JPS5848935A - 自動プラズマ処理装置 - Google Patents

自動プラズマ処理装置

Info

Publication number
JPS5848935A
JPS5848935A JP56147559A JP14755981A JPS5848935A JP S5848935 A JPS5848935 A JP S5848935A JP 56147559 A JP56147559 A JP 56147559A JP 14755981 A JP14755981 A JP 14755981A JP S5848935 A JPS5848935 A JP S5848935A
Authority
JP
Japan
Prior art keywords
chamber
cassette
arm member
opening
plasma processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56147559A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325938B2 (https=
Inventor
Akira Uehara
植原　晃
Isamu Hijikata
土方　勇
Juichi Miyazaki
宮崎　重一
Hiroyuki Kiyota
清田　浩之
Hisashi Nakane
中根　久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP56147559A priority Critical patent/JPS5848935A/ja
Publication of JPS5848935A publication Critical patent/JPS5848935A/ja
Publication of JPH0325938B2 publication Critical patent/JPH0325938B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers

Landscapes

  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP56147559A 1981-09-18 1981-09-18 自動プラズマ処理装置 Granted JPS5848935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56147559A JPS5848935A (ja) 1981-09-18 1981-09-18 自動プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56147559A JPS5848935A (ja) 1981-09-18 1981-09-18 自動プラズマ処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61250343A Division JPS6323331A (ja) 1986-10-21 1986-10-21 蓋体の開閉機構

Publications (2)

Publication Number Publication Date
JPS5848935A true JPS5848935A (ja) 1983-03-23
JPH0325938B2 JPH0325938B2 (https=) 1991-04-09

Family

ID=15433075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56147559A Granted JPS5848935A (ja) 1981-09-18 1981-09-18 自動プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPS5848935A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181527A (ja) * 1988-01-11 1989-07-19 Mitsubishi Electric Corp プラズマ真空容器のシール装置
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513743U (https=) * 1974-06-25 1976-01-12
JPS53126564U (https=) * 1977-03-17 1978-10-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513743U (https=) * 1974-06-25 1976-01-12
JPS53126564U (https=) * 1977-03-17 1978-10-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181527A (ja) * 1988-01-11 1989-07-19 Mitsubishi Electric Corp プラズマ真空容器のシール装置
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system

Also Published As

Publication number Publication date
JPH0325938B2 (https=) 1991-04-09

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