JPS5836058B2 - High-strength conductive copper alloy with excellent heat resistance - Google Patents

Description

[Detailed Description of the Invention] The present invention is suitable for electronic and electrical parts and heat exchange equipment that require properties such as heat resistance, conductivity, heat conductivity, plating properties, soldering properties, and mechanical strength. It concerns copper alloys.

Conventionally, phosphorus-deoxidized copper and soot-filled copper have been used, for example, as lead materials for semiconductor devices and fin materials for heat exchangers, and they have good electrical conductivity, heat conductivity, plating properties, and solderability. However, the current situation is that the heat resistance is insufficient, and there are restrictions on manufacturing and usage.

In view of these points, the present invention improves the drawbacks of conventional copper-based alloys such as phosphorus-deoxidized copper and soot-containing copper, and creates a material with good heat resistance suitable for electronic and electrical parts and fin materials for heat exchangers. The present invention provides a copper alloy for high strength conductivity.

The present invention includes Ti of 0.01 to less than 1.0 weight ratio, P of 0.004 to less than 0.2 weight ratio, SiO. 01 to 0.5 weight category, one or two types total 0.004
It is a copper alloy that has good heat resistance, electrical conductivity, heat conductivity, plating performance, solderability, mechanical strength, etc., including 0.7 to 0.7% by weight, and the remainder consisting of Cu and unavoidable impurities. .

Next, the reason for adding a certain amount of the intervening metal constituting the alloy of the present invention and the reason for limiting its composition range will be explained.

The reason why the Ti content is set to be less than 0.01 to 1.0 by weight is that when the Ti content is less than 0.01 by weight, the expected heat resistance cannot be obtained even if P and Si are co-added. On the other hand, when the Ti content exceeds 1.0 weight factor, the amounts of co-added elements P and Si necessary to obtain high conductivity increase, so the upper limit amounts of P and Si are reversed for the reason described later. The preferable upper limit of the Ti content is less than 1.0 weight φ.

In other words, compared to alloys containing Cu[Ti, alloys containing P and Si either singly or in combination can dramatically improve conductivity; however, there is a limit to the amount of P and Si added. A preferable upper limit of the amount of Ti that can maintain high conductivity is determined according to the above.

Further, in the copper alloy of the present invention, the P content is 0. 0 0
The reason why the weight was increased by 4 to 0.2 is that the P content is 0.004
If the weight is less than that, the conductivity cannot be improved due to P content,
This is because when the P content exceeds 0.2 weight, the processability is significantly reduced.

The reason for setting the Si content to 0.01 to 0.5 by weight is that the Si content is 0.01 to 0.5% by weight. This is because if the Si content is less than 0.5 weight factor, the conductivity cannot be improved by Si content, and if the Si content exceeds 0.5 weight factor, the workability is significantly reduced.

The reason why the total weight of one or two of these P and Si is 0.004 to 0.7 is that 0.004
This is because if the weight is less than 0.7, the conductivity cannot be improved due to the inclusion of these elements, and if the weight exceeds 0.7, the workability is significantly reduced.

Examples Various ingots of the alloys of the present invention shown in Table 1 were melted by high-frequency atmospheric melting, and then hot-rolled at 800°C to form plates with a thickness of 4 mm.

Next, this plate was subjected to ordinary pickling treatment and then cold rolled to a thickness of 1.
．． It was set as 0.

After further annealing at 500℃ for 1 hour, cold rolling was performed to a thickness of g.
It was made into a 0.6 mm plate.

The samples prepared in this manner were evaluated by strength and tensile tests, heat resistance by softening start temperature after heating for 30 minutes, and electrical conductivity and heat transfer by electrical conductivity (% IACS).

Since thermal conductivity is proportional to electrical conductivity, the thermal conductivity was evaluated in detail by measuring electrical conductivity.

The solderability was determined by immersing the product in a 230° C. solder bath (60% tin, 40% lead) for 5 seconds using a vertical immersion method, and visually observing the wetting state of the solder.

These results are shown in Table 1 along with comparative alloys.

As shown in Table 1, it is clear that the alloy according to the present invention has sufficient electrical conductivity, excellent heat resistance, strength, and solderability, and is used in electronic and electrical components that require high reliability. It also has features that make it suitable for heat exchange equipment and the like.

Claims (1)

[Claims] ITiO. 01 to l, including less than 0 weight φ, and further P
0.004 to 0.2 weight, SiO. 01 to 0,5
Total weight of one or two of the following: 0.004 to 0
．． A copper alloy for high-strength conductivity with excellent heat resistance, containing 7% by weight and the remainder consisting of Cu and unavoidable impurities.