JPS63299065A - Connecting method for electronic component - Google Patents
Connecting method for electronic componentInfo
- Publication number
- JPS63299065A JPS63299065A JP62131807A JP13180787A JPS63299065A JP S63299065 A JPS63299065 A JP S63299065A JP 62131807 A JP62131807 A JP 62131807A JP 13180787 A JP13180787 A JP 13180787A JP S63299065 A JPS63299065 A JP S63299065A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- connection sections
- electronic components
- electronic component
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的] (産業上の利用分野) 本発明は電子部品の接続方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method for connecting electronic components.
(従来の技術)
カード電卓、あるいはICカードやメモリカードと呼ば
れている携帯型情報媒は、それらを構成している電子部
品がフィルム化あるいは微少化されているため、接着に
よって組立てられている。(Prior Art) Portable information media called card calculators, IC cards, and memory cards are assembled by adhesive because the electronic components that make up them are made into films or miniaturized. .
たとえば、メモリカード等の電子機器の接着について第
2図にて説明する。すなわち、第一の電子部品であるプ
リント基板(1)には第一の接続部である端子(2)が
所定ピッチで複数個形成され、また、第二の電子部品で
ある液晶表示板(3)側には上記端子(2)と同ピツチ
になり第二の接続部である電極(4)が同数形成されて
いて、これら端子(2)と電極(4)とを対峙させた状
態で、接着剤の一種である異方性導電膜(5)を介在さ
せた後、熱圧着して異方性導電膜(5)に分散されてい
る導電粒子を端子(2)と電極(4)に接触させ、両者
を導電的に接続している。For example, bonding of electronic devices such as memory cards will be explained with reference to FIG. That is, a plurality of terminals (2), which are first connection parts, are formed at a predetermined pitch on a printed circuit board (1), which is a first electronic component, and a liquid crystal display board (3), which is a second electronic component, is formed on a printed circuit board (1), which is a first electronic component. ) side is formed with the same number of electrodes (4) that are the same pitch as the terminals (2) and are second connection parts, and with these terminals (2) and electrodes (4) facing each other, After interposing the anisotropic conductive film (5), which is a type of adhesive, the conductive particles dispersed in the anisotropic conductive film (5) are bonded by thermocompression to the terminals (2) and electrodes (4). The two are electrically conductively connected.
(発明が解決すべき問題点)
熱圧着後の接着断面をみると、同じく第2図に示すよう
に、接続されている端子(2)と電極(4)の両端側近
傍の接着状態が、他に比べてプリント基板(1)、液晶
表示板(3)に十分に接着されない接着不良領域が生じ
、上記両端側近傍の端子(2a)、(2b)と電極(4
a) 、 (4b)との接続不良を生じる原因となって
いた。このような事情に鑑み、本発明は端子、電極等の
接続部を均一に接続する方法を提供することを目的とす
る。(Problems to be Solved by the Invention) Looking at the adhesive cross section after thermocompression bonding, as also shown in Figure 2, the adhesive state near both ends of the connected terminal (2) and electrode (4) is as follows. Compared to other areas, there are areas with poor adhesion where the printed circuit board (1) and liquid crystal display board (3) are not sufficiently bonded, and the terminals (2a) and (2b) near both ends and the electrode (4)
a) and (4b) caused connection failure. In view of these circumstances, an object of the present invention is to provide a method for uniformly connecting connection parts such as terminals and electrodes.
[発明の構成]
(問題点の解決するための手段と作用)互いに所定ピッ
チでかつ突出して複数個形成された第一の接続部とこの
第一の接続部の両端側に突出して形成された一以上の予
備接続分を有する第一の電子部品と、上記第一の接続部
に対応して形成された第二の接続部を有する第二の電子
部品との接続に際し異方性導電膜を上記予備接続分を含
む第一の接続部と第二の接続部間に介在させて接続し、
電気的機能を必要とする本来の接続部の接着状態を均等
にしたものである。[Structure of the invention] (Means and effects for solving the problem) A plurality of first connecting portions are formed protruding from each other at a predetermined pitch, and a plurality of first connecting portions are formed protruding from both ends of the first connecting portion. An anisotropic conductive film is used when connecting a first electronic component having one or more preliminary connections and a second electronic component having a second connection portion formed corresponding to the first connection portion. Connected by intervening between the first connection part and the second connection part including the preliminary connection part,
The adhesive condition of the original connection parts that require electrical function is made uniform.
(実施例) 以下、実施例を示す図面に基づいて本発明を説明する。(Example) EMBODIMENT OF THE INVENTION Hereinafter, this invention will be explained based on drawing which shows an Example.
なお、第2図と共通する部分には同一符号を付しである
。すなわち、第一の実施例を示す第1図において、第2
図に示す従来例と異なる点は、プリント基板(1)の端
子(2)の両端側に、例えば−個ずつ端子(2)の数に
対して余分に電気的に全く寄与しない予備端子(2c)
(2d)を形成して接続した点゛にある。このような
端子の形成で、熱圧着時には不良領域(6)が予備端子
(2c) (2b)の近傍に移り、電極(4a) (4
b)と接続している端子(2a)(2b)は他の端子と
の接着状態と同じになる。Note that parts common to those in FIG. 2 are given the same reference numerals. That is, in FIG. 1 showing the first embodiment, the second
The difference from the conventional example shown in the figure is that, on both ends of the terminals (2) of the printed circuit board (1), there are extra terminals (2c )
It is located at the point where (2d) is formed and connected. By forming such a terminal, the defective area (6) moves to the vicinity of the spare terminal (2c) (2b) during thermocompression bonding, and the electrode (4a) (4
The terminals (2a) and (2b) connected to b) are in the same adhesive state as the other terminals.
なお、上記実施例では両端に形成した余分な端子はいず
れも一個であったが、二個以上形成してもよい。さらに
、プリント基板どうしの電極と端子の接続に適用しても
よい。また、予備端子のような予備接続分は端子ばかり
でなく、突出した形状の電極であれば、電極どうしの接
続にも適用される。予備接続分は本来の接続部と同形状
のほうが好ましいが、若干大きくても小さくてもよい。In the above embodiment, only one extra terminal was formed at both ends, but two or more terminals may be formed. Furthermore, it may be applied to connecting electrodes and terminals between printed circuit boards. Further, preliminary connections such as preliminary terminals are not limited to terminals, but can also be applied to connections between electrodes as long as the electrodes have a protruding shape. It is preferable that the preliminary connection has the same shape as the original connection, but it may be slightly larger or smaller.
[発明の効果]
本来の接続部の両側にダミーとしての役割をなす予備接
続分を設けることで9本来の電気的機能を必要とする接
続部の接着状態を均一にすることができ、接続部どうし
の接続不良を防止することができた。[Effect of the invention] By providing preliminary connections that serve as dummy on both sides of the original connection, it is possible to make the adhesion state of the connection parts that require the original electrical function uniform, and the connection part We were able to prevent poor connections between the two.
第1図は本発明の一実施例を示す断面図、第2図は従来
例を示す断面図である。
(1,、) ・・・プリント基板(一方の電子部品)(
2) (2a) (2b)・・・端子(第一の接続部)
(3)・・φ液晶表示板(第二の電子部品)(4) (
4a) (4b) ・・・電極(第二の接続部)(4c
) (4d) ・・・予備端子(予備接続分)(5)
・・・異方性導電膜FIG. 1 is a sectional view showing one embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional example. (1,,) ...Printed circuit board (one electronic component) (
2) (2a) (2b)...Terminal (first connection part)
(3)...φLCD display board (second electronic component) (4) (
4a) (4b) ... Electrode (second connection part) (4c
) (4d) ... Spare terminal (spare connection) (5)
...Anisotropic conductive film
Claims (5)
た第一の接続部とこの第一の接続部の両端側に突出して
形成された一以上の予備接続部を有する第一の電子部品
と、上記第一の接続部に対応して形成された第二の接続
部を有する第二の電子部品との接続に際し異方性導電膜
を上記予備接続分を含む第一の接続部と第二の接続部間
に介在させて接続する電子部品の接続方法。(1) A first electronic component having a plurality of protruding first connecting portions formed at a predetermined pitch and one or more preliminary connecting portions protruding from both ends of the first connecting portion; , when connecting to a second electronic component having a second connection part formed corresponding to the first connection part, an anisotropic conductive film is applied to the first connection part including the preliminary connection part and the second connection part. A method of connecting electronic components by interposing them between the connecting parts of the
になることを特徴とする特許請求の範囲第1項記載の電
子部品の接続方法。(2) The method for connecting electronic components according to claim 1, wherein the electronic components to be connected are a printed circuit board and a liquid crystal display panel.
ことを特徴とする特許請求の範囲第1項記載の電子部品
の接続方法。(3) The method for connecting electronic components according to claim 1, wherein the electronic components to be connected are printed circuit boards.
形状になることを特徴とする特許請求の範囲第1項記載
の電子部品の接続方法。(4) The method for connecting electronic components according to claim 1, wherein the preliminary connection portion has the same shape as the protruding connection portion.
の接続部の両端側に第一の電子部品側の予備接続部に対
応した予備接続部を有し予備接続部どうしが接続された
ことを特徴とする特許請求の範囲第一項記載の電子部品
の接続方法。(5) When the second connection part is formed to protrude, there are spare connection parts on both ends of the second connection part that correspond to the preliminary connection parts on the first electronic component side, and the preliminary connection parts are connected to each other. A method for connecting electronic components according to claim 1, wherein the electronic components are connected.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62131807A JPS63299065A (en) | 1987-05-29 | 1987-05-29 | Connecting method for electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62131807A JPS63299065A (en) | 1987-05-29 | 1987-05-29 | Connecting method for electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63299065A true JPS63299065A (en) | 1988-12-06 |
Family
ID=15066569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62131807A Pending JPS63299065A (en) | 1987-05-29 | 1987-05-29 | Connecting method for electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63299065A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0349959A2 (en) * | 1988-07-03 | 1990-01-10 | Canon Kabushiki Kaisha | Ink jet recording apparatus |
EP0442706A2 (en) * | 1990-02-13 | 1991-08-21 | Canon Kabushiki Kaisha | Electrically conductive sheet, recording head using the same and recording apparatus |
US5798780A (en) * | 1988-07-03 | 1998-08-25 | Canon Kabushiki Kaisha | Recording element driving unit having extra driving element to facilitate assembly and apparatus using same |
-
1987
- 1987-05-29 JP JP62131807A patent/JPS63299065A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0349959A2 (en) * | 1988-07-03 | 1990-01-10 | Canon Kabushiki Kaisha | Ink jet recording apparatus |
US5798780A (en) * | 1988-07-03 | 1998-08-25 | Canon Kabushiki Kaisha | Recording element driving unit having extra driving element to facilitate assembly and apparatus using same |
EP0442706A2 (en) * | 1990-02-13 | 1991-08-21 | Canon Kabushiki Kaisha | Electrically conductive sheet, recording head using the same and recording apparatus |
US5420620A (en) * | 1990-02-13 | 1995-05-30 | Canon Kabushiki Kaisha | Recording apparatus having a recording head using an electrically conductive sheet |
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