JPS58106951U - 半導体集積回路実装構造 - Google Patents

半導体集積回路実装構造

Info

Publication number
JPS58106951U
JPS58106951U JP1982003167U JP316782U JPS58106951U JP S58106951 U JPS58106951 U JP S58106951U JP 1982003167 U JP1982003167 U JP 1982003167U JP 316782 U JP316782 U JP 316782U JP S58106951 U JPS58106951 U JP S58106951U
Authority
JP
Japan
Prior art keywords
semiconductor integrated
mounting structure
integrated circuit
circuit mounting
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982003167U
Other languages
English (en)
Inventor
萩野　光章
藤森　昌幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1982003167U priority Critical patent/JPS58106951U/ja
Publication of JPS58106951U publication Critical patent/JPS58106951U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の実装構造の一例である。第２図、第３図
、第４図、第５図、第６図は、本考案の実装構造の実施
例である。 図中の番号と部品の対応は下記の通りである。 ＩＣ：１，５，８，９，１４，１８，１９．２Ｇ，２３
，２７．２Ｂ，３１、回路基板：１２，１６，２２，２
５，３２、回路基板上の配線：２，３，４．６．７．２
４．３０、回路基板上の配線により形成された可撓性導
体：１７，２１，２６、回路基板の配線とは別に形成さ
れた可撓性導体：１０，１１．１５，２９、回路基板に
設けられた窓部：１３。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の半導体集積回路を、同一回路基板上に搭載した
    電気回路において、複数の半導体集積回路を積み重ねて
    配置した事を特徴とする、半導体集積回路実装構造。
JP1982003167U 1982-01-13 1982-01-13 半導体集積回路実装構造 Pending JPS58106951U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982003167U JPS58106951U (ja) 1982-01-13 1982-01-13 半導体集積回路実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982003167U JPS58106951U (ja) 1982-01-13 1982-01-13 半導体集積回路実装構造

Publications (1)

Publication Number Publication Date
JPS58106951U true JPS58106951U (ja) 1983-07-21

Family

ID=30016115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982003167U Pending JPS58106951U (ja) 1982-01-13 1982-01-13 半導体集積回路実装構造

Country Status (1)

Country Link
JP (1) JPS58106951U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324840U (ja) * 1986-08-01 1988-02-18
JPH04116860A (ja) * 1990-09-06 1992-04-17 Hitachi Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6324840U (ja) * 1986-08-01 1988-02-18
JPH04116860A (ja) * 1990-09-06 1992-04-17 Hitachi Ltd 半導体装置

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