JPS5776850A - Manufacture device for semiconductor device - Google Patents

Manufacture device for semiconductor device

Info

Publication number
JPS5776850A
JPS5776850A JP55152596A JP15259680A JPS5776850A JP S5776850 A JPS5776850 A JP S5776850A JP 55152596 A JP55152596 A JP 55152596A JP 15259680 A JP15259680 A JP 15259680A JP S5776850 A JPS5776850 A JP S5776850A
Authority
JP
Japan
Prior art keywords
bonding
film carrier
mechanism section
stage
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55152596A
Other languages
Japanese (ja)
Inventor
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55152596A priority Critical patent/JPS5776850A/en
Publication of JPS5776850A publication Critical patent/JPS5776850A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To improve bonding property, and to shorten bonding time by eliminating the displacement, etc. of an element on a pasting substrate, which keeps a form of a wafer when softening wax, and omitting an organic washing process for removing wax. CONSTITUTION:A film carrier 7 wound on a film carrier supply reel section 16 is fed successively to a bonding position along a film giud 12 while being subject to tension by means of a film carrier tension mechanism section 17. The element 1 is forwarded to a bonding stage 3a by means of a semiconductor transfer mechanism section 21 from a work stage 20, vacuum-adsorbed and held by means of a vacuum source connected from a vacuum port from an adsorbing hole formed to the stage 3a, and heated preparatorily before bonding by means of a partial heating mechanism section 22. Three of a bonding tool 11, and inner lead of the film carrier and a bump of the element 1 are positioned completely, and the carrier and the element are bonded.
JP55152596A 1980-10-30 1980-10-30 Manufacture device for semiconductor device Pending JPS5776850A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152596A JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152596A JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5776850A true JPS5776850A (en) 1982-05-14

Family

ID=15543879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152596A Pending JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5776850A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864038A (en) * 1981-10-13 1983-04-16 Nec Corp Bonding plate
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864038A (en) * 1981-10-13 1983-04-16 Nec Corp Bonding plate
JPS6250057B2 (en) * 1981-10-13 1987-10-22 Nippon Electric Co
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus

Similar Documents

Publication Publication Date Title
KR100337412B1 (en) An integrated circuit and a semiconductor wafer having a bottom surface protective coating and method of making the same
JPS57152147A (en) Formation of metal projection on metal lead
US7129118B2 (en) Protective tape removing apparatus and method of assembling semiconductor package using the same
JPH10163271A (en) Solder member-sticking method
US6995468B2 (en) Semiconductor apparatus utilizing a preparatory stage for a chip assembly
JP2004047976A (en) Method and device for bonding protective tape
JPS5776850A (en) Manufacture device for semiconductor device
JPS6010756A (en) Manufacture of beam-lead type semiconductor device
JP2004281659A (en) Holding member and method for manufacturing semiconductor device
US20030059981A1 (en) Semiconductor device, method of producing the same and semiconductor production equipment for carrying out the method
US7246646B2 (en) Method for production and apparatus for production of adhesive wafer
JPH05291397A (en) Manufacture of collet and semiconductor device
FR2576148B1 (en) METHOD FOR MANUFACTURING INTEGRATED CIRCUIT CHIPS
JPS5691439A (en) Method and device for bonding pellet
JPS5553448A (en) Semiconductor element holding tape and mounting of element on wafer
JP2680104B2 (en) Method for manufacturing semiconductor device
JPH11204669A (en) Ic chip manufacturing method and laser mark apparatus provided with burning mechanism
KR20000013544U (en) Chip mounting board film
JPS6250057B2 (en)
JPS58165335A (en) Method and apparatus for manufacturing semiconductor device using tape carrier system
KR200211723Y1 (en) Tape feeder for potting process in the manufacturing process
JPH08115862A (en) Developing device
JPS6063937A (en) Assembling device for electronic component
JPS5264274A (en) Wafer soldering device for semiconductor devices
JPS5660025A (en) Bonding method for semiconductor element