JP2940532B2 - Electrical connection structure and liquid crystal device - Google Patents
Electrical connection structure and liquid crystal deviceInfo
- Publication number
- JP2940532B2 JP2940532B2 JP9294042A JP29404297A JP2940532B2 JP 2940532 B2 JP2940532 B2 JP 2940532B2 JP 9294042 A JP9294042 A JP 9294042A JP 29404297 A JP29404297 A JP 29404297A JP 2940532 B2 JP2940532 B2 JP 2940532B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal portion
- flexible printed
- terminal
- liquid crystal
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は特に高密度、多端子
のＬＣＤパネル実装等に利用するフレキシブルプリント
基板（以下ＦＰＣと略す）を用いた電気的接続構造及び
液晶装置に関するものである。
【０００２】
【従来の技術】従来、ＦＰＣの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。
【０００３】
【発明が解決しようとする課題】従来のＦＰＣは全端子
が有効接続端子として使用されていたため、ＦＰＣのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いＦＰＣ及び液晶表示装置を得ることを目的とし
ている。
【０００４】
【課題を解決するための課題】本発明の電気的接続構造
は、端子部を有するフレキシブルプリント基板と、端子
部を有し前記フレキシブルプリント基板とは熱膨張係数
が異なる基板とを、両端子部を対向させ異方性導電膜を
介して圧着によって電気的接続してなる電気的接続構造
であって、前記フレキシブルプリント基板の端子部に
は、前記フレキシブルプリント基板の端子部と前記基板
の端子部との電気的接続に寄与しないダミー端子が、当
該端子部における有効接続端子部の外側に複数個並べて
配置されてなることを特徴とする。また、ＬＳＩチップ
が接続され端子部を有するフレキシブルプリント基板
と、端子部を有し前記フレキシブルプリント基板とは熱
膨張係数が異なる基板とを、両端子部を対向させ異方性
導電膜を介して圧着によって電気的接続してなる電気的
接続構造であって、前記フレキシブルプリント基板の端
子部には、前記フレキシブルプリント基板の端子部と前
記基板の端子部との電気的接続に寄与しないダミー端子
が、当該端子部における有効接続端子部の外側に複数個
並べて配置されてなることを特徴とする。
【０００５】さらに、本発明の液晶装置は、端子部を有
するフレキシブルプリント基板と、端子部を有し前記フ
レキシブルプリント基板とは熱膨張係数が異なる液晶パ
ネルの基板とを、両端子部を対向させ異方性導電膜を介
して圧着によって電気的接続してなる液晶装置であっ
て、前記フレキシブルプリント基板の端子部には、前記
フレキシブルプリント基板の端子部と前記液晶パネルの
基板の端子部との電気的接続に寄与しないダミー端子
が、当該端子部における有効接続端子部の外側に複数個
並べて配置されてなることを特徴とする。また、ＬＳＩ
チップが接続され端子部を有するフレキシブルプリント
基板と、端子部を有し前記フレキシブルプリント基板と
は熱膨張係数が異なる液晶パネルの基板とを、両端子部
を対向させ異方性導電膜を介して圧着によって電気的接
続してなる液晶装置であって、前記フレキシブルプリン
ト基板の端子部には、前記フレキシブルプリント基板の
端子部と前記液晶パネルの基板の端子部との電気的接続
に寄与しないダミー端子が、当該端子部における有効接
続端子部の外側に複数個並べて配置されてなることを特
徴とする。
【０００６】
【発明の実施の形態】
〔実施例〕本発明を図面に基づいて説明すると図１はＦ
ＰＣベースフィルム側からみたものであり、図２はその
断面図である。１は液晶パネル端子取出部、２は異方性
導電膜、３はベースフィルム、４は有効接続端子、５は
ダミー端子である。
【０００７】このようにダミー端子５を設けた場合に
は、ベースフィルム３と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子５に負荷がかかり内側の有効接続端子４には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。
【０００８】図３は圧着時における効果を説明する図で
あり、ヒーターヘッド６により熱圧着される状態を示し
ている。ヒーターヘッド６の平坦度が理論的平面で平行
に押された場合には、端部、中央部共に同一であると考
えられるが、ヒーターヘッド６が熱変形で凹面となる場
合では端部端子に応力が集中して電気的安定接続を難し
くする。このような場合でもダミー端子５ａ，５ｂ，５
ｃが存在すれば内部の有効接続端子４は電気的安定接続
を保てる。したがって、有効接続端子部の外側両端部も
中心部と同じような接続が可能になり、有効接続端子部
の全面において圧着均一性が増大するという効果を有す
る。
【０００９】図４はダミー端子５ａ，５ｂ，５ｃの代わ
りにＦＰＣ上のレジスト材７で同様の機能を持たせたも
のである。
【００１０】図５の実装構造はＬＳＩチップ８をＡｎ−
Ｓｎ共晶等でＦＰＣに接続し、有効接続端子４と液晶パ
ネルの端子取出部１とを異方性導電膜２を介して電気的
接続を行った構造である。
【００１１】図６の実装構造は図５での方法を更に高密
度にした方法であり、液晶パネル端子取出部１上にＬＳ
Ｉチップ８を搭載したＦＰＣを異方性導電膜を介して電
気的接続を行った構造である。
【００１２】図５、図６の実装構造は多端子、多チップ
で１台の製品となるため、接続端子の外側両端部の安定
接続により累乗的に歩留まりが良くなることになる。
【００１３】
【発明の効果】以上に説明したように、本発明によれ
ば、基板同士の熱膨張係数の違いにより基板間に生じる
せん断応力によって端子部外側端部で最外端の有効接続
端子が電気的オープンになることを防止し、接続信頼性
の高い電気的接続構造が得られる。また、有効接続端子
部の外側端部が中心部と同じように接続が可能であり、
よって均一な接続強度を有し、有効接続端子部の全面に
おいて圧着均一性が増大するという効果を有している。
【００１４】したがって、ＦＰＣを大型化、多端子化し
た時等に生じる熱膨張係数の違いによる応力による不良
を低減できる。また、機械的剥離力に対しても強く、信
頼性の高い電気的接続が可能である。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection structure using a flexible printed circuit board (hereinafter abbreviated as FPC) used for mounting a high-density, multi-terminal LCD panel. And a liquid crystal device. 2. Description of the Related Art Conventionally, a group of connection terminals of an FPC has been formed so as to face a terminal extraction portion for connection to an external circuit of a liquid crystal panel, and has been electrically connected. [0003] In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in the thermal expansion coefficient between the base film of the FPC and, for example, a glass substrate, the maximum is required. There is a drawback that the connection terminal at the outer end is disconnected and causes a defect immediately. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal display device with high connection reliability. [0004] The electrical connection structure of the present invention comprises a flexible printed board having a terminal portion and a substrate having a terminal portion and having a different coefficient of thermal expansion from the flexible printed board. An electrical connection structure in which both terminal portions are opposed to each other and electrically connected by pressure bonding via an anisotropic conductive film, wherein the terminal portion of the flexible printed board includes a terminal portion of the flexible printed board and the terminal portion of the flexible printed board. A plurality of dummy terminals that do not contribute to the electrical connection with the terminal part are arranged side by side outside the effective connection terminal part in the terminal part. Further, a flexible printed board to which an LSI chip is connected and which has a terminal portion, and a substrate which has a terminal portion and has a different coefficient of thermal expansion from the flexible printed board, with both terminal portions facing each other via an anisotropic conductive film. An electrical connection structure that is electrically connected by crimping, wherein the terminal portion of the flexible printed board has a dummy terminal that does not contribute to electrical connection between the terminal portion of the flexible printed board and the terminal portion of the board. A plurality of the terminal portions are arranged and arranged outside the effective connection terminal portion. Further, in the liquid crystal device according to the present invention, a flexible printed circuit board having a terminal portion and a substrate of a liquid crystal panel having a terminal portion and having a different coefficient of thermal expansion from that of the flexible printed circuit board are provided with both terminal portions facing each other. A liquid crystal device electrically connected by pressure bonding via an anisotropic conductive film, wherein a terminal portion of the flexible printed circuit board includes a terminal portion of the flexible printed circuit board and a terminal portion of a substrate of the liquid crystal panel. A plurality of dummy terminals which do not contribute to electrical connection are arranged outside the effective connection terminal portion in the terminal portion. In addition, LSI
A flexible printed board to which a chip is connected and having a terminal portion, and a substrate of a liquid crystal panel having a terminal portion and having a different coefficient of thermal expansion from the flexible printed board, with both terminal portions facing each other via an anisotropic conductive film. A liquid crystal device electrically connected by crimping, wherein a terminal portion of the flexible printed board has a dummy terminal that does not contribute to electrical connection between the terminal portion of the flexible printed board and the terminal portion of the substrate of the liquid crystal panel. Are arranged side by side outside the effective connection terminal portion in the terminal portion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.
FIG. 2 is a cross-sectional view as viewed from the PC base film side. Reference numeral 1 denotes a liquid crystal panel terminal extraction portion, 2 denotes an anisotropic conductive film, 3 denotes a base film, 4 denotes an effective connection terminal, and 5 denotes a dummy terminal. When the dummy terminals 5 are provided in this manner, even if a shear stress is generated due to a difference in the thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal extraction portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. Further, since the dummy terminal as the reinforcing member is made of the same material as the effective connection terminal, the reinforcement can be easily performed without increasing the number of steps. In addition, it has the effect of minimizing the effect of stress due to differences in materials. FIG. 3 is a view for explaining the effect at the time of pressure bonding, and shows a state in which the pressure bonding is performed by the heater head 6. When the flatness of the heater head 6 is pressed in parallel on a theoretical plane, it is considered that both ends and the center are the same. However, when the heater head 6 becomes concave due to thermal deformation, it is connected to an end terminal. Stress concentrates and makes electrical stable connection difficult. Even in such a case, the dummy terminals 5a, 5b, 5
If c exists, the internal effective connection terminal 4 can maintain an electrically stable connection. Therefore, the outer ends of the effective connection terminal can be connected in the same manner as the center, and the uniformity of crimping can be increased over the entire surface of the effective connection terminal. FIG. 4 shows a structure in which a resist material 7 on an FPC has a similar function in place of the dummy terminals 5a, 5b and 5c. The mounting structure shown in FIG.
The structure is such that the connection is made to the FPC with Sn eutectic or the like, and the effective connection terminal 4 and the terminal extraction portion 1 of the liquid crystal panel are electrically connected via the anisotropic conductive film 2. The mounting structure shown in FIG. 6 is a method in which the method shown in FIG.
This is a structure in which an FPC on which the I chip 8 is mounted is electrically connected via an anisotropic conductive film. Since the mounting structure shown in FIGS. 5 and 6 constitutes one product with multiple terminals and multiple chips, the yield is improved by a power by the stable connection of the outer ends of the connection terminals. As described above, according to the present invention, the outermost effective connection terminal at the outer end of the terminal portion due to the shear stress generated between the substrates due to the difference in thermal expansion coefficient between the substrates. Is prevented from being electrically open, and an electrical connection structure with high connection reliability can be obtained. In addition, the outer end of the effective connection terminal can be connected in the same manner as the center,
Therefore, it has the effect of having uniform connection strength and increasing the uniformity of crimping over the entire surface of the effective connection terminal portion. Therefore, it is possible to reduce defects due to stress caused by a difference in thermal expansion coefficient when the FPC is enlarged and the number of terminals is increased. Further, it is strong against mechanical peeling force, and highly reliable electrical connection is possible.
【図面の簡単な説明】
【図１】 本発明のベースフィルム側から見た図。
【図２】 本発明の実施例の断面図。
【図３】 本発明の圧着工程図。
【図４】 本発明のダミー端子５をレジスト材７に置き
換えた図。
【図５】 本発明の他の実施例を示す図。
【図６】 本発明の他の実施例を示す図。
【符号の説明】
１．液晶パネル端子取出部
２．異方性導電膜
３．ベースフィルム
４．有効接続端子
５．ダミー端子
６．ヒーターヘッド
７．レジスト材
８．ＬＳＩチップBRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view seen from a base film side of the present invention. FIG. 2 is a sectional view of an embodiment of the present invention. FIG. 3 is a pressure-bonding process diagram of the present invention. FIG. 4 is a diagram in which a dummy terminal 5 of the present invention is replaced with a resist material 7; FIG. 5 is a view showing another embodiment of the present invention. FIG. 6 is a diagram showing another embodiment of the present invention. [Explanation of Codes] 1. LCD panel terminal extraction section 2. Anisotropic conductive film Base film4. Effective connection terminal 5. Dummy terminal 6. Heater head7. Resist material8. LSI chip
フロントページの続き (56)参考文献 特開 昭55−67183（ＪＰ，Ａ) 特開 昭58−34488（ＪＰ，Ａ) 特開 昭53−6881（ＪＰ，Ａ) 特開 昭60−170176（ＪＰ，Ａ) 特開 昭60−178690（ＪＰ，Ａ) 特開 昭60−180189（ＪＰ，Ａ) 実公 昭58−14337（ＪＰ，Ｙ２) 実公 昭58−22224（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/14 H05K 1/11 G02F 1/1345 Continuation of the front page (56) References JP-A-55-67183 (JP, A) JP-A-58-34488 (JP, A) JP-A-53-6881 (JP, A) JP-A-60-170176 (JP, A) , A) JP-A-60-178690 (JP, A) JP-A-60-180189 (JP, A) JP-A-58-14337 (JP, Y2) JP-A-58-22224 (JP, Y2) (58) Field surveyed (Int.Cl. 6 , DB name) H05K 1/14 H05K 1/11 G02F 1/1345
Claims (1)
部を有し前記フレキシブルプリント基板とは熱膨張係数
が異なる基板とを、両端子部を対向させ異方性導電膜を
介して圧着によって電気的接続してなる電気的接続構造
であって、 前記フレキシブルプリント基板の端子部には、前記フレ
キシブルプリント基板の端子部と前記基板の端子部との
電気的接続に寄与しないダミー端子が、当該端子部にお
ける有効接続端子部の外側に複数個並べて配置されてな
ることを特徴とする電気的接続構造。 ２．ＬＳＩチップが接続され端子部を有するフレキシブ
ルプリント基板と、端子部を有し前記フレキシブルプリ
ント基板とは熱膨張係数が異なる基板とを、両端子部を
対向させ異方性導電膜を介して圧着によって電気的接続
してなる電気的接続構造であって、 前記フレキシブルプリント基板の端子部には、前記フレ
キシブルプリント基板の端子部と前記基板の端子部との
電気的接続に寄与しないダミー端子が、当該端子部にお
ける有効接続端子部の外側に複数個並べて配置されてな
ることを特徴とする電気的接続構造。 ３．端子部を有するフレキシブルプリント基板と、端子
部を有し前記フレキシブルプリント基板とは熱膨張係数
が異なる液晶パネルの基板とを、両端子部を対向させ異
方性導電膜を介して圧着によって電気的接続してなる液
晶装置であって、 前記フレキシブルプリント基板の端子部には、前記フレ
キシブルプリント基板の端子部と前記液晶パネルの基板
の端子部との電気的接続に寄与しないダミー端子が、当
該端子部における有効接続端子部の外側に複数個並べて
配置されてなることを特徴とする液晶装置。 ４．ＬＳＩチップが接続され端子部を有するフレキシブ
ルプリント基板と、端子部を有し前記フレキシブルプリ
ント基板とは熱膨張係数が異なる液晶パネルの基板と
を、両端子部を対向させ異方性導電膜を介して圧着によ
って電気的接続してなる液晶装置であって、 前記フレキシブルプリント基板の端子部には、前記フレ
キシブルプリント基板の端子部と前記液晶パネルの基板
の端子部との電気的接続に寄与しないダミー端子が、当
該端子部における有効接続端子部の外側に複数個並べて
配置されてなることを特徴とする液晶装置。(57) [Claims] A flexible printed circuit board having a terminal portion and a substrate having a terminal portion and having a different coefficient of thermal expansion from the flexible printed circuit board are electrically connected by crimping via an anisotropic conductive film with both terminal portions facing each other. An electrical connection structure, wherein a dummy terminal that does not contribute to electrical connection between the terminal portion of the flexible printed board and the terminal portion of the substrate is provided at the terminal portion of the flexible printed circuit board. An electrical connection structure comprising a plurality of terminals arranged outside a terminal portion. 2. A flexible printed board to which an LSI chip is connected and which has a terminal portion, and a substrate which has a terminal portion and has a different coefficient of thermal expansion from the flexible printed board, are crimped through an anisotropic conductive film with both terminal portions facing each other. An electrical connection structure formed by electrical connection, wherein the terminal portion of the flexible printed board includes a dummy terminal that does not contribute to electrical connection between the terminal portion of the flexible printed board and the terminal portion of the board. An electrical connection structure comprising a plurality of terminals arranged outside an effective connection terminal portion in the terminal portion. 3. A flexible printed circuit board having a terminal portion and a liquid crystal panel substrate having a terminal portion and having a coefficient of thermal expansion different from that of the flexible printed circuit board are electrically connected to each other by crimping via an anisotropic conductive film with both terminal portions facing each other. A liquid crystal device comprising: a terminal portion of the flexible printed circuit board, a dummy terminal that does not contribute to electrical connection between the terminal portion of the flexible printed circuit board and the terminal portion of the substrate of the liquid crystal panel; A liquid crystal device comprising: a plurality of liquid crystal devices arranged outside an effective connection terminal portion in a portion. 4. A flexible printed circuit board to which an LSI chip is connected and having a terminal portion, and a substrate of a liquid crystal panel having a terminal portion and having a coefficient of thermal expansion different from that of the flexible printed circuit board, with both terminal portions facing each other via an anisotropic conductive film. A liquid crystal device electrically connected by crimping, wherein a terminal portion of the flexible printed board has a dummy that does not contribute to electrical connection between the terminal portion of the flexible printed board and the terminal portion of the substrate of the liquid crystal panel. A liquid crystal device comprising a plurality of terminals arranged outside the effective connection terminal portion of the terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9294042A JP2940532B2 (en) | 1997-10-27 | 1997-10-27 | Electrical connection structure and liquid crystal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9294042A JP2940532B2 (en) | 1997-10-27 | 1997-10-27 | Electrical connection structure and liquid crystal device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8266095A Division JP2845219B2 (en) | 1996-10-07 | 1996-10-07 | Electrical connection structure and liquid crystal device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11043929A Division JP3052954B2 (en) | 1999-02-22 | 1999-02-22 | Electrical connection structure and liquid crystal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10117049A JPH10117049A (en) | 1998-05-06 |
| JP2940532B2 true JP2940532B2 (en) | 1999-08-25 |
Family
ID=17802531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9294042A Expired - Lifetime JP2940532B2 (en) | 1997-10-27 | 1997-10-27 | Electrical connection structure and liquid crystal device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2940532B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002246701A (en) * | 2001-02-19 | 2002-08-30 | Shin Etsu Polymer Co Ltd | Flexible printed board and heat seal connector |
| CN100371808C (en) * | 2003-07-08 | 2008-02-27 | 鸿富锦精密工业（深圳）有限公司 | Glass flip-chip arrangement |
| KR101139523B1 (en) * | 2004-12-28 | 2012-05-02 | 엘지디스플레이 주식회사 | Organic electroluminescent device kit |
| KR100752660B1 (en) | 2006-03-31 | 2007-08-29 | 삼성전자주식회사 | Flexible printed circuit and hard disk drive with the same |
| JP5375182B2 (en) | 2009-02-26 | 2013-12-25 | 富士通株式会社 | Flexible printed circuit board |
| KR20140074740A (en) | 2012-12-10 | 2014-06-18 | 삼성디스플레이 주식회사 | Display devcie and manufacturing method of the same |
-
1997
- 1997-10-27 JP JP9294042A patent/JP2940532B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10117049A (en) | 1998-05-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19990518 |
|
| EXPY | Cancellation because of completion of term |