JPS6366421B2 - - Google Patents

Info

Publication number
JPS6366421B2
JPS6366421B2 JP56158411A JP15841181A JPS6366421B2 JP S6366421 B2 JPS6366421 B2 JP S6366421B2 JP 56158411 A JP56158411 A JP 56158411A JP 15841181 A JP15841181 A JP 15841181A JP S6366421 B2 JPS6366421 B2 JP S6366421B2
Authority
JP
Japan
Prior art keywords
cathode
semiconductor element
gate
electrode
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56158411A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5858738A (ja
Inventor
Mikio Hatakeyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56158411A priority Critical patent/JPS5858738A/ja
Publication of JPS5858738A publication Critical patent/JPS5858738A/ja
Publication of JPS6366421B2 publication Critical patent/JPS6366421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56158411A 1981-10-05 1981-10-05 平型サイリスタ Granted JPS5858738A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56158411A JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56158411A JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Publications (2)

Publication Number Publication Date
JPS5858738A JPS5858738A (ja) 1983-04-07
JPS6366421B2 true JPS6366421B2 (enrdf_load_stackoverflow) 1988-12-20

Family

ID=15671162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56158411A Granted JPS5858738A (ja) 1981-10-05 1981-10-05 平型サイリスタ

Country Status (1)

Country Link
JP (1) JPS5858738A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5858738A (ja) 1983-04-07

Similar Documents

Publication Publication Date Title
US5635427A (en) Method for assembling a pressure contact semiconductor device in a flat package
JP4384279B2 (ja) 半導体装置
US3629672A (en) Semiconductor device having an improved heat sink arrangement
JP2002270736A5 (enrdf_load_stackoverflow)
JP6580015B2 (ja) モールド樹脂封止型パワー半導体装置
JPH0214572A (ja) 半導体装置
JPS6366421B2 (enrdf_load_stackoverflow)
JP3265894B2 (ja) 半導体装置
GB1177031A (en) Pressure Assembled Semiconductor Device using Massive Flexibly Mounted Terminals
JPH05211259A (ja) 半導体装置
JPS5855650Y2 (ja) 半導体装置
JPS6020942Y2 (ja) 半導体装置
JPS626692Y2 (enrdf_load_stackoverflow)
JPS5849029B2 (ja) 半導体装置
JPS5952539B2 (ja) 半導体装置のトランスフアモ−ルド装置
JPS642441Y2 (enrdf_load_stackoverflow)
JPS6138193Y2 (enrdf_load_stackoverflow)
JP2604997B2 (ja) 圧接型半導体装置
JP2561470Y2 (ja) 絶縁封止電子部品
JPH04321255A (ja) 半導体外囲器の気密封止方法
JPH0328518Y2 (enrdf_load_stackoverflow)
JPH023627Y2 (enrdf_load_stackoverflow)
JPH065685B2 (ja) 加圧接触形半導体装置
JPS5855649Y2 (ja) 半導体装置
JPS6127901B2 (enrdf_load_stackoverflow)