JPS5884964A - Production of pattern plating on insulator - Google Patents

Abstract

PURPOSE:To produce pattern plating of high quality in large quantity at a low cost by pretreating patterns which are formed on an insulator and consist of metallic oxides such as SnO2 with aq. solns. of SnCl2, Pd-Cl2 or the like, then carrying out electroless plating thereon. CONSTITUTION:An oxide film 2 of SnO2 or In2O3 is formed by a CVD method or the like on an insulating substrate 1 and photosensitive resist is coated on the surface thereof to make a film 3. Said film is exposed with UV rays and developed through a photomask 5, whereby patterning of intended shapes is obtained; thereafter, the oxide film 2 in the unnecessary parts is etched and further the resist is stripped. The substrate is subjected to an immersion pretreatment with mixed solns. of SnCl2-PdCl2 or an SnCl2 soln. then a PdCl2 son., then the substrate is immersed in acid or alkali solns. contg. >=1 kind among Pb, Mn, Zn, Cd, As, Sb, Bi to carry out electroless plating thereon, whereby metallic films 4 are formed on the metallic oxide films 2.

Description

[Detailed Description of the Invention] The present invention provides S n O! on an insulator such as glass, plastic, ceramic crystal, etc. Or 工 n @ O @ etc. Oa
After forming a l+ oxide film, applying a photosensitive resist, patterning the desired shape, etching the oxide film on ten important parts of the Zn powder, and peeling off the resist,
The present invention relates to a method for producing pattern plating on an insulator, which comprises immersing it in a B n Ot@P A o L@ mixed pretreatment solution and then placing it in an electroless plating solution for metal coating.

Conventionally, when patterning a metal coating on an insulator, a vacuum equipment such as evaporation or sputtering is used to create a coating on the entire surface, and the following steps are performed.

(1) Photosensitive resist coating (process) Ultraviolet exposure (8) Development (etching the light irradiated areas or non-light irradiated areas with a solvent (4) Metal etching regime) Peeling If the above steps are used, Vacuum equipment is expensive,
It is unethical to fully metal coat an insulator substrate with a large amount or large surface area.

In addition, when performing electroless plating on an insulator substrate, in order to improve the adhesion of the intended metal plating film and to obtain a uniform plating film, the insulator substrate surface is subjected to mechanical polishing, chemical polishing, and other polishing techniques. Both were used to roughen the surface. Nevertheless, it is difficult to obtain a uniform plating film with good adhesion, and there are also serious problems in workability.

On the other hand, 1!1no1 or XmgO can be carried out in the next step by taking advantage of the fact that an electroless plating film is formed in close contact with the oxide film.

(1) Form an oxide film such as l1nO1 or
After that, it is transferred to 4 pre-treatments, (1) electroless plating is applied to metallize, 6) photosensitive resist is applied, and 2) ultraviolet exposure is applied to turn the desired shape. After etching the resist F in the necessary part, (7) etching the metal (@i1mo1 or etching!1BO1, etc.), etching the resist (-) and etching the resist (removal II).

In the case of this method, the number of etching steps increases, which is contrary to the intention of shortening the work. Furthermore, if there are even a few pinholes in the resist, this will directly affect the metal film, potentially leading to pinholes and side edge cuts in the formed pattern.

Also, (Y') 8! lot or engineering n80. If the film etching process can be omitted (used for photomasks, etc., rather than as a transparent conductive film), be careful of discoloration of the oxide film.When using a transparent substrate, sometimes the transmittance is Ow1. The problem must be dealt with by taking into account the decrease in transmittance O due to discoloration and the shift of the absorption wavelength to longer wavelengths.

The present invention eliminates these drawbacks, and its purpose is to shorten the work process without using vacuum equipment, to use a large number of substrates with large surface areas at low cost, to reduce pattern defects such as pinholes, and to eliminate pattern defects such as pinholes. The present invention provides a method for manufacturing pattern plating on an insulator by electrolytic plating.

The present invention will be described in detail based on Examples below. ljl is the buttering process of the present invention, α is untreated, b is after oxide film formation, C is photosensitive resist coating,
d is after UV exposure, - is after development, f is after oxide film etching,! 1 is an insulating substrate, 2 is an oxide film, 5 is a photosensitive resist film, 4 is a metal film, and 5 is a photomask.

The insulating substrate 1 was thoroughly cleaned, and a metal oxide film was obtained by OVD method or hydrolysis of metal alkoxide. Ch) Materials that can withstand relatively high temperatures, such as glass and ceramic crystals, can be heated to 0x1, but plastic substrates in particular have a heating temperature limit of 80°C to 100°C, so they are treated with an alkoxide mold. It's better.

Metal alkoxides are generally represented by 2M (OR)n, where V represents these metals, R represents an alkyl group, and R represents an MO valence. The mixed oxide film can be obtained by appropriately mixing these alkoxides.The mixed oxide film can be obtained by appropriately mixing these alkoxides. It can be obtained by appropriately mixing these alkoxides. These alkoxides are dissolved in an appropriate organic solvent (alcohol III #halogenated carbons, esters, carbonaceous compounds, aromatics, etc.) and coated onto an insulating substrate. There are spray methods, roll-to-toe methods, aerosol methods, and dipping methods. After coating, hydrolysis is carried out at a temperature ranging from room temperature to 500°C. As mentioned above, heating is performed within the heat resistance limit of each substrate.

m(on)s+m,onMOsl−)−ILo
An oxide film is formed in the region ll↑. Next, a photosensitive resist was applied to form a film (C process), and the substrate exposed to ultraviolet light (C process) was placed in a developer (T2% [01 was used) to remove unnecessary parts of the resist. No etching (one step) Furthermore, an oxide film of 8nO1, 1m101, etc. is etched using the Zn powder mob method, and resist etching is performed with 10% KOH. The pretreatment liquid used for electroless plating, which performs electroless plating on the substrate on which the oxide film pattern has been obtained, is! 1no4-paot1
Mixed colloid solution or 8 no 1! Solution, X'6a
A single-layer solution is used, and an adhesion promoter (a solution in which one or more metals selected from 211.Mu, Zn, 04.Mus, 8b, and li is dissolved in an acid or alkaline solution) It is characterized by the use of If no adhesion promoter is used here, the plating will occur in areas other than the treated area (the oxide film forming area), which does not meet the intended purpose. As a pretreatment solution in this study, a 5-fold dilution of Red Seamer from Nippon Kanigen Co., Ltd. was used as an active petting solution after immersion in a LYXA4 solution (1 f/l) (sensitizing). Alternatively, Hitachi Chemical sensitizer 11B-10111 was used as the 8not1-PdO2 mixed pretreatment solution, diluted by a predetermined method, and immersed in the solution for 3 minutes. After washing with water, soak for 5 minutes in a solution prepared by diluting the adhesion promoter Mu DP-201 manufactured by Nikkeika Co., Ltd. by a prescribed means, and after washing thoroughly with water, Nippon Kanin (
The substrate was immersed for 5 minutes in an electroless nickel bath (45° C.) in which Schemer 8680 (manufactured by Co., Ltd.) was diluted 8 times with pure water, washed with water, and then dried. The plating thickness was 35,001 mm, and there was no change even after applying 20 degrees of pressure to the plating surface obtained for the adhesion test and rubbing it for 6 times. Pattern plating was performed on the insulator using the process shown in the example above. This makes it possible to improve quality, shorten processes, and lower cost. Application examples include photomasks, encoder slit plate single circuit pattern formation, and metallization of transparent conductive film terminals.

An optimal patterning method can be provided for various insulating substrates.

[Brief explanation of the drawing]

FIG. 1 is a side view of a substrate O illustrating the patterning process of the present invention. a...Untreated b...After oxide film formation c-...Photosensitive resist) After 1m cloth d...
・Ultraviolet exposure -... After development f... After oxide film etching! ...After resist etching... Shows after electroless plating 1 ... Insulating substrate 2 ... Oxidized film 3 ... Light Photosensitive resist F coating 4...Metal coating 5...7 Otomask diagram-1 Procedural amendment (voluntary) February 3, 1980 To the Commissioner of the Japan Patent Office 1, Indication of the case 1988 patent Application No. 183480 3. Person making the amendment 6. Written amendment to the procedure to be amended (voluntary) 1. Specification, page 4, line 1, stop "Solution (actipating) vcl'%47? and sensitizer" Correct to [ail [K immersion (actipating) sensitizer]. l Specification Lines 6, 9th to 61f-12 ``The upper coating layer can be obtained by appropriately mixing these alkoxides.・These alkoxides are mixed appropriately.'' 4.These alkoxides" should be changed to "obtained by appropriately mixing alkoxides.These alkoxides." Specification Page 7, line 1 [M(OR)n-17H20-+MOn4 RRO)i
↑” A certain meeting r M(0R)ln-1-nH20-+MOn+2n
Correct to ftO1i J. 4. In the specification, page 8, line 16, change the phrase "Turn plated," to "Turn plated, JKm."

Claims (1)

[Claims] (1) II on the insulator! l O@ or In, 0
A 1st grade oxide film was formed, (1) a photosensitive resist was applied, (1) it was patterned into the desired shape by UV exposure, and (0) the unnecessary part O oxide film was etched. After (6
) Peel off the resist line, (Is) 8nO1 proverb-paozuren mixing pre-mixing pre-treatment liquid treatment, a! Lal, @ After immersion in solution, immersion treatment in PdOtm Shinnami, (to) acid or alkaline solution with Pb, Mn, Zn,
aa, A@, mb I) Insulation that has the process of dissolving one or more metals, immersing the substrate in the solution, -) placing it in an electroless plating solution and coating it with metal. A method for manufacturing pattern plating on the body.