JPS5851544A - 半導体装置のパツケ−ジ - Google Patents
半導体装置のパツケ−ジInfo
- Publication number
- JPS5851544A JPS5851544A JP56150167A JP15016781A JPS5851544A JP S5851544 A JPS5851544 A JP S5851544A JP 56150167 A JP56150167 A JP 56150167A JP 15016781 A JP15016781 A JP 15016781A JP S5851544 A JPS5851544 A JP S5851544A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- plating
- conductive layers
- package
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W42/60—
-
- H10W72/5449—
-
- H10W90/754—
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56150167A JPS5851544A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置のパツケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56150167A JPS5851544A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置のパツケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5851544A true JPS5851544A (ja) | 1983-03-26 |
| JPS634710B2 JPS634710B2 (enExample) | 1988-01-30 |
Family
ID=15490963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56150167A Granted JPS5851544A (ja) | 1981-09-22 | 1981-09-22 | 半導体装置のパツケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851544A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112921A (ja) * | 1984-06-26 | 1986-01-21 | Toyobo Co Ltd | 合成繊維のハツ水加工法 |
| JPS6177345A (ja) * | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62214648A (ja) * | 1986-03-15 | 1987-09-21 | Ngk Insulators Ltd | 半導体素子用パツケ−ジの製造方法 |
| US5507989A (en) * | 1992-04-01 | 1996-04-16 | Teijin Limited | High speed process for producing polyester filaments |
-
1981
- 1981-09-22 JP JP56150167A patent/JPS5851544A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112921A (ja) * | 1984-06-26 | 1986-01-21 | Toyobo Co Ltd | 合成繊維のハツ水加工法 |
| JPS6177345A (ja) * | 1984-09-21 | 1986-04-19 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS62214648A (ja) * | 1986-03-15 | 1987-09-21 | Ngk Insulators Ltd | 半導体素子用パツケ−ジの製造方法 |
| US5507989A (en) * | 1992-04-01 | 1996-04-16 | Teijin Limited | High speed process for producing polyester filaments |
| US5607634A (en) * | 1992-04-01 | 1997-03-04 | Teijin Limited | High speed process for producing polyester filaments |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS634710B2 (enExample) | 1988-01-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6188127B1 (en) | Semiconductor packing stack module and method of producing the same | |
| US5314606A (en) | Leadless ceramic package with improved solderabilty | |
| JP2000074993A (ja) | 高性能集積回路チップパッケ―ジ | |
| WO1987004316A1 (en) | Ultra high density pad array chip carrier | |
| JPH08500211A (ja) | 集積回路チップの一体化積重ね体用の非導電性端部層 | |
| JPS639376B2 (enExample) | ||
| US6287894B1 (en) | Acoustic device packaged at wafer level | |
| US4587548A (en) | Lead frame with fusible links | |
| JPS5832785B2 (ja) | 電子部品容器 | |
| GB2144907A (en) | Mounting integrated circuit devices | |
| JPS5851544A (ja) | 半導体装置のパツケ−ジ | |
| EP0993042A2 (en) | Manufacturing a semiconductor device using a film substrate | |
| US3434204A (en) | Interconnection structure and method of making same | |
| JPS62266857A (ja) | 半導体装置 | |
| JP3508649B2 (ja) | 電子部品の保持治具、保持方法および電子部品の製造方法 | |
| JPS6016749B2 (ja) | 集積回路用パツケ−ジ | |
| JPS63185035A (ja) | 半導体装置 | |
| JPS62214648A (ja) | 半導体素子用パツケ−ジの製造方法 | |
| CA1199424A (en) | Lead frame with fusible links | |
| JPH07221101A (ja) | 半導体ウエハ上への突起電極形成方法 | |
| JP2667491B2 (ja) | 電気ピンの製造方法 | |
| JP2751911B2 (ja) | 混成集積回路のワイヤボンディング用パッド及び該パッドの形成方法 | |
| JPS61239651A (ja) | 半導体装置 | |
| JPS5828362Y2 (ja) | ハイブリツド集積回路 | |
| JPS5871644A (ja) | 半導体装置 |