JPH10117049A - Liquid crystal apparatus - Google Patents

Liquid crystal apparatus

Info

Publication number
JPH10117049A
JPH10117049A JP29404297A JP29404297A JPH10117049A JP H10117049 A JPH10117049 A JP H10117049A JP 29404297 A JP29404297 A JP 29404297A JP 29404297 A JP29404297 A JP 29404297A JP H10117049 A JPH10117049 A JP H10117049A
Authority
JP
Japan
Prior art keywords
terminal
liquid crystal
dummy
flexible printed
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29404297A
Other languages
Japanese (ja)
Other versions
JP2940532B2 (en
Inventor
Makoto Katase
誠 片瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP9294042A priority Critical patent/JP2940532B2/en
Publication of JPH10117049A publication Critical patent/JPH10117049A/en
Application granted granted Critical
Publication of JP2940532B2 publication Critical patent/JP2940532B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Liquid Crystal (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent disconnection, due to a stress to obtain a highly reliable FPC(flexible printed circuit board) and a liquid crystal display unit by arranging a dummy pattern which does not contribute to electrical connection between a terminal section of a substrate and a terminal section of a flexible printed circuit board to the external side of the terminal. SOLUTION: A liquid crystal apparatus is formed of a liquid crystal panel terminal leading section 1, an anisotropic conductive film 2, a base film 3 and an effective connection terminal 4. Both external end sections of the effective connection terminal 4 are provided with a dummy terminal 5, which is a reinforcing member which does not contribute to electrical connection. When a dummy terminal 5 is provided as explained above, even if a shearing stress is generated due to the difference of thermal expansion coefficient of the base film 3 and liquid crystal panel terminal leading section 1, a load is applied to the dummy terminals 5 at both ends but is not loaded on the internal effective connection terminal 4. Moreover, the dummy terminal 5 is formed of the same material as the effective connection terminal 4 to realize reinforcement without increase of the process. Moreover, effects of stresses due to difference of material can be minimized.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は特に高密度、多端子
のLCDパネル実装等に利用するフレキシブルプリント
基板(以下FPCと略す)及び液晶表示装置に関するも
のである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (hereinafter abbreviated as "FPC") and a liquid crystal display device used for mounting a high-density, multi-terminal LCD panel.

【0002】[0002]

【従来の技術】従来、FPCの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。
2. Description of the Related Art Conventionally, a group of connection terminals of an FPC is formed so as to face a terminal extraction portion for connection to an external circuit of a liquid crystal panel, and electrical connection is made.

【0003】[0003]

【発明が解決しようとする課題】従来のFPCは全端子
が有効接続端子として使用されていたため、FPCのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いFPC及び液晶表示装置を得ることを目的とし
ている。
In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in the thermal expansion coefficient between the base film of the FPC and, for example, a glass substrate, the outermost end of the FPC is used. There is a drawback that the connection terminal is disconnected and causes a defect immediately. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal display device with high connection reliability.

【0004】[0004]

【課題を解決するための手段】本発明のFPCは、接続
端子群の外側両端部に電気的接続には関与しない補強部
材を配置したことを特徴とする。
The FPC according to the present invention is characterized in that reinforcing members not involved in electrical connection are arranged at both outer ends of the connection terminal group.

【0005】本発明の液晶表示装置は、FPCの接続端
子群及び前記補強部材と液晶パネルの外部回路との接続
用の端子取出部とを異方性導電膜を介して電気的接続さ
れてなることを特徴とする。
In the liquid crystal display device of the present invention, the connection terminal group of the FPC and the terminal for connecting the reinforcing member to an external circuit of the liquid crystal panel are electrically connected through an anisotropic conductive film. It is characterized by the following.

【0006】[0006]

【発明の実施の形態】BEST MODE FOR CARRYING OUT THE INVENTION

〔実施例〕本発明を図面に基づいて説明すると図1はF
PCベースフィルム側からみたものであり、図2はその
断面図である。1は液晶パネル端子取出部、2は異方性
導電膜、3はベースフィルム、4は有効接続端子、5は
ダミー端子である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.
FIG. 2 is a cross-sectional view as viewed from the PC base film side. Reference numeral 1 denotes a liquid crystal panel terminal extraction portion, 2 denotes an anisotropic conductive film, 3 denotes a base film, 4 denotes an effective connection terminal, and 5 denotes a dummy terminal.

【0007】このようにダミー端子5を設けた場合に
は、ベースフィルム3と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子5に負荷がかかり内側の有効接続端子4には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。
When the dummy terminals 5 are provided in this manner, even if a shear stress is generated due to a difference in the thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal extraction portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. Further, since the dummy terminal as the reinforcing member is made of the same material as the effective connection terminal, the reinforcement can be easily performed without increasing the number of steps. In addition, it has the effect of minimizing the effect of stress due to differences in materials.

【0008】図3は圧着時における効果を説明する図で
あり、ヒーターヘッド6により熱圧着される状態を示し
ている。ヒーターヘッド6の平坦度が理論的平面で平行
に押された場合には、端部、中央部共に同一であると考
えられるが、ヒーターヘッド6が熱変形で凹面となる場
合では端部端子に応力が集中して電気的安定接続を難し
くする。このような場合でもダミー端子5a,5b,5
cが存在すれば内部の有効接続端子4は電気的安定接続
を保てる。したがって、有効接続端子部の外側両端部も
中心部と同じような接続が可能になり、有効接続端子部
の全面において圧着均一性が増大するという効果を有す
る。
FIG. 3 is a view for explaining the effect at the time of pressure bonding, and shows a state in which the pressure bonding is performed by the heater head 6. When the flatness of the heater head 6 is pressed in parallel on the theoretical plane, it is considered that both ends and the center are the same. However, when the heater head 6 is concave due to thermal deformation, it is connected to the end terminal. Stress concentrates and makes electrical stable connection difficult. Even in such a case, the dummy terminals 5a, 5b, 5
If c exists, the internal effective connection terminal 4 can maintain an electrically stable connection. Therefore, the outer ends of the effective connection terminal can be connected in the same manner as the center, and the uniformity of crimping can be increased over the entire surface of the effective connection terminal.

【0009】図4はダミー端子5a,5b,5cの代わ
りにFPC上のレジスト材7で同様の機能を持たせたも
のである。
FIG. 4 shows a structure in which a resist material 7 on an FPC has a similar function in place of the dummy terminals 5a, 5b and 5c.

【0010】図5の実装構造はLSIチップ8をAn−
Sn共晶等でFPCに接続し、有効接続端子4と液晶パ
ネルの端子取出部1とを異方性導電膜2を介して電気的
接続を行った構造である。
The mounting structure shown in FIG.
The structure is such that the connection is made to the FPC with Sn eutectic or the like, and the effective connection terminal 4 and the terminal extraction portion 1 of the liquid crystal panel are electrically connected via the anisotropic conductive film 2.

【0011】図6の実装構造は図5での方法を更に高密
度にした方法であり、液晶パネル端子取出部1上にLS
Iチップ8を搭載したFPCを異方性導電膜を介して電
気的接続を行った構造である。
The mounting structure shown in FIG. 6 is a method in which the method shown in FIG.
This is a structure in which an FPC on which the I chip 8 is mounted is electrically connected via an anisotropic conductive film.

【0012】図5、図6の実装構造は多端子、多チップ
で1台の製品となるため、接続端子の外側両端部の安定
接続により累乗的に歩留まりが良くなることになる。
Since the mounting structure shown in FIGS. 5 and 6 constitutes one product with multiple terminals and multiple chips, the yield is improved by a power by the stable connection of the outer ends of the connection terminals.

【0013】[0013]

【発明の効果】以上説明したようにFPCの接続端子群
の外側両端部に補強部材を配置したことにより、外側両
端部のストレス等による断線を防止し、接続信頼性の高
い表示装置が得られる。また、有効接続端子部の外側両
端部も中心部と同じような接続が可能であり、均一な接
続強度を有し、有効接続端子部の全面において圧着均一
性が増大するという効果を有している。
As described above, by arranging reinforcing members at both outer ends of the connection terminal group of the FPC, disconnection due to stress or the like at the outer both ends is prevented, and a display device with high connection reliability can be obtained. . In addition, the outer end portions of the effective connection terminal portion can be connected in the same manner as the center portion, have a uniform connection strength, and have the effect of increasing crimp uniformity over the entire effective connection terminal portion. I have.

【0014】したがって、FPCを大型化、多端子化し
た時等に生じる熱膨張係数の違いによる応力による不良
を低減できる。また、機械的剥離力に対しても強く、信
頼性の高い電気的接続が可能である。
Therefore, it is possible to reduce defects due to stress caused by a difference in thermal expansion coefficient when the FPC is enlarged and the number of terminals is increased. Further, it is strong against mechanical peeling force, and highly reliable electrical connection is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明のベースフィルム側から見た図。FIG. 1 is a view of the present invention as viewed from a base film side.

【図2】 本発明の実施例の断面図。FIG. 2 is a sectional view of an embodiment of the present invention.

【図3】 本発明の圧着工程図。FIG. 3 is a pressure-bonding process diagram of the present invention.

【図4】 本発明のダミー端子5をレジスト材7に置き
換えた図。
FIG. 4 is a diagram in which a dummy terminal 5 of the present invention is replaced with a resist material 7;

【図5】 本発明の他の実施例を示す図。FIG. 5 is a view showing another embodiment of the present invention.

【図6】 本発明の他の実施例を示す図。FIG. 6 is a diagram showing another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1.液晶パネル端子取出部 2.異方性導電膜 3.ベースフィルム 4.有効接続端子 5.ダミー端子 6.ヒーターヘッド 7.レジスト材 8.LSIチップ 1. LCD panel terminal extraction section 2. 2. Anisotropic conductive film Base film 4. Effective connection terminal 5. Dummy terminal 6. Heater head 7. Resist material 8. LSI chip

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成9年11月17日[Submission date] November 17, 1997

【手続補正1】[Procedure amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】発明の名称[Correction target item name] Name of invention

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【発明の名称】液晶装置[Title of the Invention] Liquid crystal device

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Correction target item name] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【特許請求の範囲】[Claims]

【手続補正3】[Procedure amendment 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0001[Correction target item name] 0001

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0001】[0001]

【発明の属する技術分野】本発明は液晶装置に関するも
のである
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0004[Correction target item name] 0004

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0004】[0004]

【課題を解決するための手段】本発明の液晶装置は、端
子部を有する基板と、LSIチップが接続された端子部
を有するフレキシブルプリント基板との両端子部を対向
させ異方性導電膜を介して電気的接続してなる液晶表示
装置であって、前記基板の端子部と前記フレキシブルプ
リント基板の端子部との電気的接続に寄与しないダミー
パターンが、前記フレキシブルプリント基板における端
子部の外側に配置されたことを特徴とする。また、端子
部を有する基板と、LSIチップが接続された端子部を
有するフレキシブルプリント基板との両端子部を対向さ
せ異方性導電膜を介して電気的接続してなる液晶装置で
あって、前記基板の端子部と前記フレキシブルプリント
基板の端子部との電気的接続に寄与しないダミーパター
ンが、前記フレキシブルプリント基板における端子部の
外側に複数個配置されたことを特徴とする。
According to the liquid crystal device of the present invention, both terminals of a substrate having terminals and a flexible printed circuit having terminals connected to an LSI chip are opposed to each other to form an anisotropic conductive film. A liquid crystal display device electrically connected via a terminal, wherein a dummy pattern that does not contribute to the electrical connection between the terminal portion of the substrate and the terminal portion of the flexible printed board is provided outside the terminal portion of the flexible printed board. It is characterized by being arranged. Further, a liquid crystal device comprising a substrate having a terminal portion and a flexible printed circuit having a terminal portion to which an LSI chip is connected, wherein both terminal portions are opposed to each other and electrically connected via an anisotropic conductive film, A plurality of dummy patterns not contributing to the electrical connection between the terminal portion of the substrate and the terminal portion of the flexible printed board are arranged outside the terminal portion of the flexible printed board.

【手続補正5】[Procedure amendment 5]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0013[Correction target item name] 0013

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0013】[0013]

【発明の効果】以上説明したように本発明によれば、端
子部外側端部のストレス等による断線を防止し、接続信
頼性の高い液晶装置が得られる。また端子部の外側両端
部も中心部と同じように接続が可能であり、よって均一
な接続強度を有し、端子部の全面において圧着均一性が
増大するという効果を有している。更には、端子部の外
側に複数個のダミーパターンを設けたので、最も剥離し
やすい、最も外側のダミーパターンが剥離した場合にお
いても、他のダミーパターンと基板との接着によって、
基板の端子部とフレキシブルプリント基板の端子部との
電気的接続の強度が維持できる。
As described above, according to the present invention, disconnection due to stress or the like at the outer end of the terminal portion can be prevented, and a liquid crystal device having high connection reliability can be obtained. In addition, the outer end portions of the terminal portion can be connected in the same manner as the center portion, so that the terminal portion has a uniform connection strength, and has the effect of increasing the uniformity of crimping over the entire surface of the terminal portion. Further, since a plurality of dummy patterns are provided outside the terminal portion, the most easily peelable, even when the outermost dummy pattern is peeled, by bonding the other dummy pattern and the substrate,
The strength of the electrical connection between the terminal portion of the board and the terminal portion of the flexible printed board can be maintained.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】接続端子群の外側両端部に電気的接続には
関与しない補強部材を配置したことを特徴とするフレキ
シブルプリント基板。
1. A flexible printed circuit board, wherein reinforcing members not involved in electrical connection are arranged at both outer ends of a connection terminal group.
【請求項2】前記補強部材は前記接続端子と同一材質で
あることを特徴とする請求項1記載のフレキシブルプリ
ント基板。
2. The flexible printed circuit board according to claim 1, wherein said reinforcing member is made of the same material as said connection terminal.
【請求項3】前記補強部材がレジスト材からなることを
特徴とする請求項1記載のフレキシブルプリント基板。
3. The flexible printed circuit board according to claim 1, wherein said reinforcing member is made of a resist material.
【請求項4】請求項1記載のフレキシブルプリント基板
の接続端子群及び前記補強部材と液晶パネルの外部回路
との接続用の端子取出部とが異方性導電膜を介して電気
的接続されてなることを特徴とする液晶表示装置。
4. A connection terminal group of the flexible printed circuit board according to claim 1, wherein said reinforcing member and a terminal extraction portion for connection to an external circuit of a liquid crystal panel are electrically connected via an anisotropic conductive film. A liquid crystal display device comprising:
JP9294042A 1997-10-27 1997-10-27 Electrical connection structure and liquid crystal device Expired - Lifetime JP2940532B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9294042A JP2940532B2 (en) 1997-10-27 1997-10-27 Electrical connection structure and liquid crystal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9294042A JP2940532B2 (en) 1997-10-27 1997-10-27 Electrical connection structure and liquid crystal device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP8266095A Division JP2845219B2 (en) 1996-10-07 1996-10-07 Electrical connection structure and liquid crystal device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP11043929A Division JP3052954B2 (en) 1999-02-22 1999-02-22 Electrical connection structure and liquid crystal device

Publications (2)

Publication Number Publication Date
JPH10117049A true JPH10117049A (en) 1998-05-06
JP2940532B2 JP2940532B2 (en) 1999-08-25

Family

ID=17802531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9294042A Expired - Lifetime JP2940532B2 (en) 1997-10-27 1997-10-27 Electrical connection structure and liquid crystal device

Country Status (1)

Country Link
JP (1) JP2940532B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246701A (en) * 2001-02-19 2002-08-30 Shin Etsu Polymer Co Ltd Flexible printed board and heat seal connector
KR100752660B1 (en) 2006-03-31 2007-08-29 삼성전자주식회사 Flexible printed circuit and hard disk drive with the same
CN100371808C (en) * 2003-07-08 2008-02-27 鸿富锦精密工业(深圳)有限公司 Glass flip-chip arrangement
KR101139523B1 (en) * 2004-12-28 2012-05-02 엘지디스플레이 주식회사 Organic electroluminescent device kit
US8269114B2 (en) 2009-02-26 2012-09-18 Fujitsu Limited Flexible printed board
US9609758B2 (en) 2012-12-10 2017-03-28 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246701A (en) * 2001-02-19 2002-08-30 Shin Etsu Polymer Co Ltd Flexible printed board and heat seal connector
CN100371808C (en) * 2003-07-08 2008-02-27 鸿富锦精密工业(深圳)有限公司 Glass flip-chip arrangement
KR101139523B1 (en) * 2004-12-28 2012-05-02 엘지디스플레이 주식회사 Organic electroluminescent device kit
KR100752660B1 (en) 2006-03-31 2007-08-29 삼성전자주식회사 Flexible printed circuit and hard disk drive with the same
US8269114B2 (en) 2009-02-26 2012-09-18 Fujitsu Limited Flexible printed board
US9295155B2 (en) 2009-02-26 2016-03-22 Fujitsu Limited Flexible printed board
US9609758B2 (en) 2012-12-10 2017-03-28 Samsung Display Co., Ltd. Display device and method of manufacturing the same

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