JPS642443Y2 - - Google Patents

Info

Publication number
JPS642443Y2
JPS642443Y2 JP1983116690U JP11669083U JPS642443Y2 JP S642443 Y2 JPS642443 Y2 JP S642443Y2 JP 1983116690 U JP1983116690 U JP 1983116690U JP 11669083 U JP11669083 U JP 11669083U JP S642443 Y2 JPS642443 Y2 JP S642443Y2
Authority
JP
Japan
Prior art keywords
wafer
pellet
bump
current
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983116690U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6025149U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983116690U priority Critical patent/JPS6025149U/ja
Publication of JPS6025149U publication Critical patent/JPS6025149U/ja
Application granted granted Critical
Publication of JPS642443Y2 publication Critical patent/JPS642443Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/141Disposition
    • H01L2224/1418Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/14181On opposite sides of the body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015Shape
    • H01L2924/10155Shape being other than a cuboid

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP1983116690U 1983-07-27 1983-07-27 バンプ電極形成ウエ−ハ Granted JPS6025149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983116690U JPS6025149U (ja) 1983-07-27 1983-07-27 バンプ電極形成ウエ−ハ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983116690U JPS6025149U (ja) 1983-07-27 1983-07-27 バンプ電極形成ウエ−ハ

Publications (2)

Publication Number Publication Date
JPS6025149U JPS6025149U (ja) 1985-02-20
JPS642443Y2 true JPS642443Y2 (enrdf_load_stackoverflow) 1989-01-20

Family

ID=30268898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983116690U Granted JPS6025149U (ja) 1983-07-27 1983-07-27 バンプ電極形成ウエ−ハ

Country Status (1)

Country Link
JP (1) JPS6025149U (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817638A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd バンプ形成装置

Also Published As

Publication number Publication date
JPS6025149U (ja) 1985-02-20

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