JPH05183247A - Flexible printed board and liquid crystal display - Google Patents

Flexible printed board and liquid crystal display

Info

Publication number
JPH05183247A
JPH05183247A JP15944392A JP15944392A JPH05183247A JP H05183247 A JPH05183247 A JP H05183247A JP 15944392 A JP15944392 A JP 15944392A JP 15944392 A JP15944392 A JP 15944392A JP H05183247 A JPH05183247 A JP H05183247A
Authority
JP
Japan
Prior art keywords
liquid crystal
flexible printed
fpc
connection
crystal display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15944392A
Other languages
Japanese (ja)
Other versions
JP2652107B2 (en
Inventor
Makoto Katase
誠 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP4159443A priority Critical patent/JP2652107B2/en
Publication of JPH05183247A publication Critical patent/JPH05183247A/en
Application granted granted Critical
Publication of JP2652107B2 publication Critical patent/JP2652107B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Abstract

PURPOSE:To improve the reliability of connection of an FPC and to provide a highly reliable liquid crystal display. CONSTITUTION:At least one dummy terminal 5, which does not participate in electrical connection, is provided at each of both end parts on the outside of a group of effective connection terminals 4 connected to a base film 3 of an FPC. In such a way, the dummy terminals 5 are respectively provided at both end parts on the outside of the group of the connection terminals of the FPC, whereby the generation of disconnection due to a stress or the like at both end parts on the outside is prevented and a display having a high reliability of connection is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は特に高密度、多端子のL
CDパネル実装等に利用するフレキシブルプリント基板
(以下FPCと略す)及び液晶表示装置に関するもので
ある。
BACKGROUND OF THE INVENTION The present invention is particularly applicable to high density, multi-terminal L
The present invention relates to a flexible printed circuit board (hereinafter abbreviated as FPC) used for mounting a CD panel and the like and a liquid crystal display device.

【0002】[0002]

【従来の技術】従来、FPCの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。
2. Description of the Related Art Conventionally, a connection terminal group of an FPC has been formed opposite to a terminal lead-out portion for connection with an external circuit of a liquid crystal panel for electrical connection.

【0003】[0003]

【発明が解決しようとする課題】従来のFPCは全端子
が有効接続端子として使用されていたため、FPCのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いFPC及び液晶表示装置を得ることを目的とし
ている。
In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in thermal expansion coefficient between the FPC base film and the glass substrate, for example, There was a drawback that the connection terminal was broken and immediately caused a defect. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal display device with high connection reliability.

【0004】[0004]

【課題を解決するための手段】本発明のFPCは、接続
端子群の外側両端部に電気的接続には関与しない補強部
材を配置したことを特徴とする。
The FPC of the present invention is characterized in that reinforcing members which are not involved in electrical connection are arranged at both outer ends of the connection terminal group.

【0005】本発明の液晶表示装置は、FPCの接続端
子群及び前記補強部材と液晶パネルの外部回路との接続
用の端子取出部とを異方性導電膜を介して電気的接続さ
れてなることを特徴とする。
In the liquid crystal display device of the present invention, a group of connection terminals of the FPC and a terminal lead-out portion for connecting the reinforcing member and an external circuit of the liquid crystal panel are electrically connected through an anisotropic conductive film. It is characterized by

【0006】[0006]

【実施例】本発明を図面に基づいて説明すると図1はF
PCベースフィルム側からみたものであり、図2はその
断面図である。1は液晶パネル端子取出部、2は異方性
導電膜、3はベースフィルム、4は有効接続端子、5は
ダミー端子である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.
It is viewed from the PC base film side, and FIG. 2 is a sectional view thereof. Reference numeral 1 is a liquid crystal panel terminal lead-out portion, 2 is an anisotropic conductive film, 3 is a base film, 4 is an effective connection terminal, and 5 is a dummy terminal.

【0007】このようにダミー端子5を設けた場合に
は、ベースフィルム3と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子5に負荷がかかり内側の有効接続端子4には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。
When the dummy terminals 5 are provided in this way, even if shear stress is generated due to a difference in thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal take-out portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. In addition, since the dummy terminal, which is the reinforcing member, is made of the same material as the effective connection terminal, it can be easily reinforced without increasing the number of steps. In addition, it has an effect that the influence of stress due to the difference in material can be minimized.

【0008】図3は圧着時における効果を説明する図で
あり、ヒーターヘッド6により熱圧着される状態を示し
ている。ヒーターヘッド6の平坦度が理論的平面で平行
に押された場合には、端部、中央部共に同一であると考
えられるが、ヒーターヘッド6が熱変形で凹面となる場
合では端部端子に応力が集中して電気的安定接続を難し
くする。このような場合でもダミー端子5a,5b,5
cが存在すれば内部の有効接続端子4は電気的安定接続
を保てる。したがって、有効接続端子部の外側両端部も
中心部と同じような接続が可能になり、有効接続端子部
の全面において圧着均一性が増大するという効果を有す
る。
FIG. 3 is a view for explaining the effect at the time of crimping, and shows a state in which the heater head 6 is thermocompression-bonded. When the flatness of the heater head 6 is pushed in parallel on the theoretical plane, it is considered that the end portion and the center portion are the same, but when the heater head 6 is concave due to thermal deformation, the end terminals are not connected. Stress concentrates and makes stable electrical connection difficult. Even in such a case, the dummy terminals 5a, 5b, 5
If c exists, the internal effective connection terminal 4 can maintain an electrically stable connection. Therefore, the outer end portions of the effective connection terminal portion can be connected to each other in the same manner as the central portion, and the pressure-bonding uniformity is increased over the entire surface of the effective connection terminal portion.

【0009】図4はダミー端子5a,5b,5cの代わ
りにFPC上のレジスト材7で同様の機能を持たせたも
のである。
In FIG. 4, instead of the dummy terminals 5a, 5b and 5c, a resist material 7 on the FPC has a similar function.

【0010】図5の実装構造はLSIチップ8をAn−
Sn共晶等でFPCに接続し、有効接続端子4と液晶パ
ネルの端子取出部1とを異方性導電膜2を介して電気的
接続を行った構造である。
In the mounting structure shown in FIG. 5, the LSI chip 8 is An-.
The structure is such that Sn eutectic or the like is connected to the FPC, and the effective connection terminal 4 and the terminal lead-out portion 1 of the liquid crystal panel are electrically connected via the anisotropic conductive film 2.

【0011】図6の実装構造は図5での方法を更に高密
度にした方法であり、液晶パネル端子取出部1上にLS
Iチップ8を搭載したFPCを異方性導電膜を介して電
気的接続を行った構造である。
The mounting structure of FIG. 6 is a method in which the method of FIG. 5 is made higher in density, and the LS is formed on the liquid crystal panel terminal lead-out portion 1.
This is a structure in which an FPC equipped with the I-chip 8 is electrically connected through an anisotropic conductive film.

【0012】図5、図6の実装構造は多端子、多チップ
で1台の製品となるため、接続端子の外側両端部の安定
接続により累乗的に歩留まりが良くなることになる。
Since the mounting structure of FIGS. 5 and 6 is one product with multiple terminals and multiple chips, stable connection of both outer ends of the connection terminals will improve the yield rate exponentially.

【0013】[0013]

【発明の効果】以上説明したようにFPCの接続端子群
の外側両端部に補強部材を配置したことにより、外側両
端部のストレス等による断線を防止し、接続信頼性の高
い表示装置が得られる。また、有効接続端子部の外側両
端部も中心部と同じような接続が可能であり、均一な接
続強度を有し、有効接続端子部の全面において圧着均一
性が増大するという効果を有している。
As described above, by disposing the reinforcing members at both outer ends of the connection terminal group of the FPC, disconnection due to stress or the like at both outer ends can be prevented, and a display device with high connection reliability can be obtained. . Further, both outer end portions of the effective connection terminal portion can be connected in the same manner as the central portion, and have a uniform connection strength, and have an effect of increasing the pressure bonding uniformity over the entire surface of the effective connection terminal portion. There is.

【0014】したがって、FPCを大型化、多端子化し
た時等に生じる熱膨張係数の違いによる応力による不良
を低減できる。また、機械的剥離力に対しても強く、信
頼性の高い電気的接続が可能である。
Therefore, it is possible to reduce defects due to stress due to the difference in thermal expansion coefficient that occurs when the FPC is upsized and has multiple terminals. In addition, it is resistant to mechanical peeling force and enables highly reliable electrical connection.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明のベースフィルム側から見た図。FIG. 1 is a view seen from the side of a base film of the present invention.

【図2】 本発明の実施例の断面図。FIG. 2 is a sectional view of an embodiment of the present invention.

【図3】 本発明の圧着工程図。FIG. 3 is a crimping process diagram of the present invention.

【図4】 本発明のダミー端子5をレジスト材7に置き
換えた図。
FIG. 4 is a view in which the dummy terminal 5 of the present invention is replaced with a resist material 7.

【図5】 本発明の他の実施例を示す図。FIG. 5 is a diagram showing another embodiment of the present invention.

【図6】 本発明の他の実施例を示す図。FIG. 6 is a diagram showing another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1.液晶パネル端子取出部 2.異方性導電膜 3.ベースフィルム 4.有効接続端子 5.ダミー端子 6.ヒーターヘッド 7.レジスト材 8.LSIチップ 1. Liquid crystal panel terminal extraction part 2. Anisotropic conductive film 3. Base film 4. Effective connection terminal 5. Dummy terminal 6. Heater head 7. Resist material 8. LSI chip

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】接続端子群の外側両端部に電気的接続には
関与しない補強部材を配置したことを特徴とするフレキ
シブルプリント基板。
1. A flexible printed circuit board, wherein reinforcing members which are not involved in electrical connection are arranged at both outer ends of the connection terminal group.
【請求項2】前記補強部材は前記接続端子と同一材質で
あることを特徴とする請求項1記載のフレキシブルプリ
ント基板。
2. The flexible printed circuit board according to claim 1, wherein the reinforcing member is made of the same material as the connecting terminal.
【請求項3】前記補強部材がレジスト材からなることを
特徴とする請求項1記載のフレキシブルプリント基板。
3. The flexible printed circuit board according to claim 1, wherein the reinforcing member is made of a resist material.
【請求項4】請求項1記載のフレキシブルプリント基板
の接続端子群及び前記補強部材と液晶パネルの外部回路
との接続用の端子取出部とが異方性導電膜を介して電気
的接続されてなることを特徴とする液晶表示装置。
4. The flexible printed board connection terminal group according to claim 1, and the terminal lead-out portion for connecting the reinforcing member and the external circuit of the liquid crystal panel are electrically connected through an anisotropic conductive film. And a liquid crystal display device.
JP4159443A 1992-06-18 1992-06-18 Electrical connection structure Expired - Lifetime JP2652107B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4159443A JP2652107B2 (en) 1992-06-18 1992-06-18 Electrical connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4159443A JP2652107B2 (en) 1992-06-18 1992-06-18 Electrical connection structure

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7315649A Division JP2630314B2 (en) 1995-12-04 1995-12-04 Liquid crystal device

Publications (2)

Publication Number Publication Date
JPH05183247A true JPH05183247A (en) 1993-07-23
JP2652107B2 JP2652107B2 (en) 1997-09-10

Family

ID=15693868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4159443A Expired - Lifetime JP2652107B2 (en) 1992-06-18 1992-06-18 Electrical connection structure

Country Status (1)

Country Link
JP (1) JP2652107B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
WO1999053736A1 (en) * 1998-04-09 1999-10-21 Seiko Epson Corporation Pressure-bonded substrate, liquid crystal device, and electronic device
WO1999053735A1 (en) * 1998-04-09 1999-10-21 Seiko Epson Corporation Pressure-bonded substrate, liquid crystal device, and electronic device
US6061248A (en) * 1996-07-19 2000-05-09 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
JP2007088128A (en) * 2005-09-21 2007-04-05 Citizen Watch Co Ltd Fpc connecting constitution to panel and liquid crystal device using it
WO2010016312A1 (en) 2008-08-06 2010-02-11 シャープ株式会社 Liquid crystal display device testing method and liquid crystal display device
US7804693B2 (en) 2004-07-22 2010-09-28 Samsung Techwin Co., Ltd. Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
US8351009B2 (en) 2009-06-22 2013-01-08 Sharp Kabushiki Kaisha Display panel, liquid crystal display device and drive-circuit-mounted board
JP2013045956A (en) * 2011-08-25 2013-03-04 Kyocera Corp Wiring board and input device
JP2013069397A (en) * 2011-09-05 2013-04-18 Sumitomo Electric Printed Circuit Inc Connection structure of printed circuit board, printed circuit board and method for manufacturing printed circuit board connection body

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536881A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Flexible printed board having connecting terminal for connecting by multiple soldering connection method
JPS60170176A (en) * 1984-02-10 1985-09-03 ソニ−ケミカル株式会社 Connecting structure with transparent conductive film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS536881A (en) * 1976-07-09 1978-01-21 Hitachi Ltd Flexible printed board having connecting terminal for connecting by multiple soldering connection method
JPS60170176A (en) * 1984-02-10 1985-09-03 ソニ−ケミカル株式会社 Connecting structure with transparent conductive film

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5490040A (en) * 1993-12-22 1996-02-06 International Business Machines Corporation Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array
US6566165B1 (en) 1996-07-19 2003-05-20 Matsushita Electric Industrial Co., Ltd. Method for mounting a semiconductor chip to a semiconductor chip-mounting board
US6787922B2 (en) 1996-07-19 2004-09-07 Matsushita Electric Industrial Co., Ltd. Semiconductor chip—mounting board
US6061248A (en) * 1996-07-19 2000-05-09 Matsushita Electric Industrial Co., Ltd. Semiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereon
US6781662B1 (en) 1998-04-09 2004-08-24 Seiko Epson Corporation Compression-bond connection substrate, liquid crystal device, and electronic equipment
US6542213B1 (en) 1998-04-09 2003-04-01 Seiko Epson Corporation Compression-bond-connection substrate, liquid crystal device, and electronic equipment
WO1999053735A1 (en) * 1998-04-09 1999-10-21 Seiko Epson Corporation Pressure-bonded substrate, liquid crystal device, and electronic device
WO1999053736A1 (en) * 1998-04-09 1999-10-21 Seiko Epson Corporation Pressure-bonded substrate, liquid crystal device, and electronic device
US7804693B2 (en) 2004-07-22 2010-09-28 Samsung Techwin Co., Ltd. Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same
JP2007088128A (en) * 2005-09-21 2007-04-05 Citizen Watch Co Ltd Fpc connecting constitution to panel and liquid crystal device using it
WO2010016312A1 (en) 2008-08-06 2010-02-11 シャープ株式会社 Liquid crystal display device testing method and liquid crystal display device
US8351009B2 (en) 2009-06-22 2013-01-08 Sharp Kabushiki Kaisha Display panel, liquid crystal display device and drive-circuit-mounted board
JP2013045956A (en) * 2011-08-25 2013-03-04 Kyocera Corp Wiring board and input device
JP2013069397A (en) * 2011-09-05 2013-04-18 Sumitomo Electric Printed Circuit Inc Connection structure of printed circuit board, printed circuit board and method for manufacturing printed circuit board connection body

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