JP2845219B2 - Electrical connection structure and liquid crystal device - Google Patents

Electrical connection structure and liquid crystal device

Info

Publication number
JP2845219B2
JP2845219B2 JP8266095A JP26609596A JP2845219B2 JP 2845219 B2 JP2845219 B2 JP 2845219B2 JP 8266095 A JP8266095 A JP 8266095A JP 26609596 A JP26609596 A JP 26609596A JP 2845219 B2 JP2845219 B2 JP 2845219B2
Authority
JP
Japan
Prior art keywords
terminal
electrical connection
liquid crystal
substrate
terminal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP8266095A
Other languages
Japanese (ja)
Other versions
JPH09121078A (en
Inventor
誠 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17426257&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2845219(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP8266095A priority Critical patent/JP2845219B2/en
Publication of JPH09121078A publication Critical patent/JPH09121078A/en
Application granted granted Critical
Publication of JP2845219B2 publication Critical patent/JP2845219B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、接続端子群の外側
両端部に電気的な接続には関与しないダミーパターンを
配置したフレキシブルプリント基板と、導電パターン形
成されたがガラス等の部材からなる基板との電気的接続
構造に関する。さらに詳しくは、該基板ともう一枚の基
板とを相対向させて液晶セルを形成した液晶装置に関す
る。 【0002】 【従来の技術】従来、FPCの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。 【0003】 【発明が解決しようとする課題】従来のFPCは全端子
が有効接続端子として使用されていたため、FPCのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いFPC及び液晶表示装置を得ることを目的とし
ている。 【0004】 【課題を解決するための手段】本発明の電気的接続構造
は、端子部を有する基板と、端子部を有するフレキシブ
ルプリント基板との両端子部を対向させ異方性導電膜を
介して電気的接続してなる電気的接続構造であって、前
記基板の端子部と前記フレキシブルプリント基板の端子
部との電気的接続に寄与しないダミーパターンが、前記
フレキシブルプリント基板における端子部の両方の外側
にそれぞれ複数個配置され、前記異方性導電膜を介して
前記基板と対向されたことを特徴とする。また本発明の
液晶装置は、端子部を有する基板と、端子部を有するフ
レキシブルプリント基板との両端子部を対向させ異方性
導電膜を介して電気的接続してなる液晶装置であって、
前記基板の端子部と前記フレキシブルプリント基板の端
子部との電気的接続に寄与しないダミーパターンが、前
記フレキシブルプリント基板における前記端子部の両方
の外側にそれぞれ複数個配置され、前記異方性導電膜を
介して前記基板と対向されたことを特徴とする。 【0005】本発明の液晶表示装置は、FPCの接続端
子群及び前記補強部材と液晶パネルの外部回路との接続
用の端子取出部とを異方性導電膜を介して電気的接続さ
れてなることを特徴とする。 【0006】 【発明の実施の形態】 〔実施例〕本発明を図面に基づいて説明すると図1はF
PCベースフィルム側からみたものであり、図2はその
断面図である。1は液晶パネル端子取出部、2は異方性
導電膜、3はベースフィルム、4は有効接続端子、5は
ダミー端子である。 【0007】このようにダミー端子5を設けた場合に
は、ベースフィルム3と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子5に負荷がかかり内側の有効接続端子4には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。 【0008】図3は圧着時における効果を説明する図で
あり、ヒーターヘッド6により熱圧着される状態を示し
ている。ヒーターヘッド6の平坦度が理論的平面で平行
に押された場合には、端部、中央部共に同一であると考
えられるが、ヒーターヘッド6が熱変形で凹面となる場
合では端部端子に応力が集中して電気的安定接続を難し
くする。このような場合でもダミー端子5a,5b,5
cが存在すれば内部の有効接続端子4は電気的安定接続
を保てる。したがって、有効接続端子部の外側両端部も
中心部と同じような接続が可能になり、有効接続端子部
の全面において圧着均一性が増大するという効果を有す
る。 【0009】図4はダミー端子5a,5b,5cの代わ
りにFPC上のレジスト材7で同様の機能を持たせたも
のである。 【0010】図5の実装構造はLSIチップ8をAn−
Sn共晶等でFPCに接続し、有効接続端子4と液晶パ
ネルの端子取出部1とを異方性導電膜2を介して電気的
接続を行った構造である。 【0011】図6の実装構造は図5での方法を更に高密
度にした方法であり、液晶パネル端子取出部1上にLS
Iチップ8を搭載したFPCを異方性導電膜を介して電
気的接続を行った構造である。 【0012】図5、図6の実装構造は多端子、多チップ
で1台の製品となるため、接続端子の外側両端部の安定
接続により累乗的に歩留まりが良くなることになる。 【0013】 【発明の効果】以上説明したように本発明によれば、端
子部外側端部のストレス等による断線を防止し、接続信
頼性の高い電気的接続構造が得られ、そしてその電子的
接続構造を用いた接続信頼性の高い液晶装置が得られ
る。また端子部の外側両端部も中心部と同じように接続
が可能であり、よって均一な接続強度を有し、端子部の
全面において圧着均一性が増大するという効果を有して
いる。さらには、端子部の両端部に複数づつダミーパタ
ーンを設けたので、最も剥離しやすい最も外側のダミー
パターンが剥離した場合においても、他のダミーパター
ンと基板との接着によって、基板の端子部とフレキシブ
ルプリント基板の端子部との電気的接続の強度が維持で
きる。 【0014】したがって、FPCを大型化、多端子化し
た時等に生じる熱膨張係数の違いによる応力による不良
を低減できる。また、機械的剥離力に対しても強く、信
頼性の高い電気的接続が可能である。
BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention is an outer connecting terminal groups
Dummy patterns that do not contribute to the electrical connection
Flexible printed circuit board and conductive pattern
Electrical connection to a substrate made of glass or other material
Regarding the structure. More specifically, the substrate and another substrate
Liquid crystal device with liquid crystal cell formed with plates facing each other
You. 2. Description of the Related Art Conventionally, a group of connection terminals of an FPC has been formed so as to face a terminal extraction portion for connection to an external circuit of a liquid crystal panel, and has been electrically connected. [0003] In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in the thermal expansion coefficient between the base film of the FPC and, for example, a glass substrate, the maximum is required. There is a drawback that the connection terminal at the outer end is disconnected and causes a defect immediately. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal display device with high connection reliability. [0004] An electrical connection structure according to the present invention comprises a substrate having a terminal portion and a flexible printed circuit board having the terminal portion, both terminals being opposed to each other via an anisotropic conductive film. And a dummy pattern that does not contribute to the electrical connection between the terminal portion of the substrate and the terminal portion of the flexible printed circuit board. It is characterized in that a plurality of each are arranged on the outside and opposed to the substrate via the anisotropic conductive film. The liquid crystal device of the present invention is a liquid crystal device in which both terminals of a substrate having a terminal portion and a flexible printed circuit board having a terminal portion are opposed to each other and electrically connected via an anisotropic conductive film,
A plurality of dummy patterns not contributing to the electrical connection between the terminal portions of the substrate and the terminal portions of the flexible printed board are respectively arranged outside both of the terminal portions on the flexible printed board, and the anisotropic conductive film is provided. Characterized in that it is opposed to the substrate via In the liquid crystal display device of the present invention, the connection terminal group of the FPC and the terminal for connecting the reinforcing member to an external circuit of the liquid crystal panel are electrically connected through an anisotropic conductive film. It is characterized by the following. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.
FIG. 2 is a cross-sectional view as viewed from the PC base film side. Reference numeral 1 denotes a liquid crystal panel terminal extraction portion, 2 denotes an anisotropic conductive film, 3 denotes a base film, 4 denotes an effective connection terminal, and 5 denotes a dummy terminal. When the dummy terminals 5 are provided in this manner, even if a shear stress is generated due to a difference in the thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal extraction portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. Further, since the dummy terminal as the reinforcing member is made of the same material as the effective connection terminal, the reinforcement can be easily performed without increasing the number of steps. In addition, it has the effect of minimizing the effect of stress due to differences in materials. FIG. 3 is a view for explaining the effect at the time of pressure bonding, and shows a state in which the pressure bonding is performed by the heater head 6. When the flatness of the heater head 6 is pressed in parallel on a theoretical plane, it is considered that both ends and the center are the same. However, when the heater head 6 becomes concave due to thermal deformation, it is connected to an end terminal. Stress concentrates and makes electrical stable connection difficult. Even in such a case, the dummy terminals 5a, 5b, 5
If c exists, the internal effective connection terminal 4 can maintain an electrically stable connection. Therefore, the outer ends of the effective connection terminal can be connected in the same manner as the center, and the uniformity of crimping can be increased over the entire surface of the effective connection terminal. FIG. 4 shows a structure in which a resist material 7 on an FPC has a similar function in place of the dummy terminals 5a, 5b and 5c. The mounting structure shown in FIG.
The structure is such that the connection is made to the FPC with Sn eutectic or the like, and the effective connection terminal 4 and the terminal extraction portion 1 of the liquid crystal panel are electrically connected via the anisotropic conductive film 2. The mounting structure shown in FIG. 6 is a method in which the method shown in FIG.
This is a structure in which an FPC on which the I chip 8 is mounted is electrically connected via an anisotropic conductive film. Since the mounting structure shown in FIGS. 5 and 6 constitutes one product with multiple terminals and multiple chips, the yield is improved by a power by the stable connection of the outer ends of the connection terminals. As described above, according to the present invention, disconnection due to stress or the like at the outer end of the terminal portion can be prevented, and an electrical connection structure with high connection reliability can be obtained. A liquid crystal device with high connection reliability using the connection structure can be obtained. In addition, the outer end portions of the terminal portion can be connected in the same manner as the center portion, so that the terminal portion has a uniform connection strength, and has the effect of increasing the uniformity of crimping over the entire surface of the terminal portion. Furthermore, since a plurality of dummy patterns are provided at both ends of the terminal portion, even when the outermost dummy pattern which is most easily peeled is peeled off, the other dummy pattern and the substrate are bonded to each other so that the terminal portion of the substrate can be removed. The strength of the electrical connection with the terminals of the flexible printed circuit board can be maintained. Therefore, it is possible to reduce defects due to stress caused by a difference in thermal expansion coefficient when the FPC is enlarged and the number of terminals is increased. Further, it is strong against mechanical peeling force, and highly reliable electrical connection is possible.

【図面の簡単な説明】 【図1】 本発明のベースフィルム側から見た図。 【図2】 本発明の実施例の断面図。 【図3】 本発明の圧着工程図。 【図4】 本発明のダミー端子5をレジスト材7に置き
換えた図。 【図5】 本発明の他の実施例を示す図。 【図6】 本発明の他の実施例を示す図。 【符号の説明】 1.液晶パネル端子取出部 2.異方性導電膜 3.ベースフィルム 4.有効接続端子 5.ダミー端子 6.ヒーターヘッド 7.レジスト材 8.LSIチップ
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view seen from a base film side of the present invention. FIG. 2 is a sectional view of an embodiment of the present invention. FIG. 3 is a pressure-bonding process diagram of the present invention. FIG. 4 is a diagram in which a dummy terminal 5 of the present invention is replaced with a resist material 7; FIG. 5 is a view showing another embodiment of the present invention. FIG. 6 is a diagram showing another embodiment of the present invention. [Explanation of Codes] 1. LCD panel terminal extraction section 2. Anisotropic conductive film Base film4. Effective connection terminal 5. Dummy terminal 6. Heater head7. Resist material8. LSI chip

Claims (1)

(57)【特許請求の範囲】 1.端子部を有する基板と、端子部を有するフレキシブ
ルプリント基板との両端子部を対向させ異方性導電膜を
介して電気的接続してなる電気的接続構造であって、 前記基板の端子部と前記フレキシブルプリント基板の端
子部との電気的接続に寄与しないダミーパターンが、前
記フレキシブルプリント基板における端子部の両方の外
側にそれぞれ複数個配置され、前記異方性導電膜を介し
て前記基板と対向されたことを特徴とする電気的接続構
造。 2.端子部を有する基板と、端子部を有するフレキシブ
ルプリント基板との両端子部を対向させ異方性導電膜を
介して電気的接続してなる液晶装置であって、 前記基板の端子部と前記フレキシブルプリント基板の端
子部との電気的接続に寄与しないダミーパターンが、前
記フレキシブルプリント基板における前記端子部の両方
の外側にそれぞれ複数個配置され、前記異方性導電膜を
介して前記基板と対向されたことを特徴とする液晶装
置。
(57) [Claims] A substrate having a terminal portion, an electrical connection structure in which both terminal portions of the flexible printed circuit board having the terminal portion are opposed to each other and electrically connected via an anisotropic conductive film, and the terminal portion of the substrate A plurality of dummy patterns not contributing to the electrical connection with the terminal portion of the flexible printed board are respectively arranged outside both of the terminal portions on the flexible printed board, and the dummy pattern faces the substrate via the anisotropic conductive film. An electrical connection structure characterized by being performed. 2. A liquid crystal device comprising a substrate having a terminal portion and a flexible printed circuit board having a terminal portion, wherein both terminal portions are opposed to each other and electrically connected via an anisotropic conductive film. A plurality of dummy patterns not contributing to the electrical connection with the terminals of the printed circuit board are respectively arranged outside both of the terminals on the flexible printed circuit board, and are opposed to the substrate via the anisotropic conductive film. A liquid crystal device.
JP8266095A 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device Expired - Lifetime JP2845219B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8266095A JP2845219B2 (en) 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8266095A JP2845219B2 (en) 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7315649A Division JP2630314B2 (en) 1995-12-04 1995-12-04 Liquid crystal device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP9294042A Division JP2940532B2 (en) 1997-10-27 1997-10-27 Electrical connection structure and liquid crystal device

Publications (2)

Publication Number Publication Date
JPH09121078A JPH09121078A (en) 1997-05-06
JP2845219B2 true JP2845219B2 (en) 1999-01-13

Family

ID=17426257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8266095A Expired - Lifetime JP2845219B2 (en) 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device

Country Status (1)

Country Link
JP (1) JP2845219B2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11307886A (en) * 1998-04-21 1999-11-05 Matsushita Electric Ind Co Ltd Flip chip joinint land waving prevention pattern
KR100521260B1 (en) * 1998-06-22 2005-12-29 삼성전자주식회사 Circuit connection device and flexible printed circuit board comprising the same
JP2003149665A (en) * 2001-11-08 2003-05-21 Hitachi Ltd Liquid crystal display device
KR100920354B1 (en) * 2003-03-03 2009-10-07 삼성전자주식회사 Thin film transistor array panel
JP2007335434A (en) * 2006-06-12 2007-12-27 Nec Corp Flexible wiring board, method for repairing disconnection thereof and circuit board
JP5738122B2 (en) * 2011-08-25 2015-06-17 京セラ株式会社 Wiring board and input device
KR101740006B1 (en) * 2016-11-23 2017-06-09 지스마트 주식회사 Flexible circuit board for transparent display board improved durability and the assembling method thereof

Also Published As

Publication number Publication date
JPH09121078A (en) 1997-05-06

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