JPS5884964A - 絶縁体上へのパタ−ンメツキ製造方法 - Google Patents
絶縁体上へのパタ−ンメツキ製造方法Info
- Publication number
- JPS5884964A JPS5884964A JP56183480A JP18348081A JPS5884964A JP S5884964 A JPS5884964 A JP S5884964A JP 56183480 A JP56183480 A JP 56183480A JP 18348081 A JP18348081 A JP 18348081A JP S5884964 A JPS5884964 A JP S5884964A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- oxide film
- insulator
- plating
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims description 11
- 239000012212 insulator Substances 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000000034 method Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000007654 immersion Methods 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000002203 pretreatment Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 229910052745 lead Inorganic materials 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 238000005530 etching Methods 0.000 description 15
- 150000004703 alkoxides Chemical class 0.000 description 12
- 238000000059 patterning Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002318 adhesion promoter Substances 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 230000002747 voluntary effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910021130 PdO2 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000001856 aerosol method Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Electric Cables (AREA)
- Chemically Coating (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56183480A JPS5884964A (ja) | 1981-11-16 | 1981-11-16 | 絶縁体上へのパタ−ンメツキ製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56183480A JPS5884964A (ja) | 1981-11-16 | 1981-11-16 | 絶縁体上へのパタ−ンメツキ製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5884964A true JPS5884964A (ja) | 1983-05-21 |
| JPH026833B2 JPH026833B2 (enrdf_load_stackoverflow) | 1990-02-14 |
Family
ID=16136540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56183480A Granted JPS5884964A (ja) | 1981-11-16 | 1981-11-16 | 絶縁体上へのパタ−ンメツキ製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5884964A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119111A (ja) * | 1981-12-31 | 1983-07-15 | エヌ ベー フイリップス フルーイランペンフアブリケン | 電気的に導電性の非金属パタ−ンを部分的に金属化する方法 |
| JPS59147430A (ja) * | 1983-02-10 | 1984-08-23 | Oki Electric Ind Co Ltd | 微細回路の形成方法 |
| JPH02104671A (ja) * | 1988-10-11 | 1990-04-17 | C Uyemura & Co Ltd | パラジウム活性化剤及びセラミック基板の無電解めっき方法 |
| JPH02240271A (ja) * | 1989-03-14 | 1990-09-25 | C Uyemura & Co Ltd | パラジウム活性化剤及び無電解めっき方法 |
| JPH05239660A (ja) * | 1991-10-15 | 1993-09-17 | Enthone Omi Inc | プラスチックス基板を金属メッキ処理のために電気導電性にする方法 |
| JPH05241721A (ja) * | 1992-02-27 | 1993-09-21 | Totoku Electric Co Ltd | 透明型デジタイザセンサ板 |
-
1981
- 1981-11-16 JP JP56183480A patent/JPS5884964A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119111A (ja) * | 1981-12-31 | 1983-07-15 | エヌ ベー フイリップス フルーイランペンフアブリケン | 電気的に導電性の非金属パタ−ンを部分的に金属化する方法 |
| JPS59147430A (ja) * | 1983-02-10 | 1984-08-23 | Oki Electric Ind Co Ltd | 微細回路の形成方法 |
| JPH02104671A (ja) * | 1988-10-11 | 1990-04-17 | C Uyemura & Co Ltd | パラジウム活性化剤及びセラミック基板の無電解めっき方法 |
| JPH02240271A (ja) * | 1989-03-14 | 1990-09-25 | C Uyemura & Co Ltd | パラジウム活性化剤及び無電解めっき方法 |
| JPH05239660A (ja) * | 1991-10-15 | 1993-09-17 | Enthone Omi Inc | プラスチックス基板を金属メッキ処理のために電気導電性にする方法 |
| JPH05241721A (ja) * | 1992-02-27 | 1993-09-21 | Totoku Electric Co Ltd | 透明型デジタイザセンサ板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH026833B2 (enrdf_load_stackoverflow) | 1990-02-14 |
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