JPH03218034A - Semiconductor mounting board - Google Patents

Semiconductor mounting board

Info

Publication number
JPH03218034A
JPH03218034A JP2013412A JP1341290A JPH03218034A JP H03218034 A JPH03218034 A JP H03218034A JP 2013412 A JP2013412 A JP 2013412A JP 1341290 A JP1341290 A JP 1341290A JP H03218034 A JPH03218034 A JP H03218034A
Authority
JP
Japan
Prior art keywords
board
bumps
recess
terminal
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013412A
Other languages
Japanese (ja)
Inventor
Katsunori Nishiguchi
Atsushi Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2013412A priority Critical patent/JPH03218034A/en
Priority claimed from CA002034703A external-priority patent/CA2034703A1/en
Publication of JPH03218034A publication Critical patent/JPH03218034A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16237Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8112Aligning
    • H01L2224/81136Aligning involving guiding structures, e.g. spacers or supporting members
    • H01L2224/81138Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
    • H01L2224/8114Guiding structures outside the body

Abstract

PURPOSE: To reduce the time and the cost necessary for mounting by forming recessed parts accepting at least the tip parts of bumps on a semiconductor, on a semiconductor element mounting board at electrode terminals.
CONSTITUTION: A plurality of bumps 2 are formed on a semiconductor element 1 so as to protrude from the surface. On a board 3 on which the element 1 is mounted, a plurality of electrode terminals 5 are formed so as to correspond with the bumps 2. In order to form the terminal 5, a recess is formed at a part where the terminal 5 of the board 3 is formed, and the recess has a size capable of accepting at least the tip part of the bump 2. Said recess is selectively plated, thereby forming the terminal 5. Hence the bumps 2 on the element 1 can be accurately aligned with the terminals 5 on the board 3, only by pushing the element 1 on the board 3 after rough alignment, so that the time and the cost necessary for mounting can be reduced.
COPYRIGHT: (C)1991,JPO&Japio
JP2013412A 1990-01-23 1990-01-23 Semiconductor mounting board Pending JPH03218034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013412A JPH03218034A (en) 1990-01-23 1990-01-23 Semiconductor mounting board

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2013412A JPH03218034A (en) 1990-01-23 1990-01-23 Semiconductor mounting board
CA002034703A CA2034703A1 (en) 1990-01-23 1991-01-22 Substrate for packaging a semiconductor device
AU69822/91A AU645283B2 (en) 1990-01-23 1991-01-22 Substrate for packaging a semiconductor device
US07/644,587 US5214308A (en) 1990-01-23 1991-01-23 Substrate for packaging a semiconductor device
KR91001104A KR950001365B1 (en) 1990-01-23 1991-01-23 Substrate for packaging a semiconductor device, packaging structure and method
EP19910100818 EP0439134A3 (en) 1990-01-23 1991-01-23

Publications (1)

Publication Number Publication Date
JPH03218034A true JPH03218034A (en) 1991-09-25

Family

ID=11832423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013412A Pending JPH03218034A (en) 1990-01-23 1990-01-23 Semiconductor mounting board

Country Status (1)

Country Link
JP (1) JPH03218034A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8503025B2 (en) 2009-03-18 2013-08-06 Ricoh Company, Limited Image processing apparatus, image processing method, and computer program product
US9837657B2 (en) 2014-12-11 2017-12-05 Toyota Jidosha Kabushiki Kaisha Assembled battery

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8503025B2 (en) 2009-03-18 2013-08-06 Ricoh Company, Limited Image processing apparatus, image processing method, and computer program product
US9837657B2 (en) 2014-12-11 2017-12-05 Toyota Jidosha Kabushiki Kaisha Assembled battery

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