JPS6130302Y2 - - Google Patents

Info

Publication number
JPS6130302Y2
JPS6130302Y2 JP1981084975U JP8497581U JPS6130302Y2 JP S6130302 Y2 JPS6130302 Y2 JP S6130302Y2 JP 1981084975 U JP1981084975 U JP 1981084975U JP 8497581 U JP8497581 U JP 8497581U JP S6130302 Y2 JPS6130302 Y2 JP S6130302Y2
Authority
JP
Japan
Prior art keywords
electrode
solar cell
base
electrodes
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981084975U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56172959U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981084975U priority Critical patent/JPS6130302Y2/ja
Publication of JPS56172959U publication Critical patent/JPS56172959U/ja
Application granted granted Critical
Publication of JPS6130302Y2 publication Critical patent/JPS6130302Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP1981084975U 1981-06-11 1981-06-11 Expired JPS6130302Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981084975U JPS6130302Y2 (enrdf_load_stackoverflow) 1981-06-11 1981-06-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981084975U JPS6130302Y2 (enrdf_load_stackoverflow) 1981-06-11 1981-06-11

Publications (2)

Publication Number Publication Date
JPS56172959U JPS56172959U (enrdf_load_stackoverflow) 1981-12-21
JPS6130302Y2 true JPS6130302Y2 (enrdf_load_stackoverflow) 1986-09-05

Family

ID=29666399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981084975U Expired JPS6130302Y2 (enrdf_load_stackoverflow) 1981-06-11 1981-06-11

Country Status (1)

Country Link
JP (1) JPS6130302Y2 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239076B2 (enrdf_load_stackoverflow) * 1971-09-02 1977-10-03

Also Published As

Publication number Publication date
JPS56172959U (enrdf_load_stackoverflow) 1981-12-21

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