JPH0249013B2 - - Google Patents

Info

Publication number
JPH0249013B2
JPH0249013B2 JP56156494A JP15649481A JPH0249013B2 JP H0249013 B2 JPH0249013 B2 JP H0249013B2 JP 56156494 A JP56156494 A JP 56156494A JP 15649481 A JP15649481 A JP 15649481A JP H0249013 B2 JPH0249013 B2 JP H0249013B2
Authority
JP
Japan
Prior art keywords
gold
gold paste
paste layer
adhesive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56156494A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5857730A (ja
Inventor
Kozo Matsumura
Minoru Takaochi
Yukio Ogawa
Eizo Ueda
Jinichi Matsunaga
Kazutaka Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP56156494A priority Critical patent/JPS5857730A/ja
Publication of JPS5857730A publication Critical patent/JPS5857730A/ja
Publication of JPH0249013B2 publication Critical patent/JPH0249013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P72/74—
    • H10W72/0113—
    • H10W72/013—
    • H10W70/682—
    • H10W72/073—
    • H10W72/07337—
    • H10W72/352—

Landscapes

  • Die Bonding (AREA)
JP56156494A 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法 Granted JPS5857730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Publications (2)

Publication Number Publication Date
JPS5857730A JPS5857730A (ja) 1983-04-06
JPH0249013B2 true JPH0249013B2 (cg-RX-API-DMAC10.html) 1990-10-26

Family

ID=15628973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56156494A Granted JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Country Status (1)

Country Link
JP (1) JPS5857730A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063939A (ja) * 1983-05-20 1985-04-12 Tomoegawa Paper Co Ltd セラミツク封止基板に半導体固定用被膜を形成する方法
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4959008A (en) * 1984-04-30 1990-09-25 National Starch And Chemical Investment Holding Corporation Pre-patterned circuit board device-attach adhesive transfer system
KR100450004B1 (ko) 1994-12-26 2004-09-24 히다치 가세고교 가부시끼가이샤 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체 장치의 제조 방법
TW310481B (cg-RX-API-DMAC10.html) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846388B2 (ja) * 1978-04-19 1983-10-15 日本電気ホームエレクトロニクス株式会社 半田供給方法

Also Published As

Publication number Publication date
JPS5857730A (ja) 1983-04-06

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