JPS6211006Y2 - - Google Patents
Info
- Publication number
- JPS6211006Y2 JPS6211006Y2 JP1981093960U JP9396081U JPS6211006Y2 JP S6211006 Y2 JPS6211006 Y2 JP S6211006Y2 JP 1981093960 U JP1981093960 U JP 1981093960U JP 9396081 U JP9396081 U JP 9396081U JP S6211006 Y2 JPS6211006 Y2 JP S6211006Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor rectifier
- lead wire
- molded semiconductor
- semiconductor
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 32
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Rectifiers (AREA)
Description
【考案の詳細な説明】
本考案は熱硬化性樹脂（以下樹脂と言う）にて
成形されたモールド型半導体整流装置にかかり、
とくにその半導体整流素子の構造上切り取るべく
余分なリード線を切り取らず整形して放熱効果を
減少させてないモールド型半導体整流装置に関す
るものである。[Detailed description of the invention] The invention relates to a molded semiconductor rectifier made of thermosetting resin (hereinafter referred to as resin).
In particular, the present invention relates to a molded semiconductor rectifying device in which, due to the structure of the semiconductor rectifying element, excess lead wires are not cut out and shaped to reduce the heat dissipation effect.
従来のモールド型半導体整流装置では複数個の
半導体整流素子を相対するアノード電極、カソー
ド電極間に連結し両電極間内を樹脂にて覆つてい
る。ここにおいて各半導体整流素子は互いのリー
ド線をハンダ付けにより接続し余分のリード線を
切断しアノード側端のリード線をアノード側電極
へ、カソード側端のリード線をカソード側電極へ
接続して、一つの電気回路を構成している。しか
し、従来のこのような接続においては、通電によ
り各半導体整流素子よりの発生熱を放熱するのに
素子間が狭いためリード線部の放熱効果があまり
期待できないことから、素子の使用定格を下げた
り、あるいはハンダ付部に放熱板等を取りつけて
定格を保持させていた。従つて低コストで信頼性
の高い良好なモールド型半導体整流装置を提供す
ることが出来なかつた。 In a conventional molded semiconductor rectifier, a plurality of semiconductor rectifier elements are connected between opposing anode electrodes and cathode electrodes, and the space between the two electrodes is covered with resin. Here, the lead wires of each semiconductor rectifying element are connected to each other by soldering, the excess lead wires are cut off, and the lead wire at the anode side end is connected to the anode side electrode, and the lead wire at the cathode side end is connected to the cathode side electrode. , constitutes one electric circuit. However, in conventional connections like this, the heat generated by each semiconductor rectifying element is dissipated when energized, but the distance between the elements is narrow, so the heat dissipation effect of the lead wire section cannot be expected to be very effective, so the usage rating of the element has been lowered. Or, a heat sink or the like was attached to the soldered part to maintain the rating. Therefore, it has not been possible to provide a good molded semiconductor rectifier that is low cost and highly reliable.
本考案の目的は、従来のかかる欠点を除去した
モールド型半導体整流装置を提供することにあ
る。 SUMMARY OF THE INVENTION An object of the present invention is to provide a molded semiconductor rectifier that eliminates such drawbacks of the conventional method.
本考案の特徴は、半導体整流素子を複数個接続
して形成した接続体を熱硬化性樹脂を用いて覆い
放熱板上に形成したモールド型半導体整流装置に
おいて、前記半導体整流素子のリード線の少くと
も一方がＬ字形に整形されているモールド型半導
体整流装置にある。そして、このＬ字形に整形さ
れたリード線が、モールドの表面近くまで達して
いることが好ましい。すなわち、本考案の特徴は
半導体整流素子のリード線部の放熱効果を最大限
利用していることであり、従つて従来技術の欠点
を除去した良好なモールド型半導体整流装置を提
供することが出来る。 A feature of the present invention is that in a molded semiconductor rectifier device in which a connecting body formed by connecting a plurality of semiconductor rectifying elements is covered with a thermosetting resin and formed on a heat sink, the number of lead wires of the semiconductor rectifying elements is small. One of the two is a molded semiconductor rectifier having an L-shape. Preferably, this L-shaped lead wire reaches close to the surface of the mold. That is, the feature of the present invention is that the heat dissipation effect of the lead wire portion of the semiconductor rectifying element is utilized to the maximum extent, and therefore, it is possible to provide a good molded semiconductor rectifying device that eliminates the drawbacks of the conventional technology. .
次に図面により本考案を説明する。第１図は従
来構造および本考案の実施例によるモールド型半
導体整流装置外観の斜視図であり、外部取出用電
極１−ａ，１−ｂおよび樹脂２より構成されてい
る。第２図は樹脂２で覆う前の従来構造のモール
ド型半導体整流装置の状態を示す斜視図である。
ここにおいて半導体整流素子３の連結は各リード
線部３−ａをハンダ付けにて行つているが許容容
積等により各半導体整流素子３間は近づけられて
おりハンダ付後の余分なリード線部３−ｂを切り
取つている。この状態では半導体整流素子３より
の発生熱の放熱に効果のあるリード線部３−ｂが
ないため不利となつていた。第３図は本考案実施
例による樹脂２で覆う前のモールド型半導体整流
装置の状態を示す斜視図である。半導体整流素子
３のリード線部３−ａは従来構造と同様ハンダ付
けされているが余分なリード線３−ｂは切り取ら
ず整形して残してある。この構造により放熱効果
は改善されることになり良好なモールド型半導体
整流装置を提供することが出来る。 Next, the present invention will be explained with reference to the drawings. FIG. 1 is a perspective view of the external appearance of a molded semiconductor rectifier according to a conventional structure and an embodiment of the present invention, and is composed of external lead-out electrodes 1-a, 1-b and a resin 2. FIG. 2 is a perspective view showing a molded semiconductor rectifier having a conventional structure before being covered with resin 2. As shown in FIG.
Here, the semiconductor rectifying elements 3 are connected by soldering each lead wire part 3-a, but the semiconductor rectifying elements 3 are made close to each other due to the allowable volume, etc., and the redundant lead wire parts 3 are left after soldering. -b is cut out. This state is disadvantageous because there is no lead wire portion 3-b which is effective in dissipating the heat generated by the semiconductor rectifying element 3. FIG. 3 is a perspective view showing the state of the molded semiconductor rectifier before being covered with resin 2 according to the embodiment of the present invention. The lead wire portion 3-a of the semiconductor rectifying element 3 is soldered as in the conventional structure, but the excess lead wire 3-b is not cut but shaped and left. This structure improves the heat dissipation effect, making it possible to provide a good molded semiconductor rectifier.
第１図はモールド型半導体整流装置を示す外観
図、第２図は従来技術によるモールド型半導体整
流装置で樹脂を覆う前を示す斜視図、第３図は本
考案一実施例によるモールド型半導体整流装置で
樹脂を覆う前を示す斜視図である。
なお図において、１−ａ，１−ｂ……外部取出
用電極、２……熱硬化性樹脂、３……半導体整流
素子、３−ａ……リード線部、３−ｂ……余分な
リード線部、である。
Fig. 1 is an external view of a molded semiconductor rectifier, Fig. 2 is a perspective view of a conventional molded semiconductor rectifier before covering with resin, and Fig. 3 is a molded semiconductor rectifier according to an embodiment of the present invention. FIG. 3 is a perspective view showing the resin before being covered with the device. In the figure, 1-a, 1-b...electrode for external extraction, 2...thermosetting resin, 3...semiconductor rectifying element, 3-a...lead wire section, 3-b...excess lead This is the line part.
Claims (1)
体を熱硬化性樹脂を用いて覆い、放熱板上に形成
したモールド型半導体整流装置において、前記半
導体整流素子のリード線の少なくとも一方がＬ字
形に整形され、この整形された部分で隣接する半
導体整流素子のＬ字形に整形されたリード線と接
続されており、接続されたリード線の全体が前記
熱硬化性樹脂に覆われていることを特徴とするモ
ールド型半導体整流装置。 In a molded semiconductor rectifier device in which a connection body formed by connecting a plurality of semiconductor rectifier elements is covered with a thermosetting resin and formed on a heat sink, at least one of the lead wires of the semiconductor rectifier elements is L-shaped. The shaped part is connected to an L-shaped lead wire of an adjacent semiconductor rectifying element, and the entire connected lead wire is covered with the thermosetting resin. A molded semiconductor rectifier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9396081U JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9396081U JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58432U JPS58432U (en) | 1983-01-05 |
| JPS6211006Y2 true JPS6211006Y2 (en) | 1987-03-16 |
Family
ID=29888916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9396081U Granted JPS58432U (en) | 1981-06-25 | 1981-06-25 | Molded semiconductor rectifier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58432U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816756B1 (en) * | 1972-07-13 | 1973-05-24 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816756U (en) * | 1971-07-06 | 1973-02-24 |
-
1981
- 1981-06-25 JP JP9396081U patent/JPS58432U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4816756B1 (en) * | 1972-07-13 | 1973-05-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58432U (en) | 1983-01-05 |
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