JPS5857730A - 半導体パツケ−ジの製造方法 - Google Patents

半導体パツケ−ジの製造方法

Info

Publication number
JPS5857730A
JPS5857730A JP56156494A JP15649481A JPS5857730A JP S5857730 A JPS5857730 A JP S5857730A JP 56156494 A JP56156494 A JP 56156494A JP 15649481 A JP15649481 A JP 15649481A JP S5857730 A JPS5857730 A JP S5857730A
Authority
JP
Japan
Prior art keywords
gold
film
layer
recess
gold paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56156494A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249013B2 (cg-RX-API-DMAC10.html
Inventor
Kozo Matsumura
松村　紘三
Minoru Takaochi
高落　実
Yukio Ogawa
小川　行雄
Eizo Ueda
上田　英三
Jinichi Matsunaga
松永　仁一
Kazutaka Nakayama
和尊 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Nissha Printing Co Ltd
Original Assignee
Noritake Co Ltd
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd, Nissha Printing Co Ltd filed Critical Noritake Co Ltd
Priority to JP56156494A priority Critical patent/JPS5857730A/ja
Publication of JPS5857730A publication Critical patent/JPS5857730A/ja
Publication of JPH0249013B2 publication Critical patent/JPH0249013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W72/0113—
    • H10W72/013—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/352—

Landscapes

  • Die Bonding (AREA)
JP56156494A 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法 Granted JPS5857730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Publications (2)

Publication Number Publication Date
JPS5857730A true JPS5857730A (ja) 1983-04-06
JPH0249013B2 JPH0249013B2 (cg-RX-API-DMAC10.html) 1990-10-26

Family

ID=15628973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56156494A Granted JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Country Status (1)

Country Link
JP (1) JPS5857730A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063939A (ja) * 1983-05-20 1985-04-12 Tomoegawa Paper Co Ltd セラミツク封止基板に半導体固定用被膜を形成する方法
JPS60182200A (ja) * 1984-01-30 1985-09-17 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 導電性ダイ取付テープとその応用
JPS6181641A (ja) * 1984-04-30 1986-04-25 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 装置基板への装置取付用テ−プと方法他
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54138371A (en) * 1978-04-19 1979-10-26 Nec Home Electronics Ltd Solder supplying method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54138371A (en) * 1978-04-19 1979-10-26 Nec Home Electronics Ltd Solder supplying method

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063939A (ja) * 1983-05-20 1985-04-12 Tomoegawa Paper Co Ltd セラミツク封止基板に半導体固定用被膜を形成する方法
JPS60182200A (ja) * 1984-01-30 1985-09-17 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 導電性ダイ取付テープとその応用
JPS6181641A (ja) * 1984-04-30 1986-04-25 ナショナル　スタ−チ　アンド　ケミカル　コ−ポレイション 装置基板への装置取付用テ−プと方法他
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof

Also Published As

Publication number Publication date
JPH0249013B2 (cg-RX-API-DMAC10.html) 1990-10-26

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