JPS5874341U - 半導体装置の樹脂モ−ルド装置 - Google Patents

半導体装置の樹脂モ−ルド装置

Info

Publication number
JPS5874341U
JPS5874341U JP16961281U JP16961281U JPS5874341U JP S5874341 U JPS5874341 U JP S5874341U JP 16961281 U JP16961281 U JP 16961281U JP 16961281 U JP16961281 U JP 16961281U JP S5874341 U JPS5874341 U JP S5874341U
Authority
JP
Japan
Prior art keywords
resin molding
semiconductor devices
molding equipment
hole
lower mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16961281U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6120753Y2 (https=
Inventor
寺氏　菊夫
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP16961281U priority Critical patent/JPS5874341U/ja
Publication of JPS5874341U publication Critical patent/JPS5874341U/ja
Application granted granted Critical
Publication of JPS6120753Y2 publication Critical patent/JPS6120753Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16961281U 1981-11-13 1981-11-13 半導体装置の樹脂モ−ルド装置 Granted JPS5874341U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16961281U JPS5874341U (ja) 1981-11-13 1981-11-13 半導体装置の樹脂モ−ルド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16961281U JPS5874341U (ja) 1981-11-13 1981-11-13 半導体装置の樹脂モ−ルド装置

Publications (2)

Publication Number Publication Date
JPS5874341U true JPS5874341U (ja) 1983-05-19
JPS6120753Y2 JPS6120753Y2 (https=) 1986-06-21

Family

ID=29961594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16961281U Granted JPS5874341U (ja) 1981-11-13 1981-11-13 半導体装置の樹脂モ−ルド装置

Country Status (1)

Country Link
JP (1) JPS5874341U (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034017U (https=) * 1989-05-31 1991-01-16
JPH04123534U (ja) * 1991-04-22 1992-11-09 鹿児島日本電気株式会社 半導体のモールド金型
JP2009274252A (ja) * 2008-05-13 2009-11-26 Minoru Kasei Kk インサートの着座検知方法及び装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034017U (https=) * 1989-05-31 1991-01-16
JPH04123534U (ja) * 1991-04-22 1992-11-09 鹿児島日本電気株式会社 半導体のモールド金型
JP2009274252A (ja) * 2008-05-13 2009-11-26 Minoru Kasei Kk インサートの着座検知方法及び装置

Also Published As

Publication number Publication date
JPS6120753Y2 (https=) 1986-06-21

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