B. , both ends of which are covered with resin film 14°14
0 and 2, 3.
4 and 5 are superconducting elements, respectively, similar to the conventional example,
card board, foot board and wiring module,
Foot board Mei's wiring pattern 742 and distribution M! The wiring pattern s2 of the Zier device is provided with i-micro pins 43 and 53, both of which are made of superconducting alloy material. In addition, 6 and 1 are insert holes 6 for fixing at the edge, respectively.
1 and T1 form a nine-frame back plate and a pressing spring plate, 8 is a resin joint for fixing with heads 81 and 81 at both ends, and 9 is a resin plate for cushioning.

However, in order to assemble the embodiments shown in FIGS. 3 and 4, the superconducting element 2 is connected to the connecting piece 1T of the board 1&
．． Microbin 41 of hood board 4 including card board 3
and the micro pins 51 of the wiring module 50 are placed in contact with each other, and a frame back plate 6 is placed on the side of the wiring module 5, and cushioning resin plates 9 are interposed therebetween on both sides below the insertion hole 1. , In addition, the presser spring plates T are placed on each of the 7 board boards 4, and in this state, the resin joints 8 are inserted into each insertion hole @1, 71 at each end position. It is only necessary to insert and engage them at multiple points with the holder, and to integrate them into one piece. After assembling in this way, by putting it under extremely low temperature, the connection piece will be formed by shrinkage of the resin joint. Each microbin 41, 51 is pressed against the 1T in a refreshing manner.

Next, as an example of the method for manufacturing the board 1a, 25
A predetermined number of groove holes with a width of 100 μm and a length of about 200 μm are drilled in a predetermined position using a laser on a substrate made of quartz, ceramic, silicon, etc. having a thickness of 0 to 300 μm, and then A resin film 14.14 with a thickness of about 100 μm is pasted or spray coated on both sides of the substrate. This resin is preferably silicone rubber or urethane rubber, which is resistant to extremely low temperatures and highly elastic at room temperature.

Next, small holes 1B and 1@ are made in the portion of the resin 14.14 corresponding to the through hole 111 using a low power laser, and dividing grooves II are formed by laser scanning.

15 to prevent breakage and deformation of the resin film due to differences in thermal expansion coefficients and other factors. After that, connect the connecting piece 17 to each hole 13.
16, and bend both ends to push them into the resin horse face to complete the process. tt microphone four bottles 43, 53ti,
After depositing a superconducting alloy material in a thick pattern at a predetermined location, it may be heated and melted to its melting point, naturally formed into a spherical shape due to its surface tension, and then cooled and solidified.

Furthermore, the embodiment in FIG. 4 is a case in which a thin wire bundle 18 made of a superconducting alloy material is used in place of the connecting piece 1T in the embodiments in FIGS. 2 and 3. In addition, each superconducting alloy material is Pb-8n, which exhibits superconducting properties at extremely low temperatures.
-There is a Bi-In alloy.

As detailed above, according to the present invention, each member constituting the connector is made of a superconducting alloy material, which not only speeds up signal transmission, but also allows electrical connections to be provided on the board surface. In addition, the height of the micro pin can be reduced and its formation can be made easier, and the alignment recess for the connection can be made wider. Moreover, a single plate can be used as the board, and the board can be made thinner. The manufacturing process is simplified because processing can be done using a laser.

It has features such as being efficient.

[Brief explanation of drawings]

Figure #II is a schematic configuration diagram showing a conventional micro connector for mounting a superconducting element, and Figure 2 is a partially cutaway plan view showing a microphone q connector for mounting a superconducting element according to an embodiment of the present invention. , FIG. 3 is a partial perspective view of the same as above in an assembled state, and FIG. 4 is a partially cutaway plan view of another embodiment of the same as above.
14...Resin film, 16.Φ...Small hole, 17...
Connecting piece, 18, wire bundle, 2... superconducting element,
3.φ...Card board, 4...Cutting foot board, 43.
・・Φ Micro pin, 5・Φ・・Wiring module, 53
...War micro bottle, μ...Frame back plate, 611...
Push-in hole, T-th... Presser d-plate, T1... Insertion hole, 8
...Joint, 9...Resin board for cushion. Patent Applicant Nippon Telegraph and Telephone Public Corporation Agent Masaki Yamakawa Figure 1 Figure 2 Figure 1 Figure 3 Figure 4

Claims (1)

[Claims] Through-holes are formed at predetermined positions in a thin plate A made of a single board, and a resin film is adhered and formed on both sides of this substrate, and small holes are formed in each resin film at positions corresponding to the through-holes. Then, through these through holes and small holes,
Either insert a connecting piece made of an alloy material that exhibits superconducting properties in an extremely low temperature range and bend its both ends to the surface of the resin film, or insert a thin wire bundle made of the same alloy material and connect these connecting pieces. Alternatively, a micro connector for mounting a superconducting element is characterized in that a four-pin microphone made of the same alloy material is suppressed and held in a thin wire bundle to enable electrical connection.