JP3349365B2 - Liquid crystal display device and method of manufacturing the same - Google Patents
Liquid crystal display device and method of manufacturing the sameInfo
- Publication number
- JP3349365B2 JP3349365B2 JP28352296A JP28352296A JP3349365B2 JP 3349365 B2 JP3349365 B2 JP 3349365B2 JP 28352296 A JP28352296 A JP 28352296A JP 28352296 A JP28352296 A JP 28352296A JP 3349365 B2 JP3349365 B2 JP 3349365B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- display device
- crystal display
- drive circuit
- electrode substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プラスチックから
なる電極基板を用いたプラスチック液晶表示装置に関す
るものであり、特に電極基板と駆動回路基板との接着力
が補強された液晶表示装置及びその製造方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plastic liquid crystal display device using a plastic electrode substrate, and more particularly to a liquid crystal display device in which the adhesive force between an electrode substrate and a driving circuit substrate is reinforced, and a method of manufacturing the same. It is about.
【０００２】[0002]
【従来の技術】近年、液晶表示装置の薄型化及び軽量化
等の点から、電極基板としてプラスチックフィルムまた
はプラスチックシートを用いるプラスチック液晶表示装
置が注目され、電卓またはＩＣカード等の小型ディスプ
レイの分野で実用化されている。2. Description of the Related Art In recent years, a plastic liquid crystal display device using a plastic film or a plastic sheet as an electrode substrate has attracted attention from the viewpoint of reducing the thickness and weight of the liquid crystal display device, and has been used in the field of small displays such as calculators and IC cards. Has been put to practical use.
【０００３】プラスチック液晶表示装置では、電極基板
の外部接続端子と駆動回路基板の接続端子とを、異方性
導電膜またはヒートシールコネクタ等を介して熱圧着す
ることにより、液晶表示パネルと駆動回路とが電気的に
接続され、電極基板と駆動回路基板とが接着されてい
る。In a plastic liquid crystal display device, an external connection terminal of an electrode substrate and a connection terminal of a drive circuit board are thermocompression bonded via an anisotropic conductive film or a heat seal connector or the like, so that the liquid crystal display panel is connected to the drive circuit. Are electrically connected, and the electrode substrate and the drive circuit substrate are bonded.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、プラス
チック液晶表示装置を温度変化の激しい環境に置くと、
電極基板と駆動回路基板との基板材料の熱膨張率の違い
により、接続部に応力が働いたり、ユニット組み立ての
ハンドリング等で外部から接続部に無理な力がかかった
りして、接続部で異方性導電膜またはヒートシールコネ
クタ等の剥離または浮き等の接続不良が発生する。However, when the plastic liquid crystal display device is placed in an environment where the temperature changes drastically,
Due to the difference in the coefficient of thermal expansion of the substrate material between the electrode substrate and the drive circuit substrate, stress may be applied to the connection part, or excessive force may be applied to the connection part from the outside due to handling of unit assembly etc. Poor connection such as peeling or floating of an isotropic conductive film or a heat seal connector occurs.
【０００５】この接続不良は、ＴＡＢ（Ｔａｐｅ−Ａｕ
ｔｏｍａｔｅｄ−Ｂｏｎｄｉｎｇ）タイプのドライバＬ
ＳＩに異方性導電膜を介した接続、または導電樹脂をパ
ターン印刷し、端子接続部に導電粒子を熱硬化絶縁樹脂
に均一に分散したインクを印刷してなるヒートシールコ
ネクタによる接続等、種々の熱圧着型の接続方法におい
て、少なからず発生している。[0005] This connection failure is caused by TAB (Tape-Au).
driver L of tomed-Bonding type
Various types of connection, such as connection through an anisotropic conductive film on SI, or pattern printing of conductive resin, and connection with a heat seal connector in which terminal particles are printed with ink in which conductive particles are uniformly dispersed in thermosetting insulating resin In the thermo-compression bonding method described above.
【０００６】この接続不良は、電極基板と駆動回路基板
との接着強度不足に起因するものである。つまり、プラ
スチックからなる電極基板と駆動回路基板とを熱圧着す
る場合、ガラスからなる電極基板の場合と比較して、低
温、低圧力及び短時間で処理しなければならないため、
接着強度が確保し難いのである。[0006] The poor connection results from insufficient bonding strength between the electrode substrate and the drive circuit substrate. In other words, when thermocompression bonding of an electrode substrate made of plastic and a drive circuit board is performed at a lower temperature, a lower pressure, and a shorter time than in the case of an electrode substrate made of glass,
It is difficult to secure the adhesive strength.
【０００７】さらに詳細に説明すれば、熱圧着に用いる
異方性導電膜及びヒートシールコネクタ等の接着剤には
熱硬化性樹脂を用いており、熱圧着温度は接着剤の硬化
温度以上、かつ熱圧着時間は接着剤の重合に必要な熱容
量を確保できる時間に設定する必要がある。More specifically, a thermosetting resin is used for the adhesive such as the anisotropic conductive film and the heat seal connector used for thermocompression bonding, and the thermocompression bonding temperature is equal to or higher than the curing temperature of the adhesive. The thermocompression bonding time needs to be set to a time that can secure the heat capacity required for the polymerization of the adhesive.
【０００８】さらに、熱圧着における加圧力であるが、
プラスチックからなる電極基板の外部接続端子のクラッ
クによる断線という問題があり、加圧力をむやみに大き
くすることができないため、接着強度の強い熱圧着を行
うことは困難である。Further, regarding the pressing force in thermocompression bonding,
There is a problem that the external connection terminals of the plastic electrode substrate are broken due to cracks, and the pressing force cannot be increased unnecessarily. Therefore, it is difficult to perform thermocompression bonding with high adhesive strength.
【０００９】本発明は、以上のような従来の問題点に鑑
みなされたものであって、電極基板と駆動回路基板との
接続部に応力が加わった場合であっても、接続部の剥離
または浮き等の接続不良を発生することがない液晶表示
装置及びその製造方法を提供することを目的としてい
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above-described conventional problems. Even when a stress is applied to a connection portion between an electrode substrate and a drive circuit board, the connection portion may be peeled off or removed. It is an object of the present invention to provide a liquid crystal display device that does not cause a connection failure such as floating and a method of manufacturing the same.
【００１０】[0010]
【課題を解決するための手段】前述した目的を達成する
ために、本発明の請求項１記載の液晶表示装置は、プラ
スチックからなる電極基板の外部接続端子と、駆動回路
基板の接続端子とが、異方性導電膜またはヒートシール
コネクタを介して熱圧着されることによって接続され、
前記電極基板と前記駆動回路基板との接着力が補強され
ている液晶表示装置において、前記電極基板と前記駆動
回路基板とが、溶着されることによって接着力を補強さ
れていることを特徴としている。According to a first aspect of the present invention, there is provided a liquid crystal display device comprising: an external connection terminal of an electrode substrate made of plastic; and a connection terminal of a drive circuit substrate. Connected by thermocompression bonding via an anisotropic conductive film or a heat seal connector,
In a liquid crystal display device in which the adhesive force between the electrode substrate and the drive circuit substrate is reinforced, the adhesive force is reinforced by welding the electrode substrate and the drive circuit substrate. .
【００１１】請求項２記載の液晶表示装置の製造方法
は、プラスチックからなる電極基板の外部接続端子と、
駆動回路基板の接続端子とを、異方性導電膜またはヒー
トシールコネクタを介して熱圧着することによって接続
し、前記電極基板と前記駆動回路基板との接着力を補強
する液晶表示装置の製造方法において、前記電極基板と
前記駆動回路基板とを、超音波を用いて溶着することに
より、接着力を補強することを特徴としている。According to a second aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, comprising: an external connection terminal of an electrode substrate made of plastic;
A method for manufacturing a liquid crystal display device in which connection terminals of a drive circuit board are connected by thermocompression bonding via an anisotropic conductive film or a heat seal connector to reinforce the adhesive force between the electrode board and the drive circuit board Wherein the electrode substrate and the drive circuit substrate are welded by using ultrasonic waves to reinforce the adhesive force.
【００１２】本発明の液晶表示装置によれば、電極基板
と駆動回路基板とが溶着されることによって接着力を補
強されていることにより、熱圧着条件は良好な電気的接
続を得られるようにすればよく、プラスチックからなる
電極基板に適した低温、低圧力及び短時間の熱圧着が可
能となり、電気的接続の信頼性が向上する。According to the liquid crystal display device of the present invention, since the adhesive force is reinforced by welding the electrode substrate and the drive circuit substrate, the thermocompression bonding conditions are such that good electrical connection can be obtained. Then, low-temperature, low-pressure, and short-time thermocompression bonding suitable for an electrode substrate made of plastic can be performed, and the reliability of electrical connection is improved.
【００１３】また、本発明の液晶表示装置の製造方法に
よれば、電極基板と駆動回路基板とを超音波を用いて溶
着することによって接着力を補強することにより、接着
力の補強をピンポイントで行うことができるため、電気
的接続部に悪影響を及ぼすことがなく、熱圧着条件は良
好な電気的接続を得られるようにすればよく、プラスチ
ックからなる電極基板に適した低温、低圧力及び短時間
の熱圧着が可能となり、電気的接続の信頼性が向上す
る。Further, according to the method of manufacturing a liquid crystal display device of the present invention, the adhesive force is reinforced by welding the electrode substrate and the drive circuit substrate by using ultrasonic waves, thereby enhancing the adhesive force. Because it can be performed in, without adversely affecting the electrical connection portion, the thermocompression bonding conditions may be such that a good electrical connection can be obtained, low temperature, low pressure and suitable for the electrode substrate made of plastic Short-time thermocompression bonding becomes possible, and the reliability of electrical connection is improved.
【００１４】[0014]
【発明の実施の形態】図１及び図２を用いて、本発明の
実施の形態について説明する。図１は本発明に係わる液
晶表示装置の製造方法を説明する断面図、図２は本発明
に係わる液晶表示装置を説明する平面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view illustrating a method for manufacturing a liquid crystal display device according to the present invention, and FIG. 2 is a plan view illustrating a liquid crystal display device according to the present invention.
【００１５】図１に示すように、プラスチックからなる
一対の電極基板１に、ＳｉＯX等によるガスバリアコー
ト等を全面に施し、スパッタリング法によってＩＴＯを
成膜して、フォトリソグラフィ法によって表示用透明電
極２及び外部接続端子３を形成する。[0015] As shown in FIG. 1, a pair of electrode substrates 1 made of plastic, subjected to gas barrier coating due SiO X, etc. on the entire surface, a film of ITO by sputtering, a transparent electrode for display by photolithography 2 and external connection terminals 3 are formed.
【００１６】さらに、ポリイミド等からなる配向膜４を
オフセット印刷法またはフレキソ印刷法等によって形成
し、ラビング法等によって配向処理を施して、スペーサ
ー５及びシール材料６を介して一対の電極基板１を貼り
合わせる。Further, an alignment film 4 made of polyimide or the like is formed by an offset printing method or a flexographic printing method, and is subjected to an alignment treatment by a rubbing method or the like, so that the pair of electrode substrates 1 is interposed via a spacer 5 and a sealing material 6. to paste together.
【００１７】そして、液晶表示パネル毎に分断し、液晶
材料７を注入して、偏光板８を貼り付けて液晶表示パネ
ルを得る。Then, the liquid crystal display panel is divided, the liquid crystal material 7 is injected, and the polarizing plate 8 is attached to obtain a liquid crystal display panel.
【００１８】次に、ドライバＬＳＩ９を実装した駆動回
路基板１０の接続端子１１と外部接続端子３とを、熱硬
化性樹脂１２中に導電粒子１３を均一に分散したテープ
状の異方性導電膜１４を介して、圧着ヘッド１５によっ
て熱圧着し、電気的に接続するとともに、電極基板１と
駆動回路基板１０とを接着する。Next, the connection terminals 11 and the external connection terminals 3 of the drive circuit board 10 on which the driver LSI 9 is mounted are replaced with a tape-shaped anisotropic conductive film in which conductive particles 13 are uniformly dispersed in a thermosetting resin 12. The thermocompression bonding is carried out by a crimping head 15 via 14 to electrically connect and bond the electrode substrate 1 and the drive circuit board 10.
【００１９】導電粒子１３としては、金属粒子または樹
脂ビーズに金属メッキした粒子を用いることができ、特
に限定されるものではない。As the conductive particles 13, metal particles or particles obtained by plating metal on resin beads can be used, and are not particularly limited.
【００２０】接続端子１１としては、銅箔をエッチング
してパターンを形成し、金メッキまたは錫メッキを施し
たものを用いることができ、特に限定されるものではな
い。The connection terminals 11 may be formed by etching a copper foil, forming a pattern, and performing gold plating or tin plating, and is not particularly limited.
【００２１】熱圧着条件としては、外部接続端子３と接
続端子１１とを、良好な状態で電気的に接続できる温
度、時間及び加圧力とすればよく、電極基板１と駆動回
路基板１０との接着強度を考慮する必要はない。The conditions for thermocompression bonding may be a temperature, time and pressure at which the external connection terminal 3 and the connection terminal 11 can be electrically connected in a good condition. It is not necessary to consider the adhesive strength.
【００２２】次に、超音波溶着ヘッド１６により、超音
波をあてて電極基板１と駆動回路基板１０とを溶着し、
接着強度を向上させ、液晶表示装置を得る。Next, the electrode substrate 1 and the drive circuit substrate 10 are welded by applying ultrasonic waves by the ultrasonic welding head 16,
A liquid crystal display device is obtained with improved adhesive strength.
【００２３】超音波による溶着部１７は、図２に示すよ
うに、外部接続端子３及び接続端子１１の両端の外側部
分に、ピンポイント的に各１箇所ずつ円形としている
が、電極基板１と駆動回路基板１０との接着強度の向上
に貢献できれば、複数箇所に溶着部１７を設けてもよ
く、その形状は円形以外でもよい。As shown in FIG. 2, the welding portion 17 by ultrasonic waves is formed in a pinpoint circular shape on the outer portions at both ends of the external connection terminal 3 and the connection terminal 11. If it is possible to contribute to the improvement of the adhesive strength with the drive circuit board 10, the welding portion 17 may be provided at a plurality of positions, and the shape may be other than the circular shape.
【００２４】[0024]
【発明の効果】以上の説明のように、本発明の液晶表示
装置によれば、電極基板と駆動回路基板とが溶着される
ことによって接着力を補強されていることにより、熱圧
着条件は良好な電気的接続を得られるようにすればよ
く、プラスチックからなる電極基板に適した低温、低圧
力及び短時間の熱圧着が可能となり、電気的接続の信頼
性が高いプラスチック液晶表示装置を得ることができ
る。As described above, according to the liquid crystal display device of the present invention, the adhesion is reinforced by welding the electrode substrate and the drive circuit substrate, so that the thermocompression bonding conditions are good. It is possible to obtain a plastic liquid crystal display device with high reliability in electrical connection, which enables low-temperature, low-pressure and short-time thermocompression bonding suitable for an electrode substrate made of plastic. Can be.
【００２５】また、本発明の液晶表示装置の製造方法に
よれば、電極基板と駆動回路基板とを超音波を用いて溶
着することによって接着力を補強することにより、接着
力の補強をピンポイントで行うことができるため、電気
的接続部に悪影響を及ぼすことがなく、熱圧着条件は良
好な電気的接続を得られるようにすればよく、プラスチ
ックからなる電極基板に適した低温、低圧力及び短時間
の熱圧着が可能となり、電気的接続の信頼性が高いプラ
スチック液晶表示装置を得ることができる。Further, according to the method of manufacturing a liquid crystal display device of the present invention, the adhesion is strengthened by welding the electrode substrate and the drive circuit substrate by using ultrasonic waves, thereby enhancing the adhesion. Because it can be performed in, without adversely affecting the electrical connection portion, the thermocompression bonding conditions may be such that a good electrical connection can be obtained, low temperature, low pressure and suitable for the electrode substrate made of plastic Thermocompression bonding can be performed in a short time, and a plastic liquid crystal display device having high reliability of electrical connection can be obtained.
【図１】本発明に係わる液晶表示装置の製造方法を説明
する断面図である。FIG. 1 is a cross-sectional view illustrating a method for manufacturing a liquid crystal display device according to the present invention.
【図２】本発明に係わる液晶表示装置を説明する平面図
である。FIG. 2 is a plan view illustrating a liquid crystal display device according to the present invention.
１ 電極基板 ２ 表示用透明電極 ３ 外部接続端子 ４ 配向膜 ５ スペーサー ６ シール材料 ７ 液晶材料 ８ 偏光板 ９ ドライバＬＳＩ １０ 駆動回路基板 １１ 接続端子 １２ 熱硬化性樹脂 １３ 導電粒子 １４ 異方性導電膜 １５ 圧着ヘッド １６ 超音波溶着ヘッド １７ 溶着部 REFERENCE SIGNS LIST 1 electrode substrate 2 display transparent electrode 3 external connection terminal 4 alignment film 5 spacer 6 sealing material 7 liquid crystal material 8 polarizing plate 9 driver LSI 10 drive circuit board 11 connection terminal 12 thermosetting resin 13 conductive particles 14 anisotropic conductive film 15 Crimping head 16 Ultrasonic welding head 17 Welding part
Claims (2)
続端子と、駆動回路基板の接続端子とが、異方性導電膜
またはヒートシールコネクタを介して熱圧着されること
によって接続され、前記電極基板と前記駆動回路基板と
の接着力が補強されている液晶表示装置において、前記
電極基板と前記駆動回路基板とが、溶着されることによ
って接着力を補強されていることを特徴とする液晶表示
装置。An external connection terminal of an electrode substrate made of plastic and a connection terminal of a drive circuit substrate are connected by thermocompression bonding via an anisotropic conductive film or a heat seal connector, and are connected to the electrode substrate. A liquid crystal display device in which the adhesive strength with the drive circuit board is reinforced, wherein the electrode board and the drive circuit board are reinforced by welding.
続端子と、駆動回路基板の接続端子とを、異方性導電膜
またはヒートシールコネクタを介して熱圧着することに
よって接続し、前記電極基板と前記駆動回路基板との接
着力を補強する液晶表示装置の製造方法において、前記
電極基板と前記駆動回路基板とを、超音波を用いて溶着
することにより、接着力を補強することを特徴とする液
晶表示装置の製造方法。2. An external connection terminal of an electrode substrate made of plastic and a connection terminal of a drive circuit board are connected by thermocompression bonding via an anisotropic conductive film or a heat seal connector. In a method of manufacturing a liquid crystal display device that reinforces an adhesive force with a drive circuit board, the liquid crystal display device is characterized in that the electrode substrate and the drive circuit board are welded using ultrasonic waves to reinforce the adhesive force. A method for manufacturing a display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28352296A JP3349365B2 (en) | 1996-10-25 | 1996-10-25 | Liquid crystal display device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28352296A JP3349365B2 (en) | 1996-10-25 | 1996-10-25 | Liquid crystal display device and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10123557A JPH10123557A (en) | 1998-05-15 |
| JP3349365B2 true JP3349365B2 (en) | 2002-11-25 |
Family
ID=17666632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28352296A Expired - Fee Related JP3349365B2 (en) | 1996-10-25 | 1996-10-25 | Liquid crystal display device and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3349365B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100808419B1 (en) | 2007-07-27 | 2008-03-06 | 실리콘 디스플레이 (주) | Tab bonding method |
| JP6726070B2 (en) | 2016-09-28 | 2020-07-22 | エルジー ディスプレイ カンパニー リミテッド | Electronic component mounting method, electronic component joining structure, substrate device, display device, display system |
| JP6956475B2 (en) | 2016-09-28 | 2021-11-02 | エルジー ディスプレイ カンパニー リミテッド | Electronic component mounting method, electronic component bonding structure, board equipment, display equipment, display system |
-
1996
- 1996-10-25 JP JP28352296A patent/JP3349365B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10123557A (en) | 1998-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3792554B2 (en) | Display module and flexible wiring board connection method | |
| JP2003133677A (en) | Pressure-contacting structure of flexible circuit board | |
| JP2000002882A (en) | Liquid crystal display device and its manufacture | |
| EP0662256B1 (en) | An electrical connecting structure and a method for electrically connecting terminals to each other | |
| JP3491415B2 (en) | Manufacturing method of liquid crystal display device | |
| JPH0645024A (en) | Anisotropic conductive adhesive film | |
| JP2008015403A (en) | Flexible wiring sheet, and flat panel display device provided with the same and manufacturing method therefor | |
| JPH09281520A (en) | Method for connecting circuit board, liquid crystal display device and electronic apparatus | |
| JP3349365B2 (en) | Liquid crystal display device and method of manufacturing the same | |
| JP2002063958A (en) | Electro-optical device and electronic equipment | |
| JPH02127620A (en) | Electrooptic device and its connecting method | |
| JPH058831B2 (en) | ||
| JP3256659B2 (en) | Anisotropic conductive thin film and method for connecting polymer substrate using the anisotropic conductive thin film | |
| JPH10319419A (en) | Liquid crystal display device | |
| JPH1082993A (en) | Liquid crystal display device | |
| JPS63299242A (en) | Connection of semiconductor device | |
| JPH0618909A (en) | Flexible circuit board with electric conductive anisotropic film | |
| JP3100436B2 (en) | Anisotropic conductive film | |
| JPH09191026A (en) | Liquid crystal display | |
| JP2000047244A (en) | Liquid crystal device and its production | |
| JP2001125127A (en) | Liquid crystal device and connecting method therefor | |
| JPH04264525A (en) | Liquid crystal display device | |
| JPH0661642A (en) | Jointing method for flexible resin board | |
| JPH03184023A (en) | Joint structure of liquid crystal panel and joining method thereof | |
| JP2002341369A (en) | Liquid crystal display device and its manufacturing method and electrode wiring substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080913 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080913 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20090913 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20090913 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100913 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20110913 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20120913 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20130913 |
|
| LAPS | Cancellation because of no payment of annual fees |