JPS5878666U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS5878666U
JPS5878666U JP17440581U JP17440581U JPS5878666U JP S5878666 U JPS5878666 U JP S5878666U JP 17440581 U JP17440581 U JP 17440581U JP 17440581 U JP17440581 U JP 17440581U JP S5878666 U JPS5878666 U JP S5878666U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
substrate
semiconductor pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17440581U
Other languages
English (en)
Inventor
裕 遠藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP17440581U priority Critical patent/JPS5878666U/ja
Publication of JPS5878666U publication Critical patent/JPS5878666U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案による混成集積回路装置の一実施例を示
す断面図である。 なお図において、１・・・・・・基板、２．４・・・・
・・半導体ペレット、３．５・・・・・・面、６・・・
・・・外部リード、７・・・・・・内部配線パターン、
８・・・・・・導線、９・・・・・・抵　−抗、１０・
・・・・・封止機である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板に複数個の半導体ペレットを搭載してなる混成集積
    回路装置にお句）で、該基板の複数の面に各々半導体ペ
    レット等の電子部品を搭載したことを特徴とする混成集
    積回路装置。
JP17440581U 1981-11-24 1981-11-24 混成集積回路装置 Pending JPS5878666U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17440581U JPS5878666U (ja) 1981-11-24 1981-11-24 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17440581U JPS5878666U (ja) 1981-11-24 1981-11-24 混成集積回路装置

Publications (1)

Publication Number Publication Date
JPS5878666U true JPS5878666U (ja) 1983-05-27

Family

ID=29966401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17440581U Pending JPS5878666U (ja) 1981-11-24 1981-11-24 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS5878666U (ja)

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