JPS5853816A - 可変磁器コンデンサ - Google Patents

Info

Publication number

JPS5853816A

JPS5853816A JP56152739A JP15273981A JPS5853816A JP S5853816 A JPS5853816 A JP S5853816A JP 56152739 A JP56152739 A JP 56152739A JP 15273981 A JP15273981 A JP 15273981A JP S5853816 A JPS5853816 A JP S5853816A

Authority

JP

Japan

Prior art keywords

stator

case

rotor

dielectric

electrode

Prior art date

1981-09-26

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

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• 229910052573 porcelain Inorganic materials 0.000 title claims description 4
• 239000002184 metal Substances 0.000 claims description 19
• 229910052751 metal Inorganic materials 0.000 claims description 19
• 229910000679 solder Inorganic materials 0.000 claims description 11
• 239000003990 capacitor Substances 0.000 claims description 9
• 239000003973 paint Substances 0.000 claims description 5
• 239000003985 ceramic capacitor Substances 0.000 description 6
• 229920003002 synthetic resin Polymers 0.000 description 6
• 239000000057 synthetic resin Substances 0.000 description 6
• 210000000078 claw Anatomy 0.000 description 5
• 239000000463 material Substances 0.000 description 4
• 238000000034 method Methods 0.000 description 3
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• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
• 239000000919 ceramic Substances 0.000 description 2
• 239000003989 dielectric material Substances 0.000 description 2
• 238000010438 heat treatment Methods 0.000 description 2
• 239000007769 metal material Substances 0.000 description 2
• 230000003647 oxidation Effects 0.000 description 2
• 238000007254 oxidation reaction Methods 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 238000005476 soldering Methods 0.000 description 2
• 238000004381 surface treatment Methods 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 230000000712 assembly Effects 0.000 description 1
• 238000000429 assembly Methods 0.000 description 1
• 238000005452 bending Methods 0.000 description 1
• 239000003795 chemical substances by application Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000000428 dust Substances 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• 238000007747 plating Methods 0.000 description 1