JPS5917533B2 - IC chip molding method and solid molding agent - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for molding an IC using a tape carrier mounting method, in which a solid molding agent has a recess and a through hole surrounding the IC.

An object of the present invention is to provide a molding method that can mold an IC thinly.

Hereinafter, the present invention will be explained in detail. , As an IC molding method in the conventional tape carrier mounting method,
There is a method of molding an IC with a solid molding agent.

Generally, this method involves placing a solid molding agent on a polyimide film as a flexible tape, liquefying it in a furnace, and molding it on the IC in two parts, one direction each on the active side and the back side. It is taken.

The product after molding has curved protrusions on the active side and back side of the IC, but the thickness limit of these protrusions is determined by the design dimensions when mounting on a wristwatch or the like. Therefore, by stably molding the protrusions to a thinner thickness, wristwatches and the like can be made thinner and smaller. The conventional method of thinly molding an IC using a flat plate-shaped solid molding agent without through holes is to use a molding agent with good fluidity when the solid molding agent is liquefied, or to reduce the amount of solid molding agent. This is the way to do it.

If a molding agent with good fluidity is used, the molding agent will flow out from the gaps between each lead terminal during the first molding, so a molding agent with high viscosity that will not flow out from the gaps between each lead terminal is required. It is. In addition, the method of reducing the amount of solid molding agent uses a molding agent with poor flowability that does not flow out from the gaps between each lead terminal, which causes problems such as the molding agent not flowing to the side of the IC, resulting in a thinner It is difficult to mold. The present invention eliminates such drawbacks, and examples thereof are shown in FIGS. 1, 2, 3, 4, 5, 6, and 7.

FIG. 1 is a plan view showing a state in which lead terminals 3 protruding from polyimide tape 2 and ICl are bonded, and FIG. 2 is a front sectional view thereof.

Figures 3 and 4 show solid molding agent 6 used in the present invention.
is presented. FIG. 3 is a plan view and FIG. 4 is a front sectional view thereof, in which a recess 4 and a through hole 5 surrounding the IC are formed in the solid molding agent 6. An embodiment of the IC molding method of the present invention includes a recess 4 surrounding the ICl, as shown in FIG.
A solid molding agent 6 having a through hole 5 is added to the 1C1,
When the solid molding agent 6 is placed on the polyimide tape 2 using the recess 4 as a guide, the end surface 7 of the solid molding agent 6 is placed in contact with the polyimide tape 2, and in this state, the solid molding agent is heated and melted in a furnace. Then, it is cured and molded. Note that the depth of the recess 4 of the solid molding agent 5 is set to a sufficient depth so that the end surface 7 can come into contact with the upper surface of the tape. According to this configuration, the solid molding agent 6 can be easily positioned by the recessed portion of the solid molding agent 6, and the amount of molding agent flowing toward the back side or the front side of the IC can be controlled depending on the size of the through hole. It can be adjusted and the thickness of the protrusion can be reliably reduced. Further, the feature of this embodiment is that when the end surface 7 of the solid molding agent 6 is covered with ICl and further placed on the polyimide tape 2, the end surface 7 contacts the polyimide tape 2 and is not molded. Is Rukoto.

At this time, the gap between the active surface 1a of the ICl and the upper surface 4a of the recess 4 can be selected depending on the ICl lead terminal, molding conditions, etc. Whether or not the polyimide tape 2 and the bottom surface 7 of the solid molding agent 6 are in contact with each other can be an important point in reliably molding around the ICl. In other words, when molding, multiple pieces are simultaneously heated and melted in a furnace rather than by local heating, so if the bottom surface 7 of the solid molding agent 6 is placed away from the polyimide tape 2, Since the solid molding agent 6 is in contact with (placed on) only the back surface of the ICl, there is a drawback that melting and hardening progresses first in the direction of the center and top surface, and melting and hardening in the direction of the sides and bottom surface is delayed. The thickness of the mold surface will be uneven and the thickness will be uneven, and it will not be possible to meet the thickness restrictions of electronic wristwatches and the like. Further, the delay in melting and hardening in the side and lower surface directions causes the ICl to wrap around the active surface 1a and is not reliably molded into the lead terminals 3, which is a drawback. Fig. 6 shows the solid molding agent 6 liquefied in the furnace in the state shown in Fig. 5 and molded with ICl.
It is shown that even the active surface 1a and lead terminals 3 are molded. Furthermore, FIG. 7 shows a state in which the entire IC is molded by molding from the active side of the IC. As described above, according to the present invention, the lead terminal on the flexible tape and the IC bonded to the lead terminal
The solid molding agent for molding the IC chip has a recess surrounding the IC chip and a through hole with a diameter smaller than the periphery of the IC chip at the bottom of the recess, and after positioning between the IC chip and the IC chip is performed by the recess. Since it is an IC chip molding method in which molding is performed by heating and melting, it has the following effects.
That is, since the position between the IC chip and the IC chip is determined by the concave portion of the solid molding agent, no special jig is required, and the position of the through hole between the IC chip and the solid molding agent can thereby be kept almost constant. This makes it possible to create a uniform and thin mold without any deviation. Therefore, it has the advantage that it can be applied even to small devices such as wristwatches that have restrictions on mold thickness.

[Brief explanation of drawings]

1 and 2 are a plan view and a front sectional view showing a state in which an IC is bonded. FIG. 3 and FIG. 4 are a plan view and a front sectional view showing an example of the solid molding agent of the present invention. 5 and 6 are front sectional views showing the C-molding method of the present invention. FIG. 7 is a front sectional view showing a state in which the IC active surface is molded. 1...
...IC, 2...Polyimide tape, 3...
...Lead terminal, 4...Recess, 5...
・Through hole, 6... Solid molding agent, 7...
- End face, 8.9... Molten hardened molding agent.

Claims (1)

[Scope of Claims] 1. In an IC chip molding method in which a plurality of lead terminals formed on a flexible tape and an IC chip bonded and fixed to the lead terminals are molded with a solid molding agent, the solid molding agent is It has a recess that surrounds the IC chip, and a through hole at the bottom of the recess that has a smaller diameter than the periphery of the IC chip, and the solid molding agent is positioned on the flexible tape while being positioned in the recess, and then heated and melted. I characterized by molding
C chip molding method. 2. A solid molding agent for melt-molding a plurality of lead terminals formed on a flexible tape and an IC chip bonded to the lead terminals,
A recess surrounding the IC chip and a through hole having a smaller diameter than the periphery of the IC chip are formed at the bottom of the recess, and the recess is arranged to surround the IC chip, thereby positioning the solid molding agent in the planar direction. A solid molding agent characterized in that it is configured to form a solid molding agent.