JPS5858738A - 平型サイリスタ - Google Patents

平型サイリスタ

Info

Publication number
JPS5858738A
JPS5858738A JP56158411A JP15841181A JPS5858738A JP S5858738 A JPS5858738 A JP S5858738A JP 56158411 A JP56158411 A JP 56158411A JP 15841181 A JP15841181 A JP 15841181A JP S5858738 A JPS5858738 A JP S5858738A
Authority
JP
Japan
Prior art keywords
block
semiconductor element
gate
flange
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56158411A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6366421B2 (enrdf_load_stackoverflow
Inventor
Mikio Hatakeyama
畠山　幹男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56158411A priority Critical patent/JPS5858738A/ja
Publication of JPS5858738A publication Critical patent/JPS5858738A/ja
Publication of JPS6366421B2 publication Critical patent/JPS6366421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56158411A 1981-10-05 1981-10-05 平型サイリスタ Granted JPS5858738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56158411A JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56158411A JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Publications (2)

Publication Number Publication Date
JPS5858738A true JPS5858738A (ja) 1983-04-07
JPS6366421B2 JPS6366421B2 (enrdf_load_stackoverflow) 1988-12-20

Family

ID=15671162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56158411A Granted JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Country Status (1)

Country Link
JP (1) JPS5858738A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6366421B2 (enrdf_load_stackoverflow) 1988-12-20

Similar Documents

Publication Publication Date Title
JPH0385755A (ja) 樹脂封止型半導体装置
ES2038467T3 (es) Elemento de union entre rollos separadores de electrodos y polo de celda de una celda galvanica.
KR101230994B1 (ko) 중대형 배터리
GB1246668A (en) Semiconductor assemblies and a method for manufacturing semiconductor assemblies
EP0476661B1 (en) Press-contact type semiconductor device
US4591896A (en) Pressure-contact sealing arrangement for a semiconductor pellet
JPS5858738A (ja) 平型サイリスタ
US4315061A (en) Battery with internal electrical connectors
US4156963A (en) Method for manufacturing a semiconductor device
KR900008258Y1 (ko) 정류기가 부착된 트랜스장치
JPH023627Y2 (enrdf_load_stackoverflow)
JPS5855650Y2 (ja) 半導体装置
JPS5943736Y2 (ja) 半導体装置
JPH019155Y2 (enrdf_load_stackoverflow)
CN217606922U (zh) 电池盖板、盖板组件、电池及车辆
JPS6269543A (ja) 整流装置
JPH03187182A (ja) 水中ヒーター装置
JPS5931861B2 (ja) 半導体装置
JPS61129836A (ja) 圧接型半導体装置
JPH0727996B2 (ja) 冷却装置付半導体装置
JPS6218050Y2 (enrdf_load_stackoverflow)
JPS642443Y2 (enrdf_load_stackoverflow)
JPS56124238A (en) Semiconductor device
JPS5824452Y2 (ja) 半導体装置
JP3892949B2 (ja) キャップ端子付電解コンデンサ