JPS5858810B2 - 半導体装置の製作法 - Google Patents
半導体装置の製作法Info
- Publication number
- JPS5858810B2 JPS5858810B2 JP48083935A JP8393573A JPS5858810B2 JP S5858810 B2 JPS5858810 B2 JP S5858810B2 JP 48083935 A JP48083935 A JP 48083935A JP 8393573 A JP8393573 A JP 8393573A JP S5858810 B2 JPS5858810 B2 JP S5858810B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- single crystal
- forming
- crystal semiconductor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 23
- 238000004519 manufacturing process Methods 0.000 title description 7
- 238000000034 method Methods 0.000 claims description 39
- 239000013078 crystal Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 230000001419 dependent effect Effects 0.000 claims description 7
- 230000005669 field effect Effects 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000009792 diffusion process Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000012808 vapor phase Substances 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000004886 process control Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 241000238557 Decapoda Species 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 235000015429 Mirabilis expansa Nutrition 0.000 description 1
- 244000294411 Mirabilis expansa Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 235000013536 miso Nutrition 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0821—Collector regions of bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8248—Combination of bipolar and field-effect technology
- H01L21/8249—Bipolar and MOS technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76289—Lateral isolation by air gap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/115—Orientation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Element Separation (AREA)
- Bipolar Transistors (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/275,116 US4063271A (en) | 1972-07-26 | 1972-07-26 | FET and bipolar device and circuit process with maximum junction control |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4960182A JPS4960182A (US20100012521A1-20100121-C00001.png) | 1974-06-11 |
JPS5858810B2 true JPS5858810B2 (ja) | 1983-12-27 |
Family
ID=23050930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP48083935A Expired JPS5858810B2 (ja) | 1972-07-26 | 1973-07-25 | 半導体装置の製作法 |
Country Status (5)
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52149665U (US20100012521A1-20100121-C00001.png) * | 1976-05-11 | 1977-11-12 | ||
US4282538A (en) * | 1977-11-11 | 1981-08-04 | Rca Corporation | Method of integrating semiconductor components |
US4199860A (en) * | 1977-11-11 | 1980-04-29 | Rca Corporation | Method of integrating semiconductor components |
US4294510A (en) * | 1979-12-10 | 1981-10-13 | International Business Machines Corporation | Semiconductor fiber optical detection |
GB2070858B (en) * | 1980-03-03 | 1985-02-06 | Raytheon Co | Shallow channel field effect transistor |
US4523368A (en) * | 1980-03-03 | 1985-06-18 | Raytheon Company | Semiconductor devices and manufacturing methods |
JPH0626242B2 (ja) * | 1983-12-05 | 1994-04-06 | 富士通株式会社 | 半導体集積回路装置 |
US4701996A (en) * | 1984-12-19 | 1987-10-27 | Calviello Joseph A | Method for fabricating edge channel FET |
US4620207A (en) * | 1984-12-19 | 1986-10-28 | Eaton Corporation | Edge channel FET |
JPH0614536B2 (ja) * | 1985-09-17 | 1994-02-23 | 株式会社東芝 | バイポ−ラ集積回路 |
JPH0740609B2 (ja) * | 1985-12-20 | 1995-05-01 | セイコー電子工業株式会社 | 半導体装置の製造方法 |
US5923985A (en) * | 1987-01-05 | 1999-07-13 | Seiko Instruments Inc. | MOS field effect transistor and its manufacturing method |
US5332920A (en) * | 1988-02-08 | 1994-07-26 | Kabushiki Kaisha Toshiba | Dielectrically isolated high and low voltage substrate regions |
US5151768A (en) * | 1990-02-22 | 1992-09-29 | Oki Electric Industry Co., Ltd. | Dielectric isolation substrate |
US5585282A (en) * | 1991-06-04 | 1996-12-17 | Micron Technology, Inc. | Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor |
US5985328A (en) * | 1994-03-07 | 1999-11-16 | Regents Of The University Of California | Micromachined porous membranes with bulk support |
US5651900A (en) * | 1994-03-07 | 1997-07-29 | The Regents Of The University Of California | Microfabricated particle filter |
US5645684A (en) * | 1994-03-07 | 1997-07-08 | The Regents Of The University Of California | Multilayer high vertical aspect ratio thin film structures |
US5798042A (en) * | 1994-03-07 | 1998-08-25 | Regents Of The University Of California | Microfabricated filter with specially constructed channel walls, and containment well and capsule constructed with such filters |
US5985164A (en) * | 1994-03-07 | 1999-11-16 | Regents Of The University Of California | Method for forming a filter |
US5770076A (en) * | 1994-03-07 | 1998-06-23 | The Regents Of The University Of California | Micromachined capsules having porous membranes and bulk supports |
US5660680A (en) * | 1994-03-07 | 1997-08-26 | The Regents Of The University Of California | Method for fabrication of high vertical aspect ratio thin film structures |
US5841182A (en) * | 1994-10-19 | 1998-11-24 | Harris Corporation | Capacitor structure in a bonded wafer and method of fabrication |
US5938923A (en) * | 1997-04-15 | 1999-08-17 | The Regents Of The University Of California | Microfabricated filter and capsule using a substrate sandwich |
US6121552A (en) | 1997-06-13 | 2000-09-19 | The Regents Of The University Of Caliofornia | Microfabricated high aspect ratio device with an electrical isolation trench |
US7832177B2 (en) * | 2002-03-22 | 2010-11-16 | Electronics Packaging Solutions, Inc. | Insulated glazing units |
US6962834B2 (en) * | 2002-03-22 | 2005-11-08 | Stark David H | Wafer-level hermetic micro-device packages |
US6853031B2 (en) * | 2003-04-17 | 2005-02-08 | United Microelectronics Corp. | Structure of a trapezoid-triple-gate FET |
WO2009036359A1 (en) | 2007-09-14 | 2009-03-19 | Electronics Packaging Solutions, Inc. | Insulating glass unit having multi-height internal standoffs and visible decoration |
EP2324183B1 (en) * | 2008-08-09 | 2014-06-25 | Eversealed Windows, Inc. | Asymmetrical flexible edge seal for vacuum insulating glass |
US8329267B2 (en) * | 2009-01-15 | 2012-12-11 | Eversealed Windows, Inc. | Flexible edge seal for vacuum insulating glazing units |
WO2010083475A2 (en) * | 2009-01-15 | 2010-07-22 | Eversealed Windows, Inc. | Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units |
US8950162B2 (en) | 2010-06-02 | 2015-02-10 | Eversealed Windows, Inc. | Multi-pane glass unit having seal with adhesive and hermetic coating layer |
US9328512B2 (en) | 2011-05-05 | 2016-05-03 | Eversealed Windows, Inc. | Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623218A (en) * | 1969-01-16 | 1971-11-30 | Signetics Corp | Method for determining depth of lapping of dielectrically isolated integrated circuits |
US3659160A (en) * | 1970-02-13 | 1972-04-25 | Texas Instruments Inc | Integrated circuit process utilizing orientation dependent silicon etch |
JPS4941956A (US20100012521A1-20100121-C00001.png) * | 1972-05-01 | 1974-04-19 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3409812A (en) * | 1965-11-12 | 1968-11-05 | Hughes Aircraft Co | Space-charge-limited current triode device |
US3443172A (en) * | 1965-11-16 | 1969-05-06 | Monsanto Co | Low capacitance field effect transistor |
US3404450A (en) * | 1966-01-26 | 1968-10-08 | Westinghouse Electric Corp | Method of fabricating an integrated circuit structure including unipolar transistor and bipolar transistor portions |
NL6606714A (US20100012521A1-20100121-C00001.png) * | 1966-05-17 | 1967-11-20 | ||
US3509433A (en) * | 1967-05-01 | 1970-04-28 | Fairchild Camera Instr Co | Contacts for buried layer in a dielectrically isolated semiconductor pocket |
US3844858A (en) * | 1968-12-31 | 1974-10-29 | Texas Instruments Inc | Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate |
NL7017085A (US20100012521A1-20100121-C00001.png) * | 1969-11-26 | 1971-05-28 | ||
US3696274A (en) * | 1970-06-26 | 1972-10-03 | Signetics Corp | Air isolated integrated circuit and method |
US3648125A (en) * | 1971-02-02 | 1972-03-07 | Fairchild Camera Instr Co | Method of fabricating integrated circuits with oxidized isolation and the resulting structure |
-
1972
- 1972-07-26 US US05/275,116 patent/US4063271A/en not_active Expired - Lifetime
-
1973
- 1973-07-09 GB GB371675A patent/GB1435590A/en not_active Expired
- 1973-07-09 GB GB3252173A patent/GB1435589A/en not_active Expired
- 1973-07-13 DE DE19732335799 patent/DE2335799A1/de not_active Ceased
- 1973-07-25 JP JP48083935A patent/JPS5858810B2/ja not_active Expired
- 1973-07-25 FR FR7327253A patent/FR2194048B1/fr not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623218A (en) * | 1969-01-16 | 1971-11-30 | Signetics Corp | Method for determining depth of lapping of dielectrically isolated integrated circuits |
US3659160A (en) * | 1970-02-13 | 1972-04-25 | Texas Instruments Inc | Integrated circuit process utilizing orientation dependent silicon etch |
JPS4941956A (US20100012521A1-20100121-C00001.png) * | 1972-05-01 | 1974-04-19 |
Also Published As
Publication number | Publication date |
---|---|
FR2194048B1 (US20100012521A1-20100121-C00001.png) | 1978-08-11 |
FR2194048A1 (US20100012521A1-20100121-C00001.png) | 1974-02-22 |
US4063271A (en) | 1977-12-13 |
JPS4960182A (US20100012521A1-20100121-C00001.png) | 1974-06-11 |
DE2335799A1 (de) | 1974-02-07 |
GB1435589A (en) | 1976-05-12 |
GB1435590A (en) | 1976-05-12 |
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