JPS58432U - Molded semiconductor rectifier - Google Patents
Molded semiconductor rectifierInfo
- Publication number
- JPS58432U JPS58432U JP9396081U JP9396081U JPS58432U JP S58432 U JPS58432 U JP S58432U JP 9396081 U JP9396081 U JP 9396081U JP 9396081 U JP9396081 U JP 9396081U JP S58432 U JPS58432 U JP S58432U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor rectifier
- molded semiconductor
- molded
- abstract
- rectifier elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図はモールド型半導体整流装置を示す外観図、第2
図は従来技術によるモールド型半導体整流装置で樹脂を
覆う前を示す斜視図、第3図は本考案−実施例によるモ
ールド型半導体整流装置で樹脂を覆う前を示す斜視図で
ある。
なお図において、1−a、 ILb・・・外部取出用
電極、2・・・熱硬化性樹脂、3・・・半導体整流素子
、3−a・・・リード線部、3−b−・・余分なリード
線部、である。Figure 1 is an external view showing a molded semiconductor rectifier, Figure 2
FIG. 3 is a perspective view showing a mold type semiconductor rectifier according to the prior art before covering the resin, and FIG. 3 is a perspective view showing the mold type semiconductor rectifier according to an embodiment of the present invention before covering the resin. In the figure, 1-a, ILb...electrode for external extraction, 2...thermosetting resin, 3...semiconductor rectifying element, 3-a...lead wire portion, 3-b-... This is the extra lead wire part.
Claims (1)
化性樹脂を用いて覆い放熱板上に形成し゛たモールド型
半導体整流装置において、前記半導体整流素子相互の前
記接続構成上余分なリード線を切り取っていないことを
特徴とするモールド型半導体整流装置。In a molded semiconductor rectifier device in which a connection body formed by connecting a plurality of semiconductor rectifier elements is covered with a thermosetting resin and formed on a heat sink, redundant lead wires are removed due to the connection structure between the semiconductor rectifier elements. A molded semiconductor rectifier characterized by not having any parts cut out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9396081U JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9396081U JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58432U true JPS58432U (en) | 1983-01-05 |
JPS6211006Y2 JPS6211006Y2 (en) | 1987-03-16 |
Family
ID=29888916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9396081U Granted JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58432U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816756U (en) * | 1971-07-06 | 1973-02-24 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816756B1 (en) * | 1972-07-13 | 1973-05-24 |
-
1981
- 1981-06-25 JP JP9396081U patent/JPS58432U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4816756U (en) * | 1971-07-06 | 1973-02-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS6211006Y2 (en) | 1987-03-16 |
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