JPS6025149U - バンプ電極形成ウエ−ハ - Google Patents
バンプ電極形成ウエ−ハInfo
- Publication number
- JPS6025149U JPS6025149U JP1983116690U JP11669083U JPS6025149U JP S6025149 U JPS6025149 U JP S6025149U JP 1983116690 U JP1983116690 U JP 1983116690U JP 11669083 U JP11669083 U JP 11669083U JP S6025149 U JPS6025149 U JP S6025149U
- Authority
- JP
- Japan
- Prior art keywords
- bump electrode
- electrode formation
- wafer
- formation wafer
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 238000007747 plating Methods 0.000 claims description 7
- 239000008188 pellet Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1418—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/14181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983116690U JPS6025149U (ja) | 1983-07-27 | 1983-07-27 | バンプ電極形成ウエ−ハ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983116690U JPS6025149U (ja) | 1983-07-27 | 1983-07-27 | バンプ電極形成ウエ−ハ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6025149U true JPS6025149U (ja) | 1985-02-20 |
JPS642443Y2 JPS642443Y2 (enrdf_load_stackoverflow) | 1989-01-20 |
Family
ID=30268898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983116690U Granted JPS6025149U (ja) | 1983-07-27 | 1983-07-27 | バンプ電極形成ウエ−ハ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6025149U (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5817638A (ja) * | 1981-07-24 | 1983-02-01 | Hitachi Ltd | バンプ形成装置 |
-
1983
- 1983-07-27 JP JP1983116690U patent/JPS6025149U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5817638A (ja) * | 1981-07-24 | 1983-02-01 | Hitachi Ltd | バンプ形成装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS642443Y2 (enrdf_load_stackoverflow) | 1989-01-20 |
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