JPS621000B2 - - Google Patents

Info

Publication number
JPS621000B2
JPS621000B2 JP53157497A JP15749778A JPS621000B2 JP S621000 B2 JPS621000 B2 JP S621000B2 JP 53157497 A JP53157497 A JP 53157497A JP 15749778 A JP15749778 A JP 15749778A JP S621000 B2 JPS621000 B2 JP S621000B2
Authority
JP
Japan
Prior art keywords
plating
wafer
semiconductor wafer
plating liquid
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53157497A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5585692A (en
Inventor
Masaru Tsukahara
Kazuhisa Nakamoto
Nobuo Shinkai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15749778A priority Critical patent/JPS5585692A/ja
Publication of JPS5585692A publication Critical patent/JPS5585692A/ja
Publication of JPS621000B2 publication Critical patent/JPS621000B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP15749778A 1978-12-22 1978-12-22 Plating method Granted JPS5585692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15749778A JPS5585692A (en) 1978-12-22 1978-12-22 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15749778A JPS5585692A (en) 1978-12-22 1978-12-22 Plating method

Publications (2)

Publication Number Publication Date
JPS5585692A JPS5585692A (en) 1980-06-27
JPS621000B2 true JPS621000B2 (enrdf_load_stackoverflow) 1987-01-10

Family

ID=15650968

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15749778A Granted JPS5585692A (en) 1978-12-22 1978-12-22 Plating method

Country Status (1)

Country Link
JP (1) JPS5585692A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3348528B2 (ja) * 1994-07-20 2002-11-20 富士通株式会社 半導体装置の製造方法と半導体装置及び電子回路装置の製造方法と電子回路装置
JP2000232078A (ja) 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
US6632335B2 (en) * 1999-12-24 2003-10-14 Ebara Corporation Plating apparatus
WO2001048800A1 (fr) * 1999-12-24 2001-07-05 Ebara Corporation Procede et appareil de traitement de tranche de semi-conducteur
JP4922275B2 (ja) * 2008-10-20 2012-04-25 株式会社東芝 メッキ方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265665A (en) * 1975-11-28 1977-05-31 Hitachi Ltd Formation of protruding electrode of semiconductor device

Also Published As

Publication number Publication date
JPS5585692A (en) 1980-06-27

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