JPS5585692A - Plating method - Google Patents
Plating methodInfo
- Publication number
- JPS5585692A JPS5585692A JP15749778A JP15749778A JPS5585692A JP S5585692 A JPS5585692 A JP S5585692A JP 15749778 A JP15749778 A JP 15749778A JP 15749778 A JP15749778 A JP 15749778A JP S5585692 A JPS5585692 A JP S5585692A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- electrode
- liquid
- cloth
- vamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15749778A JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15749778A JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5585692A true JPS5585692A (en) | 1980-06-27 |
JPS621000B2 JPS621000B2 (ja) | 1987-01-10 |
Family
ID=15650968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15749778A Granted JPS5585692A (en) | 1978-12-22 | 1978-12-22 | Plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585692A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
WO2001048800A1 (fr) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Procede et appareil de traitement de tranche de semi-conducteur |
US6764938B2 (en) * | 1994-07-20 | 2004-07-20 | Fujitsu Limited | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
JP2009027192A (ja) * | 2008-10-20 | 2009-02-05 | Toshiba Corp | メッキ方法 |
US7575664B2 (en) | 1999-02-10 | 2009-08-18 | Kabushiki Kaisha Toshiba | Plating method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5265665A (en) * | 1975-11-28 | 1977-05-31 | Hitachi Ltd | Formation of protruding electrode of semiconductor device |
-
1978
- 1978-12-22 JP JP15749778A patent/JPS5585692A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5265665A (en) * | 1975-11-28 | 1977-05-31 | Hitachi Ltd | Formation of protruding electrode of semiconductor device |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6764938B2 (en) * | 1994-07-20 | 2004-07-20 | Fujitsu Limited | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof |
US7575664B2 (en) | 1999-02-10 | 2009-08-18 | Kabushiki Kaisha Toshiba | Plating method |
WO2001048274A1 (en) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Apparatus for plating substrate, method for plating substrate, electrolytic processing method, and apparatus thereof |
WO2001048800A1 (fr) * | 1999-12-24 | 2001-07-05 | Ebara Corporation | Procede et appareil de traitement de tranche de semi-conducteur |
US6632335B2 (en) | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
US7387717B2 (en) | 1999-12-24 | 2008-06-17 | Ebara Corporation | Method of performing electrolytic treatment on a conductive layer of a substrate |
CN100422389C (zh) * | 1999-12-24 | 2008-10-01 | 株式会社荏原制作所 | 基片的电镀装置和电镀方法以及电解处理方法及其装置 |
JP2009027192A (ja) * | 2008-10-20 | 2009-02-05 | Toshiba Corp | メッキ方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS621000B2 (ja) | 1987-01-10 |
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