JPS5864038A - ボンデイングプレ−ト - Google Patents

ボンデイングプレ−ト

Info

Publication number
JPS5864038A
JPS5864038A JP56163010A JP16301081A JPS5864038A JP S5864038 A JPS5864038 A JP S5864038A JP 56163010 A JP56163010 A JP 56163010A JP 16301081 A JP16301081 A JP 16301081A JP S5864038 A JPS5864038 A JP S5864038A
Authority
JP
Japan
Prior art keywords
bonding
vacuum
semiconductor element
plate
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56163010A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6250057B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Aoyama
弘 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56163010A priority Critical patent/JPS5864038A/ja
Publication of JPS5864038A publication Critical patent/JPS5864038A/ja
Publication of JPS6250057B2 publication Critical patent/JPS6250057B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56163010A 1981-10-13 1981-10-13 ボンデイングプレ−ト Granted JPS5864038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56163010A JPS5864038A (ja) 1981-10-13 1981-10-13 ボンデイングプレ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56163010A JPS5864038A (ja) 1981-10-13 1981-10-13 ボンデイングプレ−ト

Publications (2)

Publication Number Publication Date
JPS5864038A true JPS5864038A (ja) 1983-04-16
JPS6250057B2 JPS6250057B2 (enrdf_load_stackoverflow) 1987-10-22

Family

ID=15765474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56163010A Granted JPS5864038A (ja) 1981-10-13 1981-10-13 ボンデイングプレ−ト

Country Status (1)

Country Link
JP (1) JPS5864038A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316237A (ja) * 1989-06-14 1991-01-24 Toshiba Seiki Kk インナーリードボンダ
CN106068555A (zh) * 2014-03-19 2016-11-02 信越半导体株式会社 工件支承装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02117879U (enrdf_load_stackoverflow) * 1989-03-06 1990-09-20

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776850A (en) * 1980-10-30 1982-05-14 Nec Corp Manufacture device for semiconductor device
JPS5832426A (ja) * 1981-08-20 1983-02-25 Seiko Epson Corp インナ−リ−ドボンダ−の集積回路チツプ受台

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776850A (en) * 1980-10-30 1982-05-14 Nec Corp Manufacture device for semiconductor device
JPS5832426A (ja) * 1981-08-20 1983-02-25 Seiko Epson Corp インナ−リ−ドボンダ−の集積回路チツプ受台

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316237A (ja) * 1989-06-14 1991-01-24 Toshiba Seiki Kk インナーリードボンダ
CN106068555A (zh) * 2014-03-19 2016-11-02 信越半导体株式会社 工件支承装置

Also Published As

Publication number Publication date
JPS6250057B2 (enrdf_load_stackoverflow) 1987-10-22

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