JPS59189232U - electronic components - Google Patents
electronic componentsInfo
- Publication number
- JPS59189232U JPS59189232U JP8298183U JP8298183U JPS59189232U JP S59189232 U JPS59189232 U JP S59189232U JP 8298183 U JP8298183 U JP 8298183U JP 8298183 U JP8298183 U JP 8298183U JP S59189232 U JPS59189232 U JP S59189232U
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- electronic components
- insulating layer
- electronic component
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulding By Coating Moulds (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、従来例の固体電解コンデンサの断面図。第２
図は、固体電解コンデンサ素子の断面図。
第３図は、本考案実施例による固体電解コンデンサの断
面図。第４図は、本考案実施例による固体電解コンデン
サの斜視図。
１・・・・・・陽極体、２・・・・・・半導体陰極層、
３・・・・・・陰極導電層、４・・・・・・陰極リード
線、５・・・・・・半田層、６・・・・・・陽極リード
、７・・・・・・陽極リード線、８゜１８・・・・・・
コンデンサ素子、９．１９・・・・・・樹脂、１０・・
・・・・熱収縮性耐熱チューブ。FIG. 1 is a sectional view of a conventional solid electrolytic capacitor. Second
The figure is a cross-sectional view of a solid electrolytic capacitor element. FIG. 3 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 4 is a perspective view of a solid electrolytic capacitor according to an embodiment of the present invention. 1... Anode body, 2... Semiconductor cathode layer,
3... Cathode conductive layer, 4... Cathode lead wire, 5... Solder layer, 6... Anode lead, 7... Anode Lead wire, 8゜18...
Capacitor element, 9.19...Resin, 10...
...Heat-shrinkable heat-resistant tube.
Claims (2)
・ の絶縁層より外側に突出して取出す電子部品におい
て、前記絶縁層が熱収縮性耐熱チューブと熱硬化性樹脂
とで形成されたことを特徴とする電子部品。(1) An electronic component in which a plurality of lead wires led out from a circuit element protrude outward from an insulating layer of an exterior packaging, characterized in that the insulating layer is formed of a heat-shrinkable heat-resistant tube and a thermosetting resin. and electronic components.
ることを特徴とする実用新案登録請求の範囲第１項記載
の電子部品。(2) The electronic component according to claim 1, wherein the thermosetting resin is a powdered thermosetting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298183U JPS59189232U (en) | 1983-06-01 | 1983-06-01 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298183U JPS59189232U (en) | 1983-06-01 | 1983-06-01 | electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59189232U true JPS59189232U (en) | 1984-12-15 |
Family
ID=30212936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8298183U Pending JPS59189232U (en) | 1983-06-01 | 1983-06-01 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189232U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161324U (en) * | 1988-04-28 | 1989-11-09 |
-
1983
- 1983-06-01 JP JP8298183U patent/JPS59189232U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01161324U (en) * | 1988-04-28 | 1989-11-09 |
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