JPS6218050Y2 - - Google Patents
Info
- Publication number
- JPS6218050Y2 JPS6218050Y2 JP17034181U JP17034181U JPS6218050Y2 JP S6218050 Y2 JPS6218050 Y2 JP S6218050Y2 JP 17034181 U JP17034181 U JP 17034181U JP 17034181 U JP17034181 U JP 17034181U JP S6218050 Y2 JPS6218050 Y2 JP S6218050Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cooling plate
- semiconductor device
- plate
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 57
- 238000001816 cooling Methods 0.000 claims description 32
- 238000000605 extraction Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17034181U JPS6218050Y2 (enrdf_load_stackoverflow) | 1981-11-16 | 1981-11-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17034181U JPS6218050Y2 (enrdf_load_stackoverflow) | 1981-11-16 | 1981-11-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57181040U JPS57181040U (enrdf_load_stackoverflow) | 1982-11-17 |
| JPS6218050Y2 true JPS6218050Y2 (enrdf_load_stackoverflow) | 1987-05-09 |
Family
ID=29962305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17034181U Expired JPS6218050Y2 (enrdf_load_stackoverflow) | 1981-11-16 | 1981-11-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6218050Y2 (enrdf_load_stackoverflow) |
-
1981
- 1981-11-16 JP JP17034181U patent/JPS6218050Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57181040U (enrdf_load_stackoverflow) | 1982-11-17 |
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