JPS5875861A - 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 - Google Patents
回路素子気密パツケ−ジ用リ−ド線及びその製造方法Info
- Publication number
- JPS5875861A JPS5875861A JP17374981A JP17374981A JPS5875861A JP S5875861 A JPS5875861 A JP S5875861A JP 17374981 A JP17374981 A JP 17374981A JP 17374981 A JP17374981 A JP 17374981A JP S5875861 A JPS5875861 A JP S5875861A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- alloy
- lead wire
- circuit element
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007789 sealing Methods 0.000 title 1
- 238000007747 plating Methods 0.000 claims abstract description 16
- 239000000203 mixture Substances 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 18
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 2
- 235000001270 Allium sibiricum Nutrition 0.000 claims 1
- 239000000956 alloy Substances 0.000 abstract description 11
- 229910045601 alloy Inorganic materials 0.000 abstract description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 230000006866 deterioration Effects 0.000 abstract description 3
- 229910020816 Sn Pb Inorganic materials 0.000 abstract 3
- 229910020922 Sn-Pb Inorganic materials 0.000 abstract 3
- 229910008783 Sn—Pb Inorganic materials 0.000 abstract 3
- 230000032683 aging Effects 0.000 abstract 1
- 239000010931 gold Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17374981A JPS5875861A (ja) | 1981-10-30 | 1981-10-30 | 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17374981A JPS5875861A (ja) | 1981-10-30 | 1981-10-30 | 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875861A true JPS5875861A (ja) | 1983-05-07 |
| JPS6251500B2 JPS6251500B2 (enrdf_load_stackoverflow) | 1987-10-30 |
Family
ID=15966413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17374981A Granted JPS5875861A (ja) | 1981-10-30 | 1981-10-30 | 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875861A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603144A (ja) * | 1983-06-21 | 1985-01-09 | Oki Electric Ind Co Ltd | 半導体パツケ−ジのリ−ド処理方法 |
| JPH0235763A (ja) * | 1988-07-26 | 1990-02-06 | Matsushita Electric Works Ltd | 端子ピン付き基板 |
| JPH0235762A (ja) * | 1988-07-26 | 1990-02-06 | Matsushita Electric Works Ltd | 半導体パッケージの端子ピン |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6439598U (enrdf_load_stackoverflow) * | 1987-08-31 | 1989-03-09 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036954A (enrdf_load_stackoverflow) * | 1973-06-22 | 1975-04-07 |
-
1981
- 1981-10-30 JP JP17374981A patent/JPS5875861A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5036954A (enrdf_load_stackoverflow) * | 1973-06-22 | 1975-04-07 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS603144A (ja) * | 1983-06-21 | 1985-01-09 | Oki Electric Ind Co Ltd | 半導体パツケ−ジのリ−ド処理方法 |
| JPH0235763A (ja) * | 1988-07-26 | 1990-02-06 | Matsushita Electric Works Ltd | 端子ピン付き基板 |
| JPH0235762A (ja) * | 1988-07-26 | 1990-02-06 | Matsushita Electric Works Ltd | 半導体パッケージの端子ピン |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6251500B2 (enrdf_load_stackoverflow) | 1987-10-30 |
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