JPH09121078A - Electrical connection structure and liquid crystal device - Google Patents
Electrical connection structure and liquid crystal deviceInfo
- Publication number
- JPH09121078A JPH09121078A JP26609596A JP26609596A JPH09121078A JP H09121078 A JPH09121078 A JP H09121078A JP 26609596 A JP26609596 A JP 26609596A JP 26609596 A JP26609596 A JP 26609596A JP H09121078 A JPH09121078 A JP H09121078A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- liquid crystal
- connection
- dummy
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は特に高密度、多端子
のLCDパネル実装等に利用するフレキシブルプリント
基板(以下FPCと略す)及び液晶表示装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board (hereinafter abbreviated as "FPC") and a liquid crystal display device used for mounting a high-density, multi-terminal LCD panel.
【0002】[0002]
【従来の技術】従来、FPCの接続端子群は液晶パネル
の外部回路との接続用の端子取出部と相対向して形成さ
れ、電気的接続がなされていた。2. Description of the Related Art Conventionally, a group of connection terminals of an FPC is formed so as to face a terminal extraction portion for connection to an external circuit of a liquid crystal panel, and electrical connection is made.
【0003】[0003]
【発明が解決しようとする課題】従来のFPCは全端子
が有効接続端子として使用されていたため、FPCのベ
ースフィルムと例えばガラス基板の熱膨張係数の違いに
よる応力が生じた場合、最外端の接続端子が断線を起こ
し、即座に欠陥を引き起こしてしまう欠点があった。そ
こで、本発明では応力等による断線を防止し、接続信頼
性の高いFPC及び液晶表示装置を得ることを目的とし
ている。In the conventional FPC, all terminals are used as effective connection terminals. Therefore, when a stress is generated due to a difference in thermal expansion coefficient between the base film of the FPC and, for example, a glass substrate, the outermost end of the FPC is not used. There is a drawback that the connection terminal is disconnected and causes a defect immediately. Therefore, an object of the present invention is to prevent disconnection due to stress or the like and obtain an FPC and a liquid crystal display device with high connection reliability.
【0004】[0004]
【課題を解決するための手段】本発明のFPCは、接続
端子群の外側両端部に電気的接続には関与しない補強部
材を配置したことを特徴とする。The FPC of the present invention is characterized in that reinforcing members which are not involved in electrical connection are arranged at both outer ends of the connection terminal group.
【0005】本発明の液晶表示装置は、FPCの接続端
子群及び前記補強部材と液晶パネルの外部回路との接続
用の端子取出部とを異方性導電膜を介して電気的接続さ
れてなることを特徴とする。In the liquid crystal display device of the present invention, the connection terminal group of the FPC and the terminal lead-out portion for connecting the reinforcing member and the external circuit of the liquid crystal panel are electrically connected via the anisotropic conductive film. It is characterized by
【0006】[0006]
〔実施例〕本発明を図面に基づいて説明すると図1はF
PCベースフィルム側からみたものであり、図2はその
断面図である。1は液晶パネル端子取出部、2は異方性
導電膜、3はベースフィルム、4は有効接続端子、5は
ダミー端子である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings.
FIG. 2 is a cross-sectional view as viewed from the PC base film side. Reference numeral 1 denotes a liquid crystal panel terminal extraction portion, 2 denotes an anisotropic conductive film, 3 denotes a base film, 4 denotes an effective connection terminal, and 5 denotes a dummy terminal.
【0007】このようにダミー端子5を設けた場合に
は、ベースフィルム3と液晶パネル端子取出部の熱膨張
係数の違いによりせん断応力が生じても、最外端のダミ
ー端子5に負荷がかかり内側の有効接続端子4には負荷
がかからない。また、補強部材であるダミー端子を有効
接続端子と同一材質としたことにより、工程を増やすこ
となく容易に補強ができる。その上、材質の違いによる
ストレスの影響を最小にできるという効果を有してい
る。When the dummy terminals 5 are provided in this manner, even if a shear stress is generated due to a difference in the thermal expansion coefficient between the base film 3 and the liquid crystal panel terminal extraction portion, a load is applied to the outermost dummy terminals 5. No load is applied to the inner effective connection terminal 4. Further, since the dummy terminal as the reinforcing member is made of the same material as the effective connection terminal, the reinforcement can be easily performed without increasing the number of steps. In addition, it has the effect of minimizing the effect of stress due to differences in materials.
【0008】図3は圧着時における効果を説明する図で
あり、ヒーターヘッド6により熱圧着される状態を示し
ている。ヒーターヘッド6の平坦度が理論的平面で平行
に押された場合には、端部、中央部共に同一であると考
えられるが、ヒーターヘッド6が熱変形で凹面となる場
合では端部端子に応力が集中して電気的安定接続を難し
くする。このような場合でもダミー端子5a,5b,5
cが存在すれば内部の有効接続端子4は電気的安定接続
を保てる。したがって、有効接続端子部の外側両端部も
中心部と同じような接続が可能になり、有効接続端子部
の全面において圧着均一性が増大するという効果を有す
る。FIG. 3 is a view for explaining the effect at the time of pressure bonding, and shows a state in which the pressure bonding is performed by the heater head 6. When the flatness of the heater head 6 is pressed in parallel on the theoretical plane, it is considered that both ends and the center are the same. However, when the heater head 6 is concave due to thermal deformation, it is connected to the end terminal. Stress concentrates and makes electrical stable connection difficult. Even in such a case, the dummy terminals 5a, 5b, 5
If c exists, the internal effective connection terminal 4 can maintain an electrically stable connection. Therefore, the outer ends of the effective connection terminal can be connected in the same manner as the center, and the uniformity of crimping can be increased over the entire surface of the effective connection terminal.
【0009】図4はダミー端子5a,5b,5cの代わ
りにFPC上のレジスト材7で同様の機能を持たせたも
のである。FIG. 4 shows a structure in which a resist material 7 on an FPC has a similar function in place of the dummy terminals 5a, 5b and 5c.
【0010】図5の実装構造はLSIチップ8をAn−
Sn共晶等でFPCに接続し、有効接続端子4と液晶パ
ネルの端子取出部1とを異方性導電膜2を介して電気的
接続を行った構造である。The mounting structure shown in FIG.
The structure is such that the connection is made to the FPC with Sn eutectic or the like, and the effective connection terminal 4 and the terminal extraction portion 1 of the liquid crystal panel are electrically connected via the anisotropic conductive film 2.
【0011】図6の実装構造は図5での方法を更に高密
度にした方法であり、液晶パネル端子取出部1上にLS
Iチップ8を搭載したFPCを異方性導電膜を介して電
気的接続を行った構造である。The mounting structure shown in FIG. 6 is a method in which the method shown in FIG.
This is a structure in which an FPC on which the I chip 8 is mounted is electrically connected via an anisotropic conductive film.
【0012】図5、図6の実装構造は多端子、多チップ
で1台の製品となるため、接続端子の外側両端部の安定
接続により累乗的に歩留まりが良くなることになる。Since the mounting structure shown in FIGS. 5 and 6 constitutes one product with multiple terminals and multiple chips, the yield is improved by a power by the stable connection of the outer ends of the connection terminals.
【0013】[0013]
【発明の効果】以上説明したようにFPCの接続端子群
の外側両端部に補強部材を配置したことにより、外側両
端部のストレス等による断線を防止し、接続信頼性の高
い表示装置が得られる。また、有効接続端子部の外側両
端部も中心部と同じような接続が可能であり、均一な接
続強度を有し、有効接続端子部の全面において圧着均一
性が増大するという効果を有している。As described above, by arranging reinforcing members at both outer ends of the connection terminal group of the FPC, disconnection due to stress or the like at the outer both ends is prevented, and a display device with high connection reliability can be obtained. . Further, both outer ends of the effective connection terminal portion can be connected in the same manner as the central portion, and have a uniform connection strength, and have an effect of increasing the pressure bonding uniformity on the entire surface of the effective connection terminal portion. There is.
【0014】したがって、FPCを大型化、多端子化し
た時等に生じる熱膨張係数の違いによる応力による不良
を低減できる。また、機械的剥離力に対しても強く、信
頼性の高い電気的接続が可能である。Therefore, it is possible to reduce defects due to stress caused by a difference in thermal expansion coefficient when the FPC is enlarged and the number of terminals is increased. Further, it is strong against mechanical peeling force, and highly reliable electrical connection is possible.
【図1】 本発明のベースフィルム側から見た図。FIG. 1 is a view of the present invention as viewed from a base film side.
【図2】 本発明の実施例の断面図。FIG. 2 is a sectional view of an embodiment of the present invention.
【図3】 本発明の圧着工程図。FIG. 3 is a pressure-bonding process diagram of the present invention.
【図4】 本発明のダミー端子5をレジスト材7に置き
換えた図。FIG. 4 is a diagram in which a dummy terminal 5 of the present invention is replaced with a resist material 7;
【図5】 本発明の他の実施例を示す図。FIG. 5 is a view showing another embodiment of the present invention.
【図6】 本発明の他の実施例を示す図。FIG. 6 is a diagram showing another embodiment of the present invention.
1.液晶パネル端子取出部 2.異方性導電膜 3.ベースフィルム 4.有効接続端子 5.ダミー端子 6.ヒーターヘッド 7.レジスト材 8.LSIチップ 1. LCD panel terminal extraction section 2. 2. Anisotropic conductive film Base film 4. Effective connection terminal 5. Dummy terminal 6. Heater head 7. Resist material 8. LSI chip
─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成8年11月6日[Submission date] November 6, 1996
【手続補正1】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の名称[Correction target item name] Name of invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【発明の名称】電気的接続構造及び液晶装置 Title: Electrical connection structure and liquid crystal device
【手続補正2】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
【手続補正3】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0001[Correction target item name] 0001
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【0001】[0001]
【発明の属する技術分野】本発明は、接続端子群の外側
両端部に電気的な接続には関与しないダミーパターンを
配置したフレキシブルプリント基板と、導電パターン形
成されたがガラス等の部材からなる基板との電気的接続
構造に関する。さらに詳しくは、該基板ともう一枚の基
板とを相対向させて液晶セルを形成した液晶装置に関す
る。 TECHNICAL FIELD The present invention relates to an outer side of a connecting terminal group.
Dummy patterns not involved in electrical connection at both ends
Arranged flexible printed circuit board and conductive pattern type
Electrical connection with a substrate made of glass or other material
Regarding the structure. More specifically, the substrate and another substrate
The present invention relates to a liquid crystal device in which a plate and a plate face each other to form a liquid crystal cell.
You.
【手続補正4】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0004[Correction target item name] 0004
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【0004】[0004]
【課題を解決するための手段】本発明の電気的接続構造
は、端子部を有するガラス基板と、導電パターンとを有
するフレキシブルプリント基板とを対向させ異方性導電
膜を介して電気的接続してなる電気的接続構造であっ
て、前記導電パターンと前記フレキシブルプリント基板
との電気的接続に関与しないダミーパターンが前記フレ
キシブルプリント基板における前記導電パターンの両方
の外側にそれぞれ複数個配置され、前記異方性導膜を介
して前記ガラス基板と対向されたことを特徴とする。ま
た、本発明の液晶装置は少なくとも一方の面の所定領域
に導電パターンが形成された第1の基板と、前記第1の
基板の所定領域以外の領域に相対向するように配置され
た第2の基板と、前記導電パターンと電気的接続するた
めの端子部及び前記第1の基板との接着強度を高めるた
めに前記端子部の両方の外側に複数個形成されたダミー
パターンを具備し異方性導電膜を介して前記第1の基板
と電気的接続がなされたフレキシブルプリント基板と、
を有することを特徴とする。 An electrical connection structure of the present invention
Has a glass substrate having a terminal portion and a conductive pattern.
Anisotropic conductivity by facing the flexible printed circuit board
It is an electrical connection structure that is electrically connected through a film.
The conductive pattern and the flexible printed circuit board.
The dummy pattern that is not involved in the electrical connection with
Both of the conductive patterns in the kisible printed circuit board
A plurality of films are arranged on the outside of each of the
And is opposed to the glass substrate. Ma
Further, the liquid crystal device of the present invention has a predetermined area on at least one surface.
A first substrate on which a conductive pattern is formed, and the first substrate
It is arranged so as to face the area other than the predetermined area of the substrate.
The second substrate is electrically connected to the conductive pattern.
For increasing the adhesive strength between the terminal part for the
A plurality of dummies formed on both outer sides of the terminal portion for
The first substrate having a pattern and having an anisotropic conductive film interposed therebetween.
A flexible printed circuit board electrically connected to the
It is characterized by having.
【手続補正5】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0013[Correction target item name] 0013
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【0013】[0013]
【発明の効果】以上説明したように本発明によれば、端
子部外側端部のストレス等による断線を防止し、接続信
頼性の高い電気的接続構造が得られる。また端子部の外
側両端部も中心部と同じように接続が可能であり、よっ
て均一な接続強度を有し、端子部の全面において圧着均
一性が増大するという効果を有している。さらには、端
子部の両端部に複数づつダミーパターンを設けたので、
もっとも剥離しやすい一番外側のダミーパターンが剥離
した場合においても、他のダミーパターンとガラス基板
の接着によって、ガラス基板の端子部とフレキシブルプ
リント基板の端子部との電気的接続の強度が維持でき
る。 As described above, according to the present invention, the end
Prevents disconnection due to stress on the outer edge of the child part, and
A highly reliable electrical connection structure can be obtained. Also, outside the terminals
Both ends can be connected in the same way as the center part.
Has a uniform connection strength and is crimped evenly over the entire surface of the terminal.
It has the effect of increasing unity. Furthermore, the edge
Since a plurality of dummy patterns are provided at both ends of the child part,
The outermost dummy pattern that is most easily peeled off
Even if you do, other dummy patterns and glass substrate
By bonding the
The strength of the electrical connection with the terminals of the lint board can be maintained.
You.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 H05K 7/02 H05K 7/02 J ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Office reference number FI technical display location H05K 7/02 H05K 7/02 J
Claims (4)
関与しない補強部材を配置したことを特徴とするフレキ
シブルプリント基板。1. A flexible printed circuit board, wherein reinforcing members not involved in electrical connection are arranged at both outer ends of a connection terminal group.
あることを特徴とする請求項1記載のフレキシブルプリ
ント基板。2. The flexible printed circuit board according to claim 1, wherein said reinforcing member is made of the same material as said connection terminal.
特徴とする請求項1記載のフレキシブルプリント基板。3. The flexible printed circuit board according to claim 1, wherein said reinforcing member is made of a resist material.
の接続端子群及び前記補強部材と液晶パネルの外部回路
との接続用の端子取出部とが異方性導電膜を介して電気
的接続されてなることを特徴とする液晶表示装置。4. A connection terminal group of the flexible printed circuit board according to claim 1, wherein said reinforcing member and a terminal extraction portion for connection to an external circuit of a liquid crystal panel are electrically connected via an anisotropic conductive film. A liquid crystal display device comprising:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8266095A JP2845219B2 (en) | 1996-10-07 | 1996-10-07 | Electrical connection structure and liquid crystal device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8266095A JP2845219B2 (en) | 1996-10-07 | 1996-10-07 | Electrical connection structure and liquid crystal device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7315649A Division JP2630314B2 (en) | 1995-12-04 | 1995-12-04 | Liquid crystal device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9294042A Division JP2940532B2 (en) | 1997-10-27 | 1997-10-27 | Electrical connection structure and liquid crystal device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09121078A true JPH09121078A (en) | 1997-05-06 |
JP2845219B2 JP2845219B2 (en) | 1999-01-13 |
Family
ID=17426257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8266095A Expired - Lifetime JP2845219B2 (en) | 1996-10-07 | 1996-10-07 | Electrical connection structure and liquid crystal device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2845219B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0954020A2 (en) * | 1998-04-21 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Flip chip bonding lands |
KR100504306B1 (en) * | 2001-11-08 | 2005-07-28 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100521260B1 (en) * | 1998-06-22 | 2005-12-29 | 삼성전자주식회사 | Circuit connection device and flexible printed circuit board comprising the same |
JP2007335434A (en) * | 2006-06-12 | 2007-12-27 | Nec Corp | Flexible wiring board, method for repairing disconnection thereof and circuit board |
KR100920354B1 (en) * | 2003-03-03 | 2009-10-07 | 삼성전자주식회사 | Thin film transistor array panel |
JP2013045956A (en) * | 2011-08-25 | 2013-03-04 | Kyocera Corp | Wiring board and input device |
EP3328171A1 (en) * | 2016-11-23 | 2018-05-30 | G-Smatt Co., Ltd. | Durable flexible circuit board for transparent display board and assembling method thereof |
-
1996
- 1996-10-07 JP JP8266095A patent/JP2845219B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0954020A2 (en) * | 1998-04-21 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Flip chip bonding lands |
EP0954020A3 (en) * | 1998-04-21 | 2000-12-27 | Matsushita Electric Industrial Co., Ltd. | Flip chip bonding lands |
KR100521260B1 (en) * | 1998-06-22 | 2005-12-29 | 삼성전자주식회사 | Circuit connection device and flexible printed circuit board comprising the same |
KR100504306B1 (en) * | 2001-11-08 | 2005-07-28 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
KR100920354B1 (en) * | 2003-03-03 | 2009-10-07 | 삼성전자주식회사 | Thin film transistor array panel |
JP2007335434A (en) * | 2006-06-12 | 2007-12-27 | Nec Corp | Flexible wiring board, method for repairing disconnection thereof and circuit board |
JP2013045956A (en) * | 2011-08-25 | 2013-03-04 | Kyocera Corp | Wiring board and input device |
EP3328171A1 (en) * | 2016-11-23 | 2018-05-30 | G-Smatt Co., Ltd. | Durable flexible circuit board for transparent display board and assembling method thereof |
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